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1. 发明申请

US20050260118A1 Mesoporous carbon films and methods of preparation thereof 审中-公开
标题翻译：介孔碳膜及其制备方法
公开(公告)号：US20050260118A1
公开(公告)日：2005-11-24
申请号：US10849952
申请日：2004-05-20
申请人： Yunfeng Lu , Jiebin Pang
发明人： Yunfeng Lu , Jiebin Pang
IPC分类号： B01D53/22 , B01D67/00 , B01D69/02 , B01D71/02 , C01B3/00 , C01B31/00 , C01B31/08
CPC分类号： B01D71/021 , B01D53/228 , B01D67/0048 , B01D67/0053 , B01D67/0067 , B01D69/02 , B01D2253/102 , B01D2323/40 , B01D2323/46 , B01D2325/02 , B01D2325/04 , B01D2325/10 , B01J21/18 , B82Y30/00 , C01B3/0021 , C01B32/30 , Y02E60/325
摘要： A mesoporous carbon film having a unimodal pore structure comprises a film of carbon defining an open network of interconnected primary pores arrayed in a uniform, random manner throughout the film. The pores in the film have an average pore diameter in the range of about 2 to about 3 nm, and the diameters of the pores have a substantially unimodal pore diameter distribution. Not more than about 20% of the pores in the film have a diameter of less than about 1 nm. The mesoporous carbon films can be prepared by depositing a thin film of an aqueous sol-gel composition comprising a polysiloxane gel precursor, and a water soluble carbohydrate onto a substrate, heating the thin film to carbonize the carbohydrate and form a carbon/silica nanocomposite film, and removing the silica from the carbon/silica nanocomposite film to provide a continuous mesoporous carbon film. Suspending colloidal silica in the aqueous sol-gel composition prior to depositing the thin film on the substrate affords a mesoporous carbon film having a hierarchical, bimodal pore structure, which includes spherical secondary pores randomly distributed throughout the film and interconnecting with the network of primary pores.
摘要翻译：具有单峰孔结构的介孔碳膜包括限定在整个膜中以均匀，随机的方式排列的互连的初级孔的开放网络的碳膜。膜中的孔的平均孔径在约2nm至约3nm的范围内，并且孔的直径具有基本上单峰的孔径分布。膜中不超过约20％的孔具有小于约1nm的直径。中孔碳膜可以通过将包含聚硅氧烷凝胶前体和水溶性碳水化合物的水性溶胶 - 凝胶组合物的薄膜沉积在基材上，加热薄膜以碳化碳水化合物并形成碳/二氧化硅纳米复合膜，并从碳/二氧化硅纳米复合膜除去二氧化硅以提供连续的介孔碳膜。在将薄膜沉积在基底上之前，将胶体二氧化硅悬浮在水性溶胶 - 凝胶组合物中提供了具有分层双峰孔结构的介孔碳膜，其包括随机分布在整个薄膜中并与初级孔网络互连的球形二次孔。

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