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    • 10. 发明授权
    • Vacuum chuck with venturi jet for converting positive pressure to a
vacuum
    • 真空吸盘用文丘里喷嘴将正压转换成真空
    • US5421595A
    • 1995-06-06
    • US219122
    • 1994-03-28
    • Jerry D. CripeJoe L. Martinez, Jr.
    • Jerry D. CripeJoe L. Martinez, Jr.
    • B25B11/00H01L21/683
    • B25B11/007H01L21/6838Y10T279/11
    • A vacuum chuck (10) holds a semiconductor wafer (56) securely in place during manufacturing processes. An external chuck (12) has a hollow center portion receiving a spindle support (14) and shaft (16). A positive pressure is applied through the shaft to a nozzle assembly (26) that rests on the spindle support. The nozzle assembly is further housed within a cavity in an internal chuck (28) that rests within a cup in the external chuck. The nozzle assembly use a venturi jet (44) to convert the positive pressure to a vacuum. A plurality of vacuum ports (34 and 36) from the cavity of the internal chuck transfer the vacuum to an upper surface (40) of the internal chuck to hold the semiconductor wafer in place. A plurality of exhaust ports (30 and 32) from the cavity of the internal chuck exhaust gases radially across the upper surface (13) of the external chuck toward its perimeter to prevent undesired chemicals from reaching the underside of the semiconductor wafer.
    • 真空吸盘(10)在制造过程中将半导体晶片(56)牢固地保持就位。 外部卡盘(12)具有容纳主轴支撑件(14)和轴(16)的中空中心部分。 通过轴将正压施加到靠在主轴支撑件上的喷嘴组件(26)。 喷嘴组件进一步容纳在位于外部卡盘内的杯内的内部卡盘(28)内的空腔内。 喷嘴组件使用文丘里喷嘴(44)将正压力转换成真空。 来自内部卡盘的空腔的多个真空端口(34和36)将真空转移到内部卡盘的上表面(40),以将半导体晶片保持在适当位置。 从内部卡盘的空腔排出的多个排气口(30和32)径向跨越外部卡盘的上表面(13)朝向其周边,以防止不期望的化学品到达半导体晶片的下侧。