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    • 2. 发明申请
    • SEMICONDUCTOR CIRCUITS CAPABLE OF SELF DETECTING DEFECTS
    • 能够自行检测缺陷的半导体电路
    • US20090129185A1
    • 2009-05-21
    • US11941996
    • 2007-11-19
    • John J. CasselsJonathan Robert FalesMuthukumarasamy KarthikeyanThomas Martin Maffitt
    • John J. CasselsJonathan Robert FalesMuthukumarasamy KarthikeyanThomas Martin Maffitt
    • G11C29/04
    • G11C29/38
    • A digital circuit and a method for operating the same. The digital circuit includes (a) M×N regular cells electrically arranged in M rows and N columns, (b) N reference cells corresponding one-to-one to the N columns, and (c) N comparing circuits corresponding one-to-one to the N columns. Each regular cell is electrically coupled to a comparing circuit. Each reference cell is electrically coupled to the associated comparing circuit. Each regular cell includes a first tap node. Each reference cell includes P tap nodes. If a first voltage of the first tap node of a regular cell is between two voltages of two tap nodes of the P tap nodes of the associated reference cell, then the associated comparing circuit is capable of generating a first signal. If the first voltage is not between the two voltages, then the associated comparing circuit is capable of generating a second signal.
    • 数字电路及其操作方法。 数字电路包括(a)以M行和​​N列电排列的M×N个常规单元,(b)与N列一一对应的N个参考单元,以及(c)N个比较电路对应于一对一 N列。 每个常规单元电耦合到比较电路。 每个参考单元电耦合到相关的比较电路。 每个常规单元包括第一抽头节点。 每个参考单元包括P抽头节点。 如果规则单元的第一抽头节点的第一电压在相关参考单元的P抽头节点的两个抽头节点的两个电压之间,则相关联的比较电路能够产生第一信号。 如果第一电压不在两个电压之间,则相关联的比较电路能够产生第二信号。
    • 4. 发明授权
    • Test data reporting and analyzing using data array and related data analysis
    • 使用数据阵列和相关数据分析测试数据报告和分析
    • US07543198B2
    • 2009-06-02
    • US11163527
    • 2005-10-21
    • William J. FerranteJohn J. CasselsStephen Wu
    • William J. FerranteJohn J. CasselsStephen Wu
    • G06F11/00G11C29/00G01R31/28G01R31/02G01R31/26
    • G11C29/56G01R31/31935G11C29/56008G11C2029/5604
    • Reporting and/or analyzing test data from a plurality of tests of an array structure using a data array. One method includes obtaining the test data, and reporting the test data in a data array, which includes at least two portions representing different tests. Data stored in the data array is organized according to a translation table, which describes the locations of data for tests and criteria for data to be analyzed within the data array. Numerous other data arrangements such as a coordinate file listing a pre-defined maximum number of fail points, or a chip report including fail points by chip may also be generated. The data array reports all test data in a more easily generated and stored form, and may be converted to an image. A data analysis method for analyzing data using the data array is also presented.
    • 使用数据阵列从阵列结构的多个测试报告和/或分析测试数据。 一种方法包括获得测试数据,并将测试数据报告在数据阵列中,该数据阵列包括表示不同测试的至少两个部分。 存储在数据阵列中的数据根据​​翻译表进行组织,该转换表描述了要在数据阵列中分析的数据的测试数据和标准的位置。 也可以生成诸如列出预定义的最大失败点数的坐标文件或包括芯片故障点的芯片报告的许多其他数据布置。 数据阵列以更容易生成和存储的形式报告所有测试数据,并可将其转换为图像。 还提出了一种用于使用数据阵列分析数据的数据分析方法。
    • 5. 发明申请
    • VERTICAL PROBE TIP ROTATIONAL SCRUB AND METHOD
    • 垂直探头旋转滚筒和方法
    • US20120139574A1
    • 2012-06-07
    • US12960604
    • 2010-12-06
    • John J. CasselsGarry L. MooreRonald A. Feroli
    • John J. CasselsGarry L. MooreRonald A. Feroli
    • G01R31/20
    • G01R1/06733G01R1/07314G01R1/07392
    • A vertical probe tip rotational scrub and method is described. The vertical probe includes a wafer prober chuck; a wafer positioned on the wafer prober chuck; and at least one probe having a probe tip, the at least one probe tip rotatably mounted such that the probe tip provides a rotational scrub on a surface of a wafer surface. A method for wafer probing is also described, the method includes: determining a vertical location of a wafer surface relative to at least one probe having a probe tip; retracting the probe tip; and imparting an upward motion on the at least one probe in response to the retracting of the probe tip, wherein the upward motion results in a rotational scrub of the wafer surface.
    • 描述了垂直探针头旋转磨擦和方法。 垂直探头包括晶圆探针卡盘; 位于晶片探针卡盘上的晶片; 以及至少一个探针,其具有探针尖端,所述至少一个探针尖端可旋转地安装成使得探针尖端在晶片表面的表面上提供旋转磨擦。 还描述了用于晶片探测的方法,该方法包括:确定晶片表面相对于具有探针尖端的至少一个探针的垂直位置; 缩回探针尖; 并且响应于所述探针尖端的缩回而在所述至少一个探针上施加向上运动,其中所述向上运动导致所述晶片表面的旋转擦除。