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1. 发明授权

US08785789B2 Printed circuit board and method for manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08785789B2
公开(公告)日：2014-07-22
申请号：US13402638
申请日：2012-02-22
申请人： Hueng Jae Oh , Boo Yang Jung , Dae Young Lee , Jin Won Choi
发明人： Hueng Jae Oh , Boo Yang Jung , Dae Young Lee , Jin Won Choi
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/11462 , H01L2224/11474 , H01L2224/1184 , H01L2224/119 , H01L2224/11912 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81192 , H01L2224/8138 , H01L2224/81801 , H01L2224/831 , H05K1/111 , H05K3/4007 , H05K2201/0367 , H05K2201/09845 , H05K2203/054 , H05K2203/0588 , Y02P70/611 , Y10T29/49165 , H01L2924/00014 , H01L2924/014 , H01L2924/00012
摘要： Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.
摘要翻译：这里公开了印刷电路板（PCB）及其制造方法。 PCB包括基底基板，形成在基底基板上的电路层，包括连接焊盘，形成在基底基板的上部上并具有露出连接焊盘的开口的阻焊层，形成在上部的金属柱的连接焊盘和阻焊层，并且具有多个直径，以及沿着金属柱的界面形成在阻焊层的上部和开口的内壁上的种子层。

2. 发明申请

US20120043653A1 LEAD PIN FOR PACKAGE SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE WITH THE SAME 有权
标题翻译：用于包装衬底的引线，以及用于制造包装衬底的方法
公开(公告)号：US20120043653A1
公开(公告)日：2012-02-23
申请号：US12926626
申请日：2010-11-30
申请人： Heung Jae Oh , Jin Won Choi , Ki Taek Lee
发明人： Heung Jae Oh , Jin Won Choi , Ki Taek Lee
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H05K3/4015 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2201/10704
摘要： Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate.
摘要翻译：这里公开了一种用于封装衬底的引脚。根据本发明的示例性实施例的封装基板的引脚包括具有与封装基板相对的一个表面和与该表面相对的另一个表面的头部; 以及具有与所述头部的另一个表面接合的销形状的连接销，其中，所述头部具有朝向所述封装基板的凹陷部。

3. 发明申请

US20120000067A1 Method of manufacturing printed circuit board having flow preventing dam 失效
标题翻译：具有防流堤的印刷电路板的制造方法
公开(公告)号：US20120000067A1
公开(公告)日：2012-01-05
申请号：US13137778
申请日：2011-09-12
申请人： Jin Won Choi , Seung Wan Kim
发明人： Jin Won Choi , Seung Wan Kim
IPC分类号： H05K3/10
CPC分类号： H05K3/305 , H01L21/563 , H01L23/49816 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81192 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H05K3/3452 , H05K3/3484 , H05K2201/10674 , H05K2201/10977 , H05K2203/043 , H05K2203/0505 , H05K2203/0568 , H05K2203/0588 , Y02P70/613 , Y10T29/49142 , Y10T29/49144 , Y10T29/49155 , H01L2924/00 , H01L2224/0401
摘要： A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist
摘要翻译：一种制造具有流动防止堤坝的印刷电路板的方法，包括：在具有焊盘的基底上涂覆干膜抗蚀剂，然后将干膜抗蚀剂主要暴露于光; 二次将形成在基底基板的周边区域上的主要暴露的干膜抗蚀剂曝光，从而形成防流水坝; 去除未曝光的干膜抗蚀剂以露出焊盘，从而形成开口; 用焊膏印刷开口，然后通过回流工艺形成焊料凸块; 并除去主要暴露的干膜抗蚀剂

4. 发明申请

US20110186991A1 Package substrate and method of fabricating the same 有权
标题翻译：封装基板及其制造方法
公开(公告)号：US20110186991A1
公开(公告)日：2011-08-04
申请号：US12926314
申请日：2010-11-09
申请人： Dong Gyu Lee , Dae Young Lee , Tae Joon Chung , Seon Jae Mun , Jin Won Choi
发明人： Dong Gyu Lee , Dae Young Lee , Tae Joon Chung , Seon Jae Mun , Jin Won Choi
IPC分类号： H01L23/485 , H01L21/441
CPC分类号： H01L21/4853 , H01L21/441 , H01L23/485 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0346 , H01L2224/0347 , H01L2224/05572 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082
摘要： There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.
摘要翻译：提供一种能够通过改善后端子的组成和形成来控制其翘曲程度的封装基板及其制造方法。封装衬底包括具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 隔离层，设置在所述开口内的所述导电垫上，并形成为比所述绝缘层的所述侧壁的上表面高; 设置在分离阻挡层上的柱状端子; 以及设置在柱端子上的焊料凸块。

