会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Method for forming phase grating
    • 形成相位光栅的方法
    • US08092699B2
    • 2012-01-10
    • US12255642
    • 2008-10-21
    • Jian-Bin Shiu
    • Jian-Bin Shiu
    • B29D11/00
    • G02B5/1871B29D11/00269G02B5/1857G02B2005/1804
    • A method for forming a phase grating is disclosed. First, a substrate is provided. Second, a first dielectric layer with a tapered recess or bulge is formed on the substrate. Later, a second dielectric layer is formed to fill the tapered recess and to cover the first dielectric layer. Afterwards, the second dielectric layer is selectively etched to form the phase grating. The phase grating includes a column and multiple rings. The column and multiple rings are concentric and the multiple rings are disposed on the tapered side so that the height of each ring is different.
    • 公开了一种形成相位光栅的方法。 首先,提供基板。 其次,在基板上形成具有锥形凹部或凸起的第一电介质层。 之后,形成第二电介质层以填充锥形凹部并覆盖第一电介质层。 之后,选择性地蚀刻第二介质层以形成相位光栅。 相位光栅包括一列和多个环。 柱和多个环是同心的,并且多个环设置在锥形侧上,使得每个环的高度不同。
    • 5. 发明申请
    • TEST STRUCTURE FOR SEMICONDUCTOR PROCESS AND METHOD FOR MONITORING SEMICONDUCTOR PROCESS
    • 用于半导体工艺的测试结构和用于监测半导体工艺的方法
    • US20130270557A1
    • 2013-10-17
    • US13445934
    • 2012-04-13
    • Jian-Bin ShiuTung-Sheng Lee
    • Jian-Bin ShiuTung-Sheng Lee
    • H01L23/58H01L21/66
    • H01L22/34
    • A monitoring method of a semiconductor process includes the following steps. A semiconductor substrate is provided, and a test structure is formed thereon. The method of forming the test structure includes the following steps. A first doped region and a second doped region are formed in the semiconductor substrate, and an insulating layer is formed on the semiconductor substrate. Subsequently, a conductive layer is directly formed on the insulating layer to complete the formation of the test structure, in which the conductive layer in a floating state partially overlaps the first doped region and partially overlaps the second doped region. Then, a voltage signal is applied to the test structure and the breakdown voltage (Vbd) between the first doped region and the second doped region is measured.
    • 半导体处理的监视方法包括以下步骤。 提供半导体基板,并在其上形成测试结构。 形成测试结构的方法包括以下步骤。 在半导体衬底中形成第一掺杂区和第二掺杂区,并在半导体衬底上形成绝缘层。 随后,在绝缘层上直接形成导电层,以完成测试结构的形成,其中浮置状态的导电层部分地与第一掺杂区域重叠并部分地与第二掺杂区域重叠。 然后,将电压信号施加到测试结构,并且测量第一掺杂区域和第二掺杂区域之间的击穿电压(Vbd)。
    • 6. 发明申请
    • PASSIVATION STRUCTURE AND FABRICATING METHOD THEREOF
    • 被动结构及其制作方法
    • US20100155908A1
    • 2010-06-24
    • US12340766
    • 2008-12-22
    • Jian-Bin Shiu
    • Jian-Bin Shiu
    • H01L21/66H01L21/82H01L29/06
    • H01L22/34H01L2924/0002H01L2924/00
    • A passivation structure and fabricating method thereof includes providing a chip having a main die region and a scribe line region defined thereon and a plurality of metal pads respectively positioned in the main die region and the scribe line region, forming a first patterned passivation layer having a plurality of first openings and second openings respectively exposing the metal pads in the main die region and the scribe line region on the chip, and forming a second patterned passivation layer filling the first openings in the scribe line region and having a plurality of third openings corresponding to the first openings thus exposing the metal pads in the main die region.
    • 钝化结构及其制造方法包括:提供具有主晶片区域和限定在其上的划线区域的芯片和分别位于主管芯区域和划线区域中的多个金属焊盘,形成第一图案化钝化层,其具有 多个第一开口和第二开口分别暴露芯片上的主裸片区域中的金属焊盘和芯片上的划线区域,并形成填充划线区域中的第一开口的第二图案化钝化层,并且具有对应的多个第三开口 到第一开口,从而使主模区域中的金属焊盘露出。
    • 8. 发明授权
    • Test structure for semiconductor process and method for monitoring semiconductor process
    • 半导体工艺测试结构及半导体工艺监测方法
    • US09070652B2
    • 2015-06-30
    • US13445934
    • 2012-04-13
    • Jian-Bin ShiuTung-Sheng Lee
    • Jian-Bin ShiuTung-Sheng Lee
    • H01L21/66
    • H01L22/34
    • A monitoring method of a semiconductor process includes the following steps. A semiconductor substrate is provided, and a test structure is formed thereon. The method of forming the test structure includes the following steps. A first doped region and a second doped region are formed in the semiconductor substrate, and an insulating layer is formed on the semiconductor substrate. Subsequently, a conductive layer is directly formed on the insulating layer to complete the formation of the test structure, in which the conductive layer in a floating state partially overlaps the first doped region and partially overlaps the second doped region. Then, a voltage signal is applied to the test structure and the breakdown voltage (Vbd) between the first doped region and the second doped region is measured.
    • 半导体处理的监视方法包括以下步骤。 提供半导体基板,并在其上形成测试结构。 形成测试结构的方法包括以下步骤。 在半导体衬底中形成第一掺杂区和第二掺杂区,并在半导体衬底上形成绝缘层。 随后,在绝缘层上直接形成导电层,以完成测试结构的形成,其中浮置状态的导电层部分地与第一掺杂区域重叠并部分地与第二掺杂区域重叠。 然后,将电压信号施加到测试结构,并且测量第一掺杂区域和第二掺杂区域之间的击穿电压(Vbd)。