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1. 发明授权

US09134627B2 Multiple-patterning overlay decoupling method 有权
标题翻译：多图案叠加去耦方法
公开(公告)号：US09134627B2
公开(公告)日：2015-09-15
申请号：US13328264
申请日：2011-12-16
申请人： Wen-Chuan Wang , Shy-Jay Lin , Pei-Yi Liu , Jaw-Jung Shin , Burn Jeng Lin
发明人： Wen-Chuan Wang , Shy-Jay Lin , Pei-Yi Liu , Jaw-Jung Shin , Burn Jeng Lin
IPC分类号： H01L21/66 , G03F7/20 , H01L23/544
CPC分类号： G03F7/70633 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： A method for fabricating a semiconductor device is disclosed. An exemplary method includes forming a first structure in a first layer by a first exposure and determining placement information of the first structure. The method further includes forming a second structure in a second layer overlying the first layer by a second exposure and determining placement information of the second structure. The method further includes forming a third structure including first and second substructures in a third layer overlying the second layer by a third exposure. Forming the third structure includes independently aligning the first substructure to the first structure and independently aligning the second substructure to the second structure.
摘要翻译：公开了一种制造半导体器件的方法。一种示例性方法包括通过第一曝光在第一层中形成第一结构并确定第一结构的放置信息。该方法还包括通过第二曝光在覆盖第一层的第二层中形成第二结构，并确定第二结构的放置信息。该方法还包括在第三层中形成第三结构，该第三结构包括通过第三次曝光覆盖第二层的第三层中的第一和第二子结构。形成第三结构包括将第一子结构独立地对准第一结构并且将第二子结构独立地对准到第二结构。

2. 发明授权

US08858052B2 Backlight module 有权
标题翻译：背光模组
公开(公告)号：US08858052B2
公开(公告)日：2014-10-14
申请号：US13076439
申请日：2011-03-31
申请人： Yu-Jeng Lin , Wen-Yen Cho
发明人： Yu-Jeng Lin , Wen-Yen Cho
IPC分类号： G02B6/13 , F21V8/00 , G02F1/1333 , G02F1/1335
CPC分类号： G02B6/0083 , G02B6/0055 , G02F1/13338 , G02F1/133615
摘要： The present invention relates to a backlight module and a manufacturing method thereof. The backlight module comprises a thin film unit, a light guide unit, an insulation layer and at least a light source. The thin film unit is installed with a first circuit. The light guide unit is installed with a second circuit. The insulation layer is installed between the thin film unit and the light guide unit. The light source is electrically connected to the first circuit, and the light thereof projects into the light guide unit.
摘要翻译：本发明涉及一种背光模组及其制造方法。背光模块包括薄膜单元，导光单元，绝缘层和至少一个光源。薄膜单元安装有第一电路。光导单元安装有第二电路。绝缘层安装在薄膜单元和导光单元之间。光源电连接到第一电路，并且其光突出到导光单元中。

3. 发明授权

US08848163B2 Photoresist materials and photolithography processes 有权
标题翻译：光刻胶材料和光刻工艺
公开(公告)号：US08848163B2
公开(公告)日：2014-09-30
申请号：US13050251
申请日：2011-03-17
申请人： Hsien-Cheng Wang , Chin-Hsiang Lin , Heng-Jen Lee , Ching-Yu Chang , Hua-Tai Lin , Burn Jeng Lin
发明人： Hsien-Cheng Wang , Chin-Hsiang Lin , Heng-Jen Lee , Ching-Yu Chang , Hua-Tai Lin , Burn Jeng Lin
IPC分类号： G03B27/52 , G03B27/42
CPC分类号： G03F7/0397 , G03F7/0045 , G03F7/0392 , G03F7/30 , G03F7/38 , G03F7/70858 , Y10S430/106 , Y10S430/111
摘要： A lithography apparatus generates a tunable magnetic field to facilitate processing of photoresist. The lithography apparatus includes a chamber and a substrate stage in the chamber operable to hold a substrate. A magnetic module provides a magnetic field to the substrate on the substrate stage. The magnetic module is configured to provide the magnetic field in a tunable and alternating configuration with respect to its magnitude and frequency. The magnetic field is provided to have a gradient in magnitude along a Z-axis that is perpendicular to the substrate stage to cause magnetically-charged particles disposed over the substrate stage to move up and down along the Z-axis. The lithography apparatus also includes a radiation energy source and an objective lens configured to receive radiation energy from the radiation energy source and direct the radiation energy toward the substrate positioned on the substrate stage.
摘要翻译：光刻设备产生可调磁场以便于光致抗蚀剂的加工。光刻设备包括腔室和腔室中的衬底台，其可操作以保持衬底。磁性模块为衬底台上的衬底提供磁场。磁模块被配置为相对于其幅度和频率提供可调和交替配置的磁场。磁场被提供为具有沿垂直于衬底台的Z轴的幅度梯度，以使得设置在衬底台上的带磁性颗粒沿Z轴上下移动。光刻设备还包括辐射能量源和物镜，其被配置为从辐射能量源接收辐射能量并将辐射能量引向位于衬底台上的衬底。