5. 发明授权

US07952826B2 Method operating hard disk drive on the basis of predicted defect using hierarchical clustering and curve fit 失效
标题翻译：在使用层次聚类和曲线拟合的预测缺陷的基础上操作硬盘驱动器的方法
公开(公告)号：US07952826B2
公开(公告)日：2011-05-31
申请号：US12143938
申请日：2008-06-23
申请人： Hristov Stoev Youlian , Jin-won Choi , Nam-guk Kim
发明人： Hristov Stoev Youlian , Jin-won Choi , Nam-guk Kim
IPC分类号： G11B5/09 , G11B27/36
CPC分类号： G11B19/048 , G06K9/6218 , G11B19/041 , G11B20/18 , G11B2020/1823 , G11B2020/1893 , G11B2020/1896 , G11B2220/2516
摘要： A method of operating a hard disk drive (HDD) on the basis of a predicted new defect in a disk associated with the HDD is disclosed. The method includes detecting defects in a magnetic surface of the disk, defining a plurality of clusters by grouping the detected defects using a hierarchical clustering algorithm, calculating a curve fit for each one of the plurality of clusters, predicting a new defect likely to occur in the magnetic surface of the disk on the basis of the calculated curve fit; and writing data to the disk on the basis of the new defect prediction.
摘要翻译：公开了基于与HDD相关联的盘中预测的新缺陷来操作硬盘驱动器（HDD）的方法。该方法包括检测盘的磁表面中的缺陷，通过使用分级聚类算法对检测到的缺陷进行分组来定义多个聚类，计算多个聚类中的每一个的曲线拟合，预测可能发生的新缺陷基于计算曲线拟合的磁盘表面; 并基于新的缺陷预测将数据写入盘。

6. 发明授权

US07875340B2 Heat radiation substrate having metal core and method of manufacturing the same 有权
标题翻译：具有金属芯的散热基板及其制造方法
公开(公告)号：US07875340B2
公开(公告)日：2011-01-25
申请号：US12003490
申请日：2007-12-26
申请人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
发明人： Seung Hyun Cho , Byoung Youl Min , Soon Jin Cho , Jin Won Choi
IPC分类号： H05K1/00
CPC分类号： H05K1/056 , B82Y10/00 , H01L21/486 , H01L21/4871 , H01L23/3677 , H01L23/373 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K7/20481 , H05K2201/026 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T428/24917
摘要： Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
摘要翻译：本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。

7. 发明申请

US20100000761A1 Lead pin for package boards 失效
标题翻译：封装板引脚
公开(公告)号：US20100000761A1
公开(公告)日：2010-01-07
申请号：US12232316
申请日：2008-09-15
申请人： Hueng Jae Oh , Jin Won Choi
发明人： Hueng Jae Oh , Jin Won Choi
IPC分类号： H01B5/00
CPC分类号： H05K3/3426 , H01L23/49811 , H01L2924/0002 , H05K2201/10318 , H05K2201/10772 , Y02P70/613 , H01L2924/00
摘要： Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.
摘要翻译：提供一种用于封装板的引脚，包括直径朝向其中间部分增加的圆盘形头部，并且具有六边形垂直横截面形状; 以及形成为从头部的上表面的中心突出的连接销。

