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    • 4. 发明授权
    • High frequency resonator, and manufacturing method therefor
    • 高频谐振器及其制造方法
    • US06259189B1
    • 2001-07-10
    • US09337279
    • 1999-06-22
    • Nak Cheol SungMin Soo KimJeong Ho Cho
    • Nak Cheol SungMin Soo KimJeong Ho Cho
    • H01L4108
    • H03H9/562H03H3/02Y10T29/42Y10T29/43Y10T29/435Y10T29/49121Y10T29/49146Y10T29/49169Y10T29/49171Y10T29/49789Y10T29/49798
    • A high frequency resonator and a manufacturing method therefor are disclosed. The method for manufacturing a ceramic resonator includes the step of forming a ceramic piezoelectric device, a capacitor chip and a lead frame. Then the piezoelectric device and the capacitor chip are assembled into the lead frame, and the assembled chip is molded by using epoxy resin. The process for making the capacitor includes the step of cutting a ceramic wafer into a plurality of sub-wafers. Then electrodes are printed on one face of the sub-wafer in a dual-striped form, and a drying is carried out on the sub-wafer thus printed. Then another electrode is printed on a central part of the opposite face of the sub-wafer in such a manner as to be overlapped with the electrodes of the one face of the sub-wafer. Then the sub-wafer is dried. Then a baking is carried out on the sub-wafer thus dried, and the sub-wafer thus baked is cut into a plurality of capacitor chips.
    • 公开了一种高频谐振器及其制造方法。 制造陶瓷谐振器的方法包括形成陶瓷压电器件,电容器芯片和引线框架的步骤。 然后将压电器件和电容器芯片组装到引线框架中,并且使用环氧树脂模制组装的芯片。 制造电容器的过程包括将陶瓷晶片切割成多个子晶片的步骤。 然后将电极以双重条纹形式印刷在子晶片的一个面上,并且在这样印刷的子晶片上进行干燥。 然后以与子晶片的一个面的电极重叠的方式将另一电极印刷在子晶片的相对面的中心部分上。 然后将该副晶片干燥。 然后在这样干燥的子晶片上进行烘烤,将这样烘烤的子晶片切成多个电容器芯片。