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    • 1. 发明授权
    • Reflow soldering apparatus
    • 回流焊接装置
    • US5405074A
    • 1995-04-11
    • US94311
    • 1993-07-20
    • Rolf A. Den DopperJohannes J. H. Luijten
    • Rolf A. Den DopperJohannes J. H. Luijten
    • B23K1/008B23K1/012
    • B23K1/008B23K1/012B23K2201/42
    • The invention relates to a soldering apparatus comprising: a soldering chamber; transporting means for transporting the objects to be soldered through the soldering chamber; and heating means for heating the objects to be soldered in the soldering chamber, wherein the heating means are formed by means for feeding heated gas to the chamber. A simple device is thus obtained which heats uniformly. Such an apparatus can be embodied in both closed and open form. According to one of the preferred embodiments the means for feeding heated gas are formed by at least one heating unit, wherein the heating units are each formed by a fan and at least one heating device, for instance an electrical heating filament, connected forwardly thereof. Cooling units can also be used.
    • 本发明涉及一种焊接装置,包括:焊接室; 运送装置,用于运送通过焊接室焊接的物体; 以及加热装置,用于加热要在焊接室中焊接的物体,其中加热装置由用于将加热的气体供给到室的装置形成。 由此获得均匀加热的简单装置。 这样的装置可以以闭合和开放形式实现。 根据优选实施例之一,用于供给加热气体的装置由至少一个加热单元形成,其中加热单元各自由风扇形成,并且至少一个加热装置,例如电加热丝,其前面连接。 也可以使用冷却单元。