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    • 3. 发明授权
    • Image forming apparatus with opening/closing member
    • 具有打开/关闭构件的图像形成装置
    • US07792453B2
    • 2010-09-07
    • US12153271
    • 2008-05-15
    • Sung Ku BaekSung Hyup KimSun Soo KimGyu Deok HwangJong Woo KimHyun Ki ChoJe Hyoung RyuTae Hee Kim
    • Sung Ku BaekSung Hyup KimSun Soo KimGyu Deok HwangJong Woo KimHyun Ki ChoJe Hyoung RyuTae Hee Kim
    • G03G15/20
    • G03G21/20G03G15/2064
    • An image forming apparatus capable of minimizing a temperature rise of a cover by substantially preventing heat emission from a fusing device to an outside is disclosed. The image forming apparatus includes a main body, a fusing device mounted in the main body, the fusing device having an outlet to discharge paper, an opening/closing member opening and closing the outlet of the fusing device, a cam member moving the opening/closing member between a first position in which the opening/closing member closes the outlet to prevent heat in the fusing device from being emitted through the outlet and a second position in which the opening/closing member opens the outlet to permit the paper to pass through the outlet, a driving part rotating the cam member, and a control unit controlling the driving part to determine a rotational position of the cam member.
    • 公开了一种图像形成装置,其能够通过基本上防止从定影装置向外部的热量发射来最小化盖的温度上升。 图像形成装置包括主体,安装在主体中的定影装置,具有排出纸张的出口的定影装置,打开和关闭定影装置的出口的打开/关闭部件,使打开/ 关闭构件,其中所述打开/关闭构件关闭所述出口的第一位置以防止所述定影装置中的热量通过所述出口发射;以及第二位置,所述打开/关闭构件打开所述出口以允许所述纸张通过 所述出口,使所述凸轮构件旋转的驱动部,以及控制所述驱动部,以确定所述凸轮构件的旋转位置的控制单元。
    • 4. 发明授权
    • Inspecting apparatus for semiconductor device
    • 半导体器件检测设备
    • US07176704B2
    • 2007-02-13
    • US10823546
    • 2004-04-14
    • Je-hyoung RyuTae-gyu KimSoon-kyu YimSung-jin LeeJun-ho Lee
    • Je-hyoung RyuTae-gyu KimSoon-kyu YimSung-jin LeeJun-ho Lee
    • G01R31/02
    • G01R1/0458
    • An inspecting apparatus for semiconductor devices including: a match plate; a contact module combined with the match plate, and the match plate including a radiation unit radiating heat from the semiconductor devices to the outside, and a test unit contacting leads of the semiconductor; an insert module installed on a bottom of the contact module, and having a semiconductor device accommodator to accommodate the semiconductor device; and an auxiliary radiation member installed on a bottom of the insert module, and radiating the heat from the semiconductor device to the outside. Accordingly, the inspecting apparatus for semiconductor device according to the present invention performs testing at a constant temperature regardless of heat from the semiconductors by radiating the heat from the semiconductors immediately and efficiently, thereby producing more accurate test results. Accurate testing improves productivity and saves expense by removing faulty test results caused by identifying a qualified semiconductor as a defective semiconductor due to heat radiated from the semiconductor device.
    • 一种用于半导体器件的检查装置,包括:匹配板; 与所述匹配板组合的接触模块,所述匹配板包括从所述半导体器件向外部辐射热的辐射单元,以及接触所述半导体的引线的测试单元; 插入模块,安装在所述触点模块的底部,并且具有用于容纳所述半导体器件的半导体器件容纳器; 以及安装在所述插入模块的底部上的辅助辐射构件,并且将来自所述半导体器件的热量散发到外部。 因此,根据本发明的半导体装置的检查装置不管来自半导体的热量是恒定的,通过立即有效地辐射来自半导体的热量进行测试,从而产生更准确的测试结果。 通过从半导体器件辐射的热量,通过识别合格的半导体作为有缺陷的半导体而导致的故障测试结果,可以提高生产率并节省成本。