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    • 4. 发明授权
    • Packing means for small form-factor module
    • 小尺寸模块的包装方式
    • US06530785B1
    • 2003-03-11
    • US10020530
    • 2001-12-18
    • Jenq-Yih Hwang
    • Jenq-Yih Hwang
    • H01R1200
    • H01R13/6582G02B6/4246G02B6/4261G02B6/428G02B6/4284H01R12/722H01R13/633
    • Means to firmly pack an SFP module. The means comprises an upper cover (4) and a lower cover (5). The upper cover comprises an upper plate (41), two sidewalls (42) integrally depending from the upper plate, and a bottom plate (43) formed between front portions of the sidewalls. The lower cover has a main panel (50). A pair of flanges (52) extends from opposite longitudinal sides of the main panel respectively. Two elbow-shaped locking tabs (424) integrally depend from respective opposite bottom edges of the sidewalls of the upper cover. A pair of symmetric elbow-shaped cutouts (51) is respectively defined in opposite sides of a front portion of the lower cover, for extension of the elbow-shaped locking tabs of the upper cover therethrough.
    • 意味着牢固地包装SFP模块。 该装置包括上盖(4)和下盖(5)。 上盖包括上板(41),从上板一体地悬垂的两个侧壁(42)和形成在侧壁前部之间的底板(43)。 下盖具有主面板(50)。 一对凸缘(52)分别从主面板的相对的纵向侧面延伸。 两个肘形的锁定突片(424)从上盖的侧壁的相应的相对的底部边缘一体地依靠。 一对对称的肘形切口(51)分别限定在下盖的前部的相对侧中,用于延伸上盖的肘形锁定突出部。
    • 5. 发明授权
    • Guide rail device for receiving a GBIC module
    • 用于接收GBIC模块的导轨装置
    • US06469905B1
    • 2002-10-22
    • US09935431
    • 2001-08-22
    • Jenq-Yih Hwang
    • Jenq-Yih Hwang
    • H05K504
    • G02B6/4277H01R13/6582H01R13/6594
    • A guide rail (1) for receiving a GBIC module therein mounts to a printed circuit board (2) and includes a frame (10) having a receiving space (26) for receiving the GBIC module therein, a metallic cover (12), and a connector assembly (14) and two pairs of supporting poles (15) fastened to the frame for elevating the frame a given distance above the printed circuit board. The frame includes four side lugs (28) at outer walls thereof for attachment to selected ends of the respective supporting poles by four bolts (78). The lower ends of the supporting poles are mounted onto the printed circuit board. The connector assembly has a second connector (104) downwardly extending beyond a bottom surface (124) of the frame and mounted onto the printed circuit board, helping elevate the frame a given distance above the printed circuit board.
    • 用于在其中接收GBIC模块的导轨(1)安装到印刷电路板(2),并且包括具有用于接收GBIC模块的容纳空间(26)的框架(10),金属盖(12)和 连接器组件(14)和固定到框架上的两对支撑杆(15),用于将框架提升到印刷电路板上方给定距离。 该框架包括在其外壁处的四个侧凸耳(28),用于通过四个螺栓(78)附接到各支撑杆的选定端。 支撑杆的下端安装在印刷电路板上。 连接器组件具有向下延伸超过框架的底表面(124)并安装到印刷电路板上的第二连接器(104),有助于使框架在印刷电路板上方给定距离。