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    • 2. 发明授权
    • Gas-assisted mold surface heating system
    • 气体辅助模具表面加热系统
    • US08092208B2
    • 2012-01-10
    • US12754966
    • 2010-04-06
    • Shia-Chung ChenJen-An Chang
    • Shia-Chung ChenJen-An Chang
    • B29C45/73
    • B29C45/7337B29C2045/7375
    • A gas-assisted mold surface heating system is disclosed, which comprise: an air supply, for providing air with a flow rate larger than 300 L/min; a heater, for heating air to a temperature higher than 400° C.; a mold, configured with a mold cavity, an inlet and an outlet; and an air storage tank; wherein, the inlet is connected to the heater through a pipeline for allowing the air from the air supply to flow into the cavity after being heated by the heater and thus to be for heating up the surface of the mold cavity while the heated air is being enabled to flow out of the cavity through the outlet and into the air storage tank. With the aforesaid system, surface temperature of the mold cavity can be raised to a point higher than a glass transmission point in a short period of time.
    • 公开了一种气体辅助模具表面加热系统,其包括:用于提供流量大于300L / min的空气的空气供应; 加热器,用于将空气加热至高于400℃的温度; 模具,其配置有模腔,入口和出口; 和储气罐; 其中,所述入口通过管道连接到所述加热器,用于允许来自所述空气供应的空气在被所述加热器加热之后流入所述空腔,并且因此用于在所述加热的空气正在被加热的情况下加热所述模腔的表面 使得能够通过出口流出空腔并进入储气罐。 利用上述系统,可以在短时间内将模腔的表面温度升高到比玻璃传输点高的点。
    • 4. 发明授权
    • Apparatus for controlling counterpressure and temperature in mold cavity
    • 用于控制模腔中的反压和温度的装置
    • US08500426B2
    • 2013-08-06
    • US13217726
    • 2011-08-25
    • Shia-Chung ChenPing-Shun HsuJen-An ChangShyh-Shin HwangChia-Yen Tseng
    • Shia-Chung ChenPing-Shun HsuJen-An ChangShyh-Shin HwangChia-Yen Tseng
    • B29C44/00
    • B29C35/007B29C44/105B29C44/348
    • A counterpressure/temperature control apparatus, comprises: a mold, having a runner and an air passage, both coupled to a mold cavity inside the mold; a logic control valve, coupled to the air passage for controlling a high-temperature gas or/and a counterpressure gas to flow in and out the mold cavity; a counterpressure gas supplying device, for supplying the counterpressure gas to the mold cavity through the logic control valve; and a high-temperature gas supplying device, for supplying the high-temperature gas to the mold cavity through the logic control valve; wherein the mold cavity is heated by the high-temperature gas, while subjecting the same to a counterpressure provided from the counterpressure gas supplying device during an injection molding process, and thereby, not only the surface quality of a product resulting from the injection molding process can be improved, but also the size of foams and the distribution evenness thereof are enhanced.
    • 一种反压/温度控制装置,包括:具有流道和空气通道的模具,两者都联接到模具内部的模腔; 逻辑控制阀,其连接到空气通道,用于控制高温气体或/和反压气体流入和流出模腔; 反压气体供给装置,用于通过逻辑控制阀将反压气体供给模腔; 以及高温气体供给装置,用于通过逻辑控制阀向模腔供给高温气体; 其中模具腔被高温气体加热,同时在注射成型工艺期间使其具有由反压气体供给装置提供的反压力,从而不仅由注塑成型过程产生的产品的表面质量 可以提高发泡体的尺寸和分散均匀性。
    • 5. 发明申请
    • APPARATUS FOR CONTROLLING COUNTERPRESSURE AND TEMPERATURE IN MOLD CAVITY
    • 控制模具中温度和温度的设备
    • US20120052143A1
    • 2012-03-01
    • US13217726
    • 2011-08-25
    • SHIA-CHUNG CHENPing-Shun HsuJen-An ChangShyh-Shin HwangChia-Yen Tseng
    • SHIA-CHUNG CHENPing-Shun HsuJen-An ChangShyh-Shin HwangChia-Yen Tseng
    • B29C35/04
    • B29C35/007B29C44/105B29C44/348
    • A counterpressure/temperature control apparatus, comprises: a mold, having a runner and an air passage, both coupled to a mold cavity inside the mold; a logic control valve, coupled to the air passage for controlling a high-temperature gas or/and a counterpressure gas to flow in and out the mold cavity; a counterpressure gas supplying device, for supplying the counterpressure gas to the mold cavity through the logic control valve; and a high-temperature gas supplying device, for supplying the high-temperature gas to the mold cavity through the logic control valve; wherein the mold cavity is heated by the high-temperature gas, while subjecting the same to a counterpressure provided from the counterpressure gas supplying device during an injection molding process, and thereby, not only the surface quality of a product resulting from the injection molding process can be improved, but also the size of foams and the distribution evenness thereof are enhanced.