4. 发明授权

US08767178B2 Immersion lithography system using direction-controlling fluid inlets 有权
标题翻译：浸入光刻系统采用方向控制流体入口
公开(公告)号：US08767178B2
公开(公告)日：2014-07-01
申请号：US13482879
申请日：2012-05-29
申请人： Burn Jeng Lin , Ching-Yu Chang
发明人： Burn Jeng Lin , Ching-Yu Chang
IPC分类号： G03B27/42
CPC分类号： G03B27/52 , G03F7/70341
摘要： Immersion lithography system and method using direction-controlling fluid inlets are described. According to one embodiment of the present disclosure, an immersion lithography apparatus includes a lens assembly having an imaging lens disposed therein and a wafer stage configured to retain a wafer beneath the lens assembly. The apparatus also includes a plurality of direction-controlling fluid inlets disposed adjacent to the lens assembly, each direction-controlling fluid inlet in the plurality of direction-controlling fluid inlets being configured to direct a flow of fluid beneath the lens assembly and being independently controllable with respect to the other fluid inlets in the plurality of direction-controlling fluid inlets.
摘要翻译：描述了使用方向控制流体入口的浸渍光刻系统和方法。根据本公开的一个实施例，浸没式光刻设备包括具有设置在其中的成像透镜的透镜组件和被配置为将晶片保持在透镜组件下方的晶片台。该装置还包括多个方向控制流体入口，其邻近透镜组件设置，多个方向控制流体入口中的每个方向控制流体入口构造成将透镜流体下方的流体引导到透镜组件的下方并且可独立控制相对于多个方向控制流体入口中的其它流体入口。

5. 发明申请

US20140044530A1 PORTABLE ELECTRONIC DEVICE WITH TILTEDLY INSTALLED CENTRIFUGAL FAN 有权
标题翻译：便携式电子设备，带有安装好的离心风扇
公开(公告)号：US20140044530A1
公开(公告)日：2014-02-13
申请号：US13569897
申请日：2012-08-08
申请人： Ming-Hsien LIN , Yun-Jeng Lin , Yu-Hsun Lin
发明人： Ming-Hsien LIN , Yun-Jeng Lin , Yu-Hsun Lin
IPC分类号： F04D29/58 , F04D17/16
CPC分类号： F04D17/16 , F04D25/0613 , F04D29/601 , G06F1/203
摘要： A portable electronic device includes a main body and a heat dissipation module with a tiltedly installed centrifugal fan inside thereof. The main body includes an upper housing wall and a lower housing wall. The heat dissipation module includes a centrifugal fan, a heat dissipation fin array and a heat pipe. The centrifugal fan includes an impeller, a radial air outlet, an upper axial air inlet and a lower axial air inlet, wherein the centrifugal fan has a first side that is in contact with the upper housing wall and an opposite second side that is in contact with the lower housing wall. The heat dissipation fin array is located at the radial air outlet of the centrifugal fan. The heat pipe has a first end connected with the heat dissipation fin array and a second opposite end connected with a heat source.
摘要翻译：便携式电子设备包括主体和散热模块，其内部具有倾斜安装的离心式风扇。主体包括上壳体壁和下壳体壁。散热模块包括离心风扇，散热片阵列和热管。离心风扇包括叶轮，径向空气出口，上部轴向空气入口和下部轴向空气入口，其中离心风扇具有与上部壳体壁接触的第一侧和与之接触的相对的第二侧与下壳体墙。散热片阵列位于离心风机的径向出风口处。热管具有与散热片阵列连接的第一端和与热源连接的第二相对端。

