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1. 发明授权

US5583376A High performance semiconductor device with resin substrate and method for making the same 失效
标题翻译：具有树脂基板的高性能半导体器件及其制造方法
公开(公告)号：US5583376A
公开(公告)日：1996-12-10
申请号：US368503
申请日：1995-01-03
申请人： Janet Sickler , Everitt W. Mace
发明人： Janet Sickler , Everitt W. Mace
IPC分类号： H01L21/56 , H01L23/13 , H01L23/14 , H01L23/31 , H05K1/03
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/13 , H01L23/145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01068 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H01L2924/181 , H01L2924/3011 , H05K1/032
摘要： High performance semiconductor devices, such as those used to package microprocessor integrated circuits, demand materials with excellent electrical, physical and chemical properties. Polymethylpentene (PMP) compositions provide resin substrates for high performance devices with a material which has a low dielectric constant and a low dissipation factor. In addition, PMP has very low moisture absorption, and good mechanical stability under repeated thermal stress, which will help keep the device from cracking and warping during high temperature assembly processes and constant use.
摘要翻译：高性能半导体器件（如用于封装微处理器集成电路的器件）需要具有优异电气，物理和化学特性的材料。聚甲基戊烯（PMP）组合物为具有低介电常数和低耗散因子的材料的高性能装置提供树脂基材。此外，PMP具有非常低的吸湿性，并且在重复的热应力下具有良好的机械稳定性，这将有助于在高温组装过程和不断使用的过程中保持装置不起裂和翘曲。

2. 发明授权

US5004508A Thermally dissipated soldering flux 失效
标题翻译：散热助焊剂
公开(公告)号：US5004508A
公开(公告)日：1991-04-02
申请号：US449647
申请日：1989-12-12
申请人： Everitt W. Mace , Janet Sickler , Varadarajan Srinivasan
发明人： Everitt W. Mace , Janet Sickler , Varadarajan Srinivasan
IPC分类号： B23K35/363 , B23K35/36 , B23K101/40
CPC分类号： B23K35/3612
摘要： A no clean thermally dissipated soldering flux is shown which includes camphor as a flux base, an organic activator and an organic diluent. The camphor provides a tacky yet fluid medium which is thermally dissipated during the flux operation and leaves no undesirable residue which would require a postcleaning step.

3. 发明申请

US20060250731A1 System and method for electrostatic discharge protection in an electronic circuit 审中-公开
标题翻译：电子电路中静电放电保护的系统和方法
公开(公告)号：US20060250731A1
公开(公告)日：2006-11-09
申请号：US11121401
申请日：2005-05-03
申请人： Ray Parkhurst , Ron Ruebusch , Chi Jiaa , Janet Sickler
发明人： Ray Parkhurst , Ron Ruebusch , Chi Jiaa , Janet Sickler
IPC分类号： H02H9/00
CPC分类号： H01L23/62 , H01L2924/0002 , H05K1/0231 , H05K1/0259 , H05K1/0298 , H05K1/167 , H05K1/181 , H05K2201/09309 , H01L2924/00
摘要： A system and method for implementing an electronic circuit for protecting electronic components from ESD. A PCB or IC may include an electrostatic discharge protection layer having a first and second conductive layer separated by a semi-conductive dielectric layer. Further, the PCB/IC may include a protected node coupled to the first conductive layer and a current-shunt node electrically coupled to the second conductive layer, such that a signal at the protected node that is below a threshold magnitude propagates through the protected node in a normal operating path and a signal at the protected node that exceeds a threshold magnitude is diverted to the semi-conductive dielectric layer to the current-shunt node in a current-shunt path. In this manner, existing layers of a PCB/IC may be used for both ESD protection and other functions, such as ground planes or battery plane by isolating the specific sections of the layer for its intended use.
摘要翻译：一种用于实现用于保护电子部件免受ESD的电子电路的系统和方法。 PCB或IC可以包括具有由半导电介电层隔开的第一和第二导电层的静电放电保护层。此外，PCB / IC可以包括耦合到第一导电层的受保护节点和电耦合到第二导电层的电流分流节点，使得受保护节点处于阈值以下的信号通过受保护节点传播在正常操作路径中，超过阈值幅度的受保护节点处的信号被转移到电流分流路径中的电流分流节点的半导体电介质层。以这种方式，PCB / IC的现有层可以用于ESD保护和其它功能，例如通过将层的特定部分隔离用于其预期用途，诸如接地层或电池平面。

4. 发明授权

US4994119A Water soluble soldering flux 失效
标题翻译：水溶性助焊剂
公开(公告)号：US4994119A
公开(公告)日：1991-02-19
申请号：US521775
申请日：1990-05-09
申请人： Barbara L. Gutierrez , Janet Sickler
发明人： Barbara L. Gutierrez , Janet Sickler
IPC分类号： B23K35/363 , B23K35/36 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/3618
摘要： A water soluble soldering flux is shown which includes gum arabic, modified polysaccharides and other natural resins as the carrier, an organic activator and water. The carrier provides a tacky, yet fluid medium capable of holding precisely aligned electrical components during solder reflow and allows aqueous removal of the flux after reflow. The flux composition can be used to solder precisely aligned integrated circuit chips onto a circuit board.

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