    • 一种反压/温度控制装置,包括:具有流道和空气通道的模具,两者都联接到模具内部的模腔; 逻辑控制阀,其连接到空气通道,用于控制高温气体或/和反压气体流入和流出模腔; 反压气体供给装置,用于通过逻辑控制阀将反压气体供给模腔; 以及高温气体供给装置,用于通过逻辑控制阀向模腔供给高温气体; 其中模具腔被高温气体加热,同时在注射成型工艺期间使其具有由反压气体供给装置提供的反压力,从而不仅由注塑成型过程产生的产品的表面质量 可以提高发泡体的尺寸和分散均匀性。
    • 8. 发明申请
    • GAS-ASSISTED MOLD SURFACE HEATING SYSTEM
    • 气体辅助模具表面加热系统
    • US20100255143A1
    • 2010-10-07
    • US12754966
    • 2010-04-06
    • Shia-Chung ChenJen-An Chang
    • Shia-Chung ChenJen-An Chang
    • B29C45/73
    • B29C45/7337B29C2045/7375
    • A gas-assisted mold surface heating system is disclosed, which comprise: an air supply, for providing air with a flow rate larger than 300 L/min; a heater, for heating air to a temperature higher than 400° C.; a mold, configured with a mold cavity, an inlet and an outlet; and an air storage tank; wherein, the inlet is connected to the heater through a pipeline for allowing the air from the air supply to flow into the cavity after being heated by the heater and thus to be for heating up the surface of the mold cavity while the heated air is being enabled to flow out of the cavity through the outlet and into the air storage tank. With the aforesaid system, surface temperature of the mold cavity can be raised to a point higher than a glass transmission point in a short period of time.
    • 公开了一种气体辅助模具表面加热系统,其包括:用于提供流量大于300L / min的空气的空气供应; 加热器,用于将空气加热至高于400℃的温度; 模具,其配置有模腔,入口和出口; 和储气罐; 其中,所述入口通过管道连接到所述加热器,用于允许来自所述空气供应的空气在被所述加热器加热之后流入所述空腔,并且因此用于在所述加热的空气正在被加热的情况下加热所述模腔的表面 使得能够通过出口流出空腔并进入储气罐。 利用上述系统,可以在短时间内将模腔的表面温度升高到比玻璃传输点高的点。
    • 9. 发明申请
    • MOLD HEATING/COOLING STRUCTURE
    • 模具加热/冷却结构
    • US20100221373A1
    • 2010-09-02
    • US12713303
    • 2010-02-26
    • SHIA-CHUNG CHENJen-An Chang
    • SHIA-CHUNG CHENJen-An Chang
    • B29C35/02
    • B29C33/04B29C33/06B29C33/306B29C33/3828B29C35/041B29C35/0805B29C35/16B29C2035/0811B29C2035/0816B29K2995/0007B29K2995/0008
    • A mold heating/cooling structure for a mold configured with a die base and an insert, comprising: a heat insulating layer, disposed surrounding a die impression of the die base for insulating the heat conduction between the die base and the insert; a magnetic powder layer, disposed against the heat insulating layer; a coil, being disposed on the magnetic powder layer in a manner that it is circling from the outside in toward the center of the magnetic powder layer; and a cooling plate, configured with a plurality of second fluid channels provided fro a fluid to flow therein. With the aforesaid structure, the insert can be heated directly by the coil the it is subject to a high-frequency current, and the heated coil as well as the insert can be cool down with high efficiency as soon as the fluid is fed into the second fluid channels.
    • 一种用于模具的模具加热/冷却结构,其配置有模具基座和插入件,包括:绝热层,围绕模具基座的模具印模设置,用于绝缘模具基座和插入件之间的热传导; 设置在隔热层上的磁性粉末层; 线圈,以从外部朝向磁性粉末层的中心​​环绕的方式设置在磁粉末层上; 以及冷却板,其构造有多个第二流体通道,所述第二流体通道设置成流体流动。 利用上述结构,可以通过线圈直接对线圈进行高频电流加热,并且一旦流体进入到该加热线圈中,加热线圈以及插入件就能以高效率冷却 第二流体通道。
    • 10. 发明授权
    • Mold heating/cooling structure
    • 模具加热/冷却结构
    • US08162640B2
    • 2012-04-24
    • US12713303
    • 2010-02-26
    • Shia-Chung ChenJen-An Chang
    • Shia-Chung ChenJen-An Chang
    • B29C45/73
    • B29C33/04B29C33/06B29C33/306B29C33/3828B29C35/041B29C35/0805B29C35/16B29C2035/0811B29C2035/0816B29K2995/0007B29K2995/0008
    • A mold heating/cooling structure for a mold configured with a die base and an insert, comprising: a heat insulating layer, disposed surrounding a die impression of the die base for insulating the heat conduction between the die base and the insert; a magnetic powder layer, disposed against the heat insulating layer; a coil, being disposed on the magnetic powder layer in a manner that it is circling from the outside in toward the center of the magnetic powder layer; and a cooling plate, configured with a plurality of second fluid channels provided fro a fluid to flow therein. With the aforesaid structure, the insert can be heated directly by the coil the it is subject to a high-frequency current, and the heated coil as well as the insert can be cool down with high efficiency as soon as the fluid is fed into the second fluid channels.
    • 一种用于模具的模具加热/冷却结构,其配置有模具基座和插入件,包括:绝热层,围绕模具基座的模具印模设置,用于绝缘模具基座和插入件之间的热传导; 设置在隔热层上的磁性粉末层; 线圈,以从外部朝向磁性粉末层的中心​​环绕的方式设置在磁粉末层上; 以及冷却板,其构造有多个第二流体通道,所述第二流体通道设置成流体流动。 利用上述结构,可以通过线圈直接对线圈进行高频电流加热,并且一旦流体进入到该加热线圈中,加热线圈以及插入件就能以高效率冷却 第二流体通道。