6. 发明申请

US20130320243A1 EFFICIENT SCAN FOR E-BEAM LITHOGRAPHY 有权
标题翻译： E-BEAM LITHOGRAPHY的高效扫描
公开(公告)号：US20130320243A1
公开(公告)日：2013-12-05
申请号：US13484524
申请日：2012-05-31
申请人： Cheng-Hung Chen , Shih-Chi Wang , Jeng-Horng Chen , Burn Jeng Lin
发明人： Cheng-Hung Chen , Shih-Chi Wang , Jeng-Horng Chen , Burn Jeng Lin
IPC分类号： G21K5/10
CPC分类号： H01J37/3174 , B82Y10/00 , B82Y40/00 , H01J2237/31761
摘要： The present disclosure provides a method of increasing the wafer throughput by an electron beam lithography system. The method includes scanning a wafer using the maximum scan slit width (MSSW) of the electron beam writer. By constraining the integrated circuit (IC) field size to allow the MSSW to cover a complete field, the MSSW is applied to decrease the scan lanes of a wafer and thereby increase the throughput. When scanning the wafer with the MSSW, the next scan lane data can be rearranged and loaded into a memory buffer. Thus, once one scan lane is finished, the next scan lane data in the memory buffer is read for scanning.
摘要翻译：本公开提供了一种通过电子束光刻系统增加晶片通过量的方法。该方法包括使用电子束写入器的最大扫描狭缝宽度（MSSW）扫描晶片。通过限制集成电路（IC）场尺寸以允许MSSW覆盖整个场，MSSW被应用于减小晶片的扫描通道，从而增加吞吐量。当用MSSW扫描晶片时，下一个扫描通道数据可以重新排列并加载到存储器缓冲器中。因此，一旦一个扫描通道完成，读取存储器缓冲器中的下一个扫描通道数据进行扫描。

7. 发明授权

US08534894B2 Light guide plate, backlight module and method of guiding light 有权
标题翻译：导光板，背光模组及导光方法
公开(公告)号：US08534894B2
公开(公告)日：2013-09-17
申请号：US12969584
申请日：2010-12-15
申请人： Yu-Jeng Lin , Guan-Kai Ciou , Shin-Kun Lee
发明人： Yu-Jeng Lin , Guan-Kai Ciou , Shin-Kun Lee
IPC分类号： F21V7/04
CPC分类号： G02B6/0036 , G02B6/0055
摘要： A light guide plate, backlight module installed with the same and method of guiding light utilizing the same are provided. The light guide plate has a bottom surface, a light outlet surface opposite to the bottom surface, and a light inlet surface at least connected with the light outlet surface. A light is introduced to the light inlet surface and transmitted in the light guide plate. The light guide plate comprises a light transmissive substrate installed with at least one through hole, and a first slot installed on the light transmissive substrate and arranged at the periphery of the through hole.
摘要翻译：提供了一种安装有导光板的背光模块和使用该导光板的引导光的方法。导光板具有底表面，与底表面相对的光出口表面，以及至少与光出射表面连接的光入口表面。将光引入光入口表面并在导光板中传输。导光板包括安装有至少一个通孔的透光基板和安装在透光基板上并布置在通孔周边的第一槽。

