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    • 6. 发明申请
    • SUBSTRATE HAVING A PLURAL DIAMETER VIA
    • 具有一个直径的基底
    • US20130020121A1
    • 2013-01-24
    • US13189278
    • 2011-07-22
    • ALEX MICHAEL SHARFJIE QIN
    • ALEX MICHAEL SHARFJIE QIN
    • H05K1/11
    • H05K1/0251H05K1/115H05K3/306H05K2201/09845H05K2201/09854H05K2201/10189
    • A substrate is provided that includes a plurality of substrate layers and a plural diameter via having a first via portion and a second via portion. The first via portion is formed in a first substrate layer, has a first diameter, and extends along a first axis. The second via portion is formed in a second substrate layer, has a second diameter that is different than the first diameter of the first via portion, and extends along a second axis that is offset from the first axis of the first via portion. Optionally, the first via portion and the second via portion may have a common edge that is spaced the same distance from an edge of another via extending through the substrate.
    • 提供一种衬底,其包括多个衬底层和具有第一通孔部分和第二通孔部分的多个直径通孔。 第一通孔部分形成在第一基底层中,具有第一直径并且沿着第一轴线延伸。 第二通孔部分形成在第二基底层中,具有不同于第一通孔部分的第一直径的第二直径,并且沿着与第一通孔部分的第一轴线偏移的第二轴线延伸。 可选地,第一通孔部分和第二通孔部分可以具有与延伸穿过基底的另一通路的边缘间隔相同距离的公共边缘。
    • 7. 发明授权
    • Electrical connector having a ground clip
    • 具有接地夹的电连接器
    • US08221139B2
    • 2012-07-17
    • US12880411
    • 2010-09-13
    • Jie QinSteven J. MillardDavid W. Helster
    • Jie QinSteven J. MillardDavid W. Helster
    • H01R4/66
    • H01R13/6471H01R12/724H01R12/732H01R31/08
    • An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.
    • 电连接器包括具有与壳体相对的前后相反的后壳的壳体。 壳体具有通过前部开口的槽,其中容纳配合连接器。 壳体通过后壁具有接触开口,后壁上的接地夹通道在后部开口。 信号触点保持在壳体中并成对布置。 信号触点被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地触点保持在壳体中并且布置在相应的信号触点之间。 接地触头被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地夹被加载到接地夹通道中。 接地夹与接地触头接合,以在由接地夹接合的接地触点之间产生接地电路。
    • 8. 发明申请
    • ELECTRICAL CONNECTOR HAVING A GROUND CLIP
    • 具有接地夹的电气连接器
    • US20120064743A1
    • 2012-03-15
    • US12880411
    • 2010-09-13
    • Jie QINSteven J. MILLARDDavid W. HELSTER
    • Jie QINSteven J. MILLARDDavid W. HELSTER
    • H01R12/02
    • H01R13/6471H01R12/724H01R12/732H01R31/08
    • An electrical connector includes a housing having a front and a rear opposite the housing with a rear wall at the rear. The housing has a slot open through the front that receives a mating connector therein. The housing has contact openings through the rear wall and a ground clip channel in the rear wall open at the rear. Signal contacts are held in the housing and arranged in pairs. The signal contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and are arranged between corresponding signal contacts. The ground contacts are received in corresponding contact openings and are arranged within the slot to mate with the mating connector. A ground clip is loaded into the ground clip channel. The ground clip engages the ground contacts to create a ground circuit between the ground contacts engaged by the ground clip.
    • 电连接器包括具有与壳体相对的前后相反的后壳的壳体。 壳体具有通过前部开口的槽,其中容纳配合连接器。 壳体通过后壁具有接触开口,后壁上的接地夹通道在后部开口。 信号触点保持在壳体中并成对布置。 信号触点被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地触点保持在壳体中并且布置在相应的信号触点之间。 接地触头被接收在相应的接触开口中并且布置在槽内以与配合连接器配合。 接地夹被加载到接地夹通道中。 接地夹与接地触头接合,以在由接地夹接合的接地触点之间产生接地电路。
    • 10. 发明授权
    • Substrate having a plural diameter via
    • 具有多个直径通孔的基板
    • US08592692B2
    • 2013-11-26
    • US13189278
    • 2011-07-22
    • Alex Michael SharfJie Qin
    • Alex Michael SharfJie Qin
    • H05K1/11
    • H05K1/0251H05K1/115H05K3/306H05K2201/09845H05K2201/09854H05K2201/10189
    • A substrate is provided that includes a plurality of substrate layers and a plural diameter via having a first via portion and a second via portion. The first via portion is formed in a first substrate layer, has a first diameter, and extends along a first axis. The second via portion is formed in a second substrate layer, has a second diameter that is different than the first diameter of the first via portion, and extends along a second axis that is offset from the first axis of the first via portion. Optionally, the first via portion and the second via portion may have a common edge that is spaced the same distance from an edge of another via extending through the substrate.
    • 提供一种衬底,其包括多个衬底层和具有第一通孔部分和第二通孔部分的多个直径通孔。 第一通孔部分形成在第一基底层中,具有第一直径并且沿着第一轴线延伸。 第二通孔部分形成在第二基底层中,具有不同于第一通孔部分的第一直径的第二直径,并且沿着与第一通孔部分的第一轴线偏移的第二轴线延伸。 可选地,第一通孔部分和第二通孔部分可以具有与延伸穿过基底的另一通路的边缘间隔相同距离的公共边缘。