8. 发明申请

US20090153997A1 METHOD OPERATING HARD DISK DRIVE ON THE BASIS OF PREDICTED DEFECT USING HIERARCHICAL CLUSTERING AND CURVE FIT 失效
标题翻译：使用分层聚类和曲线拟合方法在预测缺陷的基础上运行硬盘驱动器
公开(公告)号：US20090153997A1
公开(公告)日：2009-06-18
申请号：US12143938
申请日：2008-06-23
申请人： Hristov Stoev YOULIAN , Jin-won CHOI , Nam-guk KIM
发明人： Hristov Stoev YOULIAN , Jin-won CHOI , Nam-guk KIM
IPC分类号： G11B27/36
CPC分类号： G11B19/048 , G06K9/6218 , G11B19/041 , G11B20/18 , G11B2020/1823 , G11B2020/1893 , G11B2020/1896 , G11B2220/2516
摘要： A method of operating a hard disk drive (HDD) on the basis of a predicted new defect in a disk associated with the HDD is disclosed. The method includes detecting defects in a magnetic surface of the disk, defining a plurality of clusters by grouping the detected defects using a hierarchical clustering algorithm, calculating a curve fit for each one of the plurality of clusters, predicting a new defect likely to occur in the magnetic surface of the disk on the basis of the calculated curve fit; and writing data to the disk on the basis of the new defect prediction.
摘要翻译：公开了基于与HDD相关联的盘中预测的新缺陷来操作硬盘驱动器（HDD）的方法。该方法包括检测盘的磁表面中的缺陷，通过使用分级聚类算法对检测到的缺陷进行分组来定义多个聚类，计算多个聚类中的每一个的曲线拟合，预测可能发生的新缺陷基于计算曲线拟合的磁盘表面; 并基于新的缺陷预测将数据写入盘。

9. 发明申请

US20090025581A1 Mask for screen printing and screen printing method using the same 审中-公开
标题翻译：屏幕用于丝网印刷和丝网印刷方法使用
公开(公告)号：US20090025581A1
公开(公告)日：2009-01-29
申请号：US12003491
申请日：2007-12-26
申请人： Soon Jin Cho , Seon Jae Mun , Jin Won Choi
发明人： Soon Jin Cho , Seon Jae Mun , Jin Won Choi
IPC分类号： B05C17/06 , B41M1/12
CPC分类号： H05K3/1225 , B41P2215/12
摘要： This invention relates to a mask for screen printing, which includes a mask body composed of a plurality of pattern areas having holes for screen printing and a peripheral area surrounding the outside of the pattern areas; and a protrusion portion formed in the peripheral area of a back surface of the mask body, and to a screen printing method using the same.
摘要翻译：本发明涉及一种丝网印刷用掩模，其包括由具有丝网印刷用孔的多个图案区域和围绕图案区域外部的周边区域构成的掩模体; 以及形成在面罩主体的后表面的周边区域中的突出部分，以及使用该突起部分的丝网印刷方法。

10. 发明申请

US20150042569A1 Keyboard for Inputting Multiple Languages Using Detachable Keypad 审中-公开
标题翻译：使用可拆卸键盘输入多种语言的键盘
公开(公告)号：US20150042569A1
公开(公告)日：2015-02-12
申请号：US14385567
申请日：2012-11-05
申请人： Jin Won Choi
发明人： Jin Won Choi
IPC分类号： G06F3/02 , H01H3/12
CPC分类号： G06F3/0219 , G06F3/0202 , H01H3/12
摘要： The present invention relates to a keyboard for inputting multiple languages using a detachable keypad. More particularly, the present invention includes: a base board; rows of a plurality of key caps that are disposed on the base board; and a plurality of moving mechanism members that connect the key caps to the base board and enable the key caps to vertically move relative to the base board. Each key cap is divided into an opaque portion and a transparent portion, and characters are disposed on the upper surface thereof. The insertion-type keyboard for inputting multiple languages according to the present invention comprises an insertion member that is provided such that a character can be seen by a user through the transparent portion, and a space part in which the insertion member is accommodated between the base board and the transparent portion in the direction in which the rows of key caps are arranged.
摘要翻译：本发明涉及一种使用可拆卸键盘输入多种语言的键盘。更具体地说，本发明包括：基板; 设置在基板上的多个键帽的行; 以及将键帽连接到基板并使键帽相对于基板垂直移动的多个移动机构构件。每个键帽被分成不透明部分和透明部分，并且字符被设置在其上表面上。根据本发明的用于输入多种语言的插入式键盘包括：插入构件，其被设置成使得用户可以通过透明部分看到角色;以及空间部分，其中插入构件容纳在基座之间板和键排的排的方向上的透明部分。

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