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1. 发明申请

US20130032953A1 METHOD OF MANUFACTURING A PLURALITY OF ELECTRONIC ASSEMBLIES 有权
标题翻译：制造大量电子组件的方法
公开(公告)号：US20130032953A1
公开(公告)日：2013-02-07
申请号：US13620477
申请日：2012-09-14
申请人： John J. Beatty , Jason A. Garcia
发明人： John J. Beatty , Jason A. Garcia
IPC分类号： H01L23/538
CPC分类号： H01L25/50 , H01L21/563 , H01L23/3114 , H01L25/0657 , H01L2224/73204 , H01L2225/06513 , H01L2924/19041
摘要： A method of manufacturing a plurality of electronic devices is provided. Each one of a plurality of first conductive terminals on a plurality of integrated circuits formed on a device wafer is connected to a respective one of a plurality of second conductive terminals on a carrier wafer, thereby forming a combination wafer assembly. The combination wafer assembly is singulated between the integrated circuits to form separate electronic assemblies. The combination wafer assembly also allows for an underfill material to be introduced and to cured at wafer level and for thinning of the device wafer at wafer level without requiring a separate supporting substrate. Alignment between the device wafer and the carrier wafer can be tested by conducting a current through first and second conductors in the device and carrier wafers, respectively.
摘要翻译：提供一种制造多个电子设备的方法。形成在器件晶片上的多个集成电路上的多个第一导电端子中的每一个连接到载体晶片上的多个第二导电端子中的相应一个，从而形成组合晶片组件。组合晶片组件在集成电路之间分离以形成分离的电子组件。组合晶片组件还允许底片填充材料被引入并在晶片级别固化并且在晶片级别使器件晶片变薄，而不需要单独的支撑衬底。可以通过分别通过在器件和载体晶片中的电流通过第一和第二导体来测试器件晶片和载体晶片之间的对准。

2. 发明授权

US07352039B2 Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device 有权
标题翻译：用于微电子组件的方法和装置具有在MEMS器件周围具有可变粘度的材料
公开(公告)号：US07352039B2
公开(公告)日：2008-04-01
申请号：US11089906
申请日：2005-03-24
申请人： Jason A. Garcia
发明人： Jason A. Garcia
IPC分类号： H01L23/10
CPC分类号： B81B7/0058 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/73253 , H01L2224/73265 , H01L2924/1461 , H01L2924/00014
摘要： Various methods and apparatuses are described in which a micro-electro-mechanical systems (MEMS) device is encapsulated with a material having a variable viscosity with a viscosity value high enough to retard foreign material from contacting the MEMS device during an electronic package assembly process. The material having the variable viscosity may be affixed to a cavity area surrounding the MEMS device prior to an epoxy being dispensed onto the electronic package assembly. The temperature and pressure conditions of the electronic package assembly process may be controlled to ensure when the epoxy is dispensed that the material having the variable viscosity has a high enough viscosity value to retard foreign material from contacting the MEMS device during the electronic package assembly process.
摘要翻译：描述了各种方法和装置，其中微电子机械系统（MEMS）装置用具有可变粘度的材料包封，其粘度值足够高以在电子封装组装过程期间阻止异物接触MEMS装置。具有可变粘度的材料可以在将环氧树脂分配到电子封装组件之前固定到围绕MEMS器件的空腔区域。可以控制电子封装组装过程的温度和压力条件，以确保当分配环氧树脂时，具有可变粘度的材料具有足够高的粘度值，以在电子封装组装过程期间阻止异物接触MEMS器件。

3. 发明授权

US07262509B2 Microelectronic assembly having a perimeter around a MEMS device 有权
标题翻译：具有MEMS器件周围的微电子组件
公开(公告)号：US07262509B2
公开(公告)日：2007-08-28
申请号：US10843885
申请日：2004-05-11
申请人： Jason A. Garcia
发明人： Jason A. Garcia
IPC分类号： H01L23/28 , H01L23/29
CPC分类号： H01L24/17 , B81B7/0077 , H01L23/3121 , H01L23/433 , H01L23/4334 , H01L24/32 , H01L24/48 , H01L24/81 , H01L2224/13099 , H01L2224/13147 , H01L2224/16225 , H01L2224/27013 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/81801 , H01L2224/83051 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic assembly is provided having a MEMS substrate, a MEMS device on the MEMS substrate, the MEMS device having a MEMS component which is movable relative to the MEMS substrate, a cover piece having a side over a side of the MEMS substrate on which the MEMS device is located, and a plurality of perimeter components, each having opposing portions sealing with the MEMS substrate and the cover piece respectively, the perimeter components forming a perimeter around the MEMS device.
摘要翻译：提供了一种微电子组件，其具有MEMS衬底，MEMS衬底上的MEMS器件，MEMS器件具有可相对于MEMS衬底移动的MEMS部件;覆盖件，其具有在MEMS衬底的一侧上的侧面， MEMS器件被定位，并且多个周边部件各自具有分别与MEMS基板和盖片密封的相对部分，周边部件形成围绕MEMS器件的周边。

