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    • 4. 发明授权
    • Method of fabricating CMOS image sensor
    • CMOS图像传感器的制作方法
    • US08124438B2
    • 2012-02-28
    • US12565983
    • 2009-09-24
    • Ji-Hwan Park
    • Ji-Hwan Park
    • H01L21/00
    • H01L27/14603H01L27/14683
    • A CMOS image sensor and a method of fabricating the same. The CMOS image sensor may minimize disappearance of electrons generated by light without transmission of electrons to a transfer gate. A method of manufacturing a CMOS image sensor may include forming a trench over an isolation region of a semiconductor substrate to define an active region including a photodiode region and a transistor region. The method may include forming first conductivity-type ion implanted regions over a trench side wall of a photodiode region and over a region adjacent to the transistor region. The method may include forming second conductivity-type ion implanted regions between a first conductivity-type ion implanted region and a trench, and between a lower part of a transistor region and a first conductivity-type ion implanted region. The method may include forming an isolation layer, forming a gate electrode and a spacer, and/or forming a photodiode.
    • CMOS图像传感器及其制造方法。 CMOS图像传感器可以最小化由光产生的电子的消失而不将电子传输到传输门。 制造CMOS图像传感器的方法可以包括在半导体衬底的隔离区域上形成沟槽,以限定包括光电二极管区域和晶体管区域的有源区域。 该方法可以包括在光电二极管区域的沟槽侧壁上方和与晶体管区域相邻的区域上形成第一导电型离子注入区域。 该方法可以包括在第一导电型离子注入区域和沟槽之间以及在晶体管区域的下部和第一导电型离子注入区域之间形成第二导电型离子注入区域。 该方法可以包括形成隔离层,形成栅电极和间隔物,和/或形成光电二极管。
    • 7. 发明申请
    • Light Guide Plate, and Method and Apparatus of Manufacturing Same
    • 导光板及其制造方法和装置
    • US20130004726A1
    • 2013-01-03
    • US13583855
    • 2011-01-18
    • Doo Jin ParkJi Hwan Park
    • Doo Jin ParkJi Hwan Park
    • B32B3/30B29C35/08C08J7/04
    • B29D11/00663B29C33/42B29C35/0888B29C59/046B29C2035/0827B32B37/1027B32B38/06B32B2310/0831B32B2333/12B32B2551/00G02B6/0053G02B6/0065Y10T428/24612
    • The present invention relates to a light guide plate, and a method and apparatus of manufacturing the same. The light guide plate includes; a transparent substrate including an active area and a dummy area defined in the periphery of the active area, wherein a groove for coupling other members is defined in the dummy area; and a pattern layer disposed on one surface of the substrate. The pattern layer is not disposed on the dummy area of the substrate, but disposed on the active area of the substrate. Since the pattern layer is formed on only the active are of the substrate using a spinless process, a material for forming the pattern layer may not be wasted to reduce material costs. Also, since a plurality of grooves are formed in the substrate before the pattern layer is formed on the substrate, conventional limitations, whereby it is difficult to perform a groove forming process due to a pattern layer cured by forming a plurality of grooves after the pattern layer is formed, may be overcome.
    • 本发明涉及一种导光板及其制造方法和装置。 导光板包括: 所述透明基板包括有源区域和限定在所述有效区域的周边中的虚设区域,其中用于耦合其它构件的沟槽限定在所述虚拟区域中; 以及设置在基板的一个表面上的图案层。 图案层不设置在基板的虚拟区域上,而是设置在基板的有源区域上。 由于图案层仅使用无纺工艺形成在基板的有源部分上,所以形成图案层的材料可能不会浪费以降低材料成本。 此外,由于在图案层形成在基板上之前在基板中形成多个凹槽,这是常规的限制,由于通过在图案之后形成多个凹槽而使图案层固化而难以进行凹槽形成处理 形成层,可以克服。
    • 8. 发明授权
    • Method of manufacturing flash memory device
    • 制造闪存设备的方法
    • US07883984B2
    • 2011-02-08
    • US12620811
    • 2009-11-18
    • Ji-Hwan Park
    • Ji-Hwan Park
    • H01L21/20H01L21/8242H01L21/336
    • H01L27/11521
    • A method of manufacturing a flash memory device may include forming a trench, defining at least a common source region, on a semiconductor substrate, forming a gate poly over the semiconductor substrate, performing an ion implantation process employing a first photoresist pattern and the gate poly as a mask, wherein the ion implantation process forms a source/drain junction on the semiconductor substrate, forming a recess common source region in the trench by using a second photoresist pattern, and performing an ion implantation process on the recess common source region.