8. 发明授权

US08510687B1 Error diffusion and grid shift in lithography 有权
标题翻译：光刻中的误差扩散和栅格位移
公开(公告)号：US08510687B1
公开(公告)日：2013-08-13
申请号：US13409765
申请日：2012-03-01
申请人： Pei-Yi Liu , Shy-Jay Lin , Wen-Chuan Wang , Jaw-Jung Shin , Burn Jeng Lin
发明人： Pei-Yi Liu , Shy-Jay Lin , Wen-Chuan Wang , Jaw-Jung Shin , Burn Jeng Lin
IPC分类号： G06F17/50
CPC分类号： G03F1/36
摘要： The present disclosure involves a method of data preparation in lithography processes. The method of data preparation includes providing an integrated circuit (IC) layout design in a graphic database system (GDS) grid, and converting the IC layout design GDS grid to a second exposure grid by applying an error diffusion and a grid shift technique to a sub-pixel exposure grid.
摘要翻译：本公开涉及在光刻工艺中的数据准备方法。数据准备的方法包括在图形数据库系统（GDS）网格中提供集成电路（IC）布局设计，并且通过向第二曝光网格应用误差扩散和网格移位技术将IC布局设计GDS网格转换为第二曝光网格子像素曝光网格。

9. 发明申请

US20130202256A1 OPTICAL INTERCONNNECTION TRANSCEIVER MODULE 审中-公开
标题翻译：光学互连收发器模块
公开(公告)号：US20130202256A1
公开(公告)日：2013-08-08
申请号：US13365368
申请日：2012-02-03
申请人： Fang-Jeng Lin , Tsu-Hsiu Wu
发明人： Fang-Jeng Lin , Tsu-Hsiu Wu
IPC分类号： G02B6/43
CPC分类号： G02B6/4214
摘要： An optical interconnection transceiver module comprises a printed circuit board, a carrier, an optical interconnection device and a light-guiding module. The printed circuit board comprises a first area and a second area. The carrier is disposed at the first area of the printed circuit board to make the flexibility of the first area lower than that of the second area. The optical interconnection device is disposed on the carrier and electrically connected with the printed circuit board. The light-guiding module comprises a case disposed on the carrier and at least one reflective mirror. The case comprises a first accommodating slot, a first light channel and a second light channel in communication with the first accommodating slot and the first light channel. The reflective mirror is disposed at the first light channel, and the optical interconnection device is corresponded to the reflective mirror via the first light channel.
摘要翻译：光互连收发模块包括印刷电路板，载体，光互连装置和光导模块。印刷电路板包括第一区域和第二区域。载体设置在印刷电路板的第一区域，以使第一区域的柔性比第二区域的柔性更低。光学互连装置设置在载体上并与印刷电路板电连接。导光模块包括设置在载体上的壳体和至少一个反射镜。壳体包括与第一容纳槽和第一光通道连通的第一容纳槽，第一光通道和第二光通道。反射镜设置在第一光通道处，并且光学互连装置经由第一光通道对应于反射镜。

10. 发明申请

US20130157389A1 Multiple-Patterning Overlay Decoupling Method 有权
标题翻译：多重图案叠加去耦方法
公开(公告)号：US20130157389A1
公开(公告)日：2013-06-20
申请号：US13328264
申请日：2011-12-16
申请人： Wen-Chuan Wang , Shy-Jay Lin , Pei-Yi Liu , Jaw-Jung Shin , Burn Jeng Lin
发明人： Wen-Chuan Wang , Shy-Jay Lin , Pei-Yi Liu , Jaw-Jung Shin , Burn Jeng Lin
IPC分类号： H01L21/66
CPC分类号： G03F7/70633 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2924/0002 , H01L2924/00
摘要： A method for fabricating a semiconductor device is disclosed. An exemplary method includes forming a first structure in a first layer by a first exposure and determining placement information of the first structure. The method further includes forming a second structure in a second layer overlying the first layer by a second exposure and determining placement information of the second structure. The method further includes forming a third structure including first and second substructures in a third layer overlying the second layer by a third exposure. Forming the third structure includes independently aligning the first substructure to the first structure and independently aligning the second substructure to the second structure
摘要翻译：公开了一种制造半导体器件的方法。一种示例性方法包括通过第一曝光在第一层中形成第一结构并确定第一结构的放置信息。该方法还包括通过第二曝光在覆盖第一层的第二层中形成第二结构，并确定第二结构的放置信息。该方法还包括在第三层中形成第三结构，该第三结构包括通过第三次曝光覆盖第二层的第三层中的第一和第二子结构。形成第三结构包括将第一子结构独立地对准第一结构并且将第二子结构独立地对准到第二结构

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