4. 发明授权

US07421778B2 Method of making an electronic assembly 失效
标题翻译：制作电子组件的方法
公开(公告)号：US07421778B2
公开(公告)日：2008-09-09
申请号：US11388100
申请日：2006-03-22
申请人： Jason A. Garcia , John J. Beatty
发明人： Jason A. Garcia , John J. Beatty
IPC分类号： H05K3/36
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05647 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13078 , H01L2224/13099 , H01L2224/13111 , H01L2224/14051 , H01L2224/14141 , H01L2224/14142 , H01L2224/14145 , H01L2224/14146 , H01L2224/14177 , H01L2224/14505 , H01L2224/16 , H01L2224/16227 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/3511 , H05K3/3426 , H05K2201/068 , H05K2201/10242 , H05K2201/10909 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , H01L2924/00014
摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
摘要翻译：根据本发明的一个方面，提供一种电子组件。电子组件包括其中形成有集成电路的第一基板和第二基板。第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件，第二热膨胀系数。第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。当第二基板的温度升高时，第二基板从其中心部分扩展。双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。

5. 发明授权

US08064728B2 Traceability marks 有权
标题翻译：可追溯性标记
公开(公告)号：US08064728B2
公开(公告)日：2011-11-22
申请号：US11694893
申请日：2007-03-30
申请人： Jason A. Garcia
发明人： Jason A. Garcia
IPC分类号： G06K9/00 , G06K9/46 , G06K9/36 , G06K9/62 , G06K9/66 , G06K7/10 , H04N9/47 , H04N7/18
CPC分类号： G06K19/06037
摘要： The formation of marks on devices is described. In one embodiment, a method for marking a device includes forming a plurality of unique marks sequentially on a device. The method includes defining a virtual array having a plurality of cells extending in an x-direction and a plurality of cells extending in a y-direction, wherein the marks are each positioned in a cell in the virtual array. The method also includes capturing an image including the relative cell position of the marks within the virtual array and converting the relative position of the marks within the virtual array into a set of coordinates including an x value along the x-direction and a y value along the y-direction for each of the marks. The method also includes generating a device identification using a plurality of the x values and the y values. Other embodiments are described and claimed.
摘要翻译：描述了器件上的标记形成。在一个实施例中，用于标记设备的方法包括在设备上顺序地形成多个唯一标记。该方法包括定义具有在x方向上延伸的多个单元的虚拟阵列和沿y方向延伸的多个单元，其中，所述标记各自位于虚拟阵列中的单元中。该方法还包括捕获包括虚拟阵列内的标记的相对单元位置的图像，并将虚拟阵列内的标记的相对位置转换成包括x方向上的x值和沿着x方向的ay值的一组坐标 y方向为每个标记。该方法还包括使用多个x值和y值生成设备标识。描述和要求保护其他实施例。

6. 发明申请

US20080240614A1 TRACEABILITY MARKS 有权
标题翻译：可追溯性标志
公开(公告)号：US20080240614A1
公开(公告)日：2008-10-02
申请号：US11694893
申请日：2007-03-30
申请人： Jason A. Garcia
发明人： Jason A. Garcia
IPC分类号： G06K9/36
CPC分类号： G06K19/06037
摘要： The formation of marks on devices is described. In one embodiment, a method for marking a device includes forming a plurality of unique marks sequentially on a device. The method includes defining a virtual array having a plurality of cells extending in an x-direction and a plurality of cells extending in a y-direction, wherein the marks are each positioned in a cell in the virtual array. The method also includes capturing an image including the relative cell position of the marks within the virtual array and converting the relative position of the marks within the virtual array into a set of coordinates including an x value along the x-direction and a y value along the y-direction for each of the marks. The method also includes generating a device identification using a plurality of the x values and the y values. Other embodiments are described and claimed.
摘要翻译：描述了器件上的标记形成。在一个实施例中，用于标记设备的方法包括在设备上顺序地形成多个唯一标记。该方法包括定义具有在x方向上延伸的多个单元的虚拟阵列和沿y方向延伸的多个单元，其中，所述标记各自位于虚拟阵列中的单元中。该方法还包括捕获包括虚拟阵列内的标记的相对单元位置的图像，并将虚拟阵列内的标记的相对位置转换成包括x方向上的x值和沿着x方向的ay值的一组坐标 y方向为每个标记。该方法还包括使用多个x值和y值生成设备标识。描述和要求保护其他实施例。