    • 一种制造闪速存储器件的方法可以包括在半导体衬底上形成至少限定公共源极区域的沟槽,在半导体衬底上形成栅极多晶硅,执行使用第一光致抗蚀剂图案的离子注入工艺和栅极聚 作为掩模,其中所述离子注入工艺在所述半导体衬底上形成源极/漏极结,通过使用第二光致抗蚀剂图案在所述沟槽中形成凹陷共同源极区域,以及对所述凹部公共源极区域执行离子注入工艺。
    • 9. 发明申请
    • IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME
    • 图像传感器及其制造方法
    • US20090315087A1
    • 2009-12-24
    • US12486876
    • 2009-06-18
    • Ji-Hwan Park
    • Ji-Hwan Park
    • H01L31/112H01L31/18
    • H01L27/14609H01L27/14689
    • A method for manufacturing an image sensor includes forming an isolation area in a semiconductor substrate, forming a plurality of gate insulating layers and a plurality of gates over a transistor area of the semiconductor substrate, forming a photodiode over the semiconductor substrate between the gates and the isolation area, forming a nitride layer over the semiconductor substrate such that tensile stress is applied to the transistor area of the semiconductor substrate, forming a floating diffusion layer over the semiconductor substrate between the gates, and removing the nitride layer over the photodiode, and forming an oxide layer over the photodiode.
    • 一种用于制造图像传感器的方法,包括在半导体衬底中形成隔离区域,在半导体衬底的晶体管区域上形成多个栅极绝缘层和多个栅极,在栅极和栅极之间的半导体衬底上形成光电二极管 隔离区域,在半导体衬底上形成氮化物层,使得拉伸应力施加到半导体衬底的晶体管区域,在栅极之间的半导体衬底上形成浮动扩散层,并且去除光电二极管上的氮化物层,并形成 在光电二极管上的氧化层。
    • 10. 发明申请
    • Image Sensor and Method for Manufacturing Thereof
    • 图像传感器及其制造方法
    • US20090114962A1
    • 2009-05-07
    • US12256514
    • 2008-10-23
    • Ji Hwan Park
    • Ji Hwan Park
    • H01L31/00H01L21/00
    • H01L27/14603H01L27/1463H01L27/14687
    • Disclosed are an image sensor and a method for manufacturing the same. The image sensor can include a first pixel including a first photodiode and a first gate; a second pixel adjacent the first pixel and including a second photodiode and a second gate; and a barrier layer between the first photodiode and the second photodiode. The barrier layer can be formed by implanting ions into a semiconductor substrate at a region between adjacent photodiodes. A shallow trench isolation (STI) can be omitted in the regions between adjacent photodiodes by using the ion-implanted barrier layer to isolate the photodiodes from each other.
    • 公开了一种图像传感器及其制造方法。 图像传感器可以包括包括第一光电二极管和第一栅极的第一像素; 与所述第一像素相邻并包括第二光电二极管和第二栅极的第二像素; 以及第一光电二极管和第二光电二极管之间的阻挡层。 可以通过在相邻的光电二极管之间的区域将离子注入到半导体衬底中来形成阻挡层。 通过使用离子注入的阻挡层将光电二极管彼此隔离,可以在相邻的光电二极管之间的区域中省略浅沟槽隔离(STI)。