7. 发明授权

US07183493B2 Electronic assembly having multi-material interconnects 失效
标题翻译：具有多材料互连的电子组件
公开(公告)号：US07183493B2
公开(公告)日：2007-02-27
申请号：US10883433
申请日：2004-06-30
申请人： Jason A. Garcia , John J. Beatty
发明人： Jason A. Garcia , John J. Beatty
IPC分类号： H05K1/09
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05647 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13078 , H01L2224/13099 , H01L2224/13111 , H01L2224/14051 , H01L2224/14141 , H01L2224/14142 , H01L2224/14145 , H01L2224/14146 , H01L2224/14177 , H01L2224/14505 , H01L2224/16 , H01L2224/16227 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/3511 , H05K3/3426 , H05K2201/068 , H05K2201/10242 , H05K2201/10909 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , H01L2924/00014
摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
摘要翻译：根据本发明的一个方面，提供一种电子组件。电子组件包括其中形成有集成电路的第一基板和第二基板。第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件，第二热膨胀系数。第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。当第二基板的温度升高时，第二基板从其中心部分扩展。双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。

8. 发明授权

US06535388B1 Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof 有权
标题翻译：引线键合的微电子封装包括用于从其有效表面散热的散热装置
公开(公告)号：US06535388B1
公开(公告)日：2003-03-18
申请号：US09971948
申请日：2001-10-04
申请人： Jason A. Garcia
发明人： Jason A. Garcia
IPC分类号： H05K720
CPC分类号： H01L24/49 , H01L23/24 , H01L23/36 , H01L23/427 , H01L23/4334 , H01L24/48 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality of bond wires electrically connects bond pads on the microelectronic die active surface to a plurality of corresponding traces within the recess.
摘要翻译：一种引线键合微电子封装，其包括由背面附接到形成在基板中的凹部的安装表面的微电子管芯和与所述微电子管芯有源表面热接触的散热器件。多个接合线将微电子管芯有源表面上的接合焊盘电连接到凹部内的多个相应的迹线。

9. 发明授权

US08709869B2 Method of manufacturing a plurality of electronic assemblies 有权
标题翻译：制造多个电子组件的方法
公开(公告)号：US08709869B2
公开(公告)日：2014-04-29
申请号：US13620477
申请日：2012-09-14
申请人： John J. Beatty , Jason A. Garcia
发明人： John J. Beatty , Jason A. Garcia
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , H01L21/563 , H01L23/3114 , H01L25/0657 , H01L2224/73204 , H01L2225/06513 , H01L2924/19041
摘要： A method of manufacturing a plurality of electronic devices is provided. Each one of a plurality of first conductive terminals on a plurality of integrated circuits formed on a device wafer is connected to a respective one of a plurality of second conductive terminals on a carrier wafer, thereby forming a combination wafer assembly. The combination wafer assembly is singulated between the integrated circuits to form separate electronic assemblies. The combination wafer assembly also allows for an underfill material to be introduced and to cured at wafer level and for thinning of the device wafer at wafer level without requiring a separate supporting substrate. Alignment between the device wafer and the carrier wafer can be tested by conducting a current through first and second conductors in the device and carrier wafers, respectively.
摘要翻译：提供一种制造多个电子设备的方法。形成在器件晶片上的多个集成电路上的多个第一导电端子中的每一个连接到载体晶片上的多个第二导电端子中的相应一个，从而形成组合晶片组件。组合晶片组件在集成电路之间分离以形成分离的电子组件。组合晶片组件还允许底片填充材料被引入并在晶片级别固化并且在晶片级别使器件晶片变薄，而不需要单独的支撑衬底。可以通过分别通过在器件和载体晶片中的电流通过第一和第二导体来测试器件晶片和载体晶片之间的对准。

10. 发明授权

US07276396B2 Die handling system 有权
标题翻译：模具处理系统
公开(公告)号：US07276396B2
公开(公告)日：2007-10-02
申请号：US10959931
申请日：2004-10-06
申请人： Jason A. Garcia
发明人： Jason A. Garcia
IPC分类号： H01L21/00
CPC分类号： H01L24/75 , H01L21/67132 , H01L2221/68313 , H01L2221/68322 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/7565 , H01L2224/75745 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01033 , H01L2924/14 , Y10T156/12 , H01L2224/0401
摘要： A system may include singulation of a semiconductor wafer to separate a plurality of integrated circuit die that are integrated into the semiconductor wafer; coupling of a support to an integrated circuit substrate of one of the plurality of integrated circuit die, and decoupling of the one integrated circuit die from the singulated semiconductor wafer while the support is coupled to the integrated circuit substrate. According to some embodiments, a second side of the one integrated circuit die is not touched during the coupling and the decoupling, the second side being opposite to the integrated circuit substrate.
摘要翻译：系统可以包括半导体晶片的分离以分离集成到半导体晶片中的多个集成电路裸片; 将支撑件耦合到多个集成电路管芯中的一个集成电路管芯的集成电路基板，以及在支撑件耦合到集成电路基板的同时将单个集成电路管芯与分离的半导体晶片分离。根据一些实施例，在耦合和解耦期间，一个集成电路管芯的第二侧不被接触，第二侧与集成电路衬底相对。

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