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1. 发明授权

US4896817A Flux composition and method of decreasing tin content in lead/tin solder joints 失效
标题翻译：焊锡成分及铅锡锡焊锡含量降低的方法
公开(公告)号：US4896817A
公开(公告)日：1990-01-30
申请号：US258524
申请日：1988-10-17
申请人： Randy W. Snyder , James Spalik
发明人： Randy W. Snyder , James Spalik
IPC分类号： B23K35/26 , B23K35/34 , B23K35/36 , H05K3/34
CPC分类号： B23K35/268 , B23K35/34 , B23K35/3612 , H05K3/3457 , H05K3/3489
摘要： A technique for soldering is provided wherein the solder contains a nominal amount of 4 to 5% tin and the remainder lead. A solder flux is utilized which incorporates a lead compound, such as lead acetate. When the solder and flux is heated, a redox reaction will take place in which the lead ions in the flux will replace the alloyed tin in the solder, thereby reducing the tin content of the solder, whereby the ductility of the solder joint is improved.

2. 发明授权

US06217671B1 Composition for increasing activity of a no-clean flux 有权
标题翻译：用于增加免清洁助焊剂活性的组合物
公开(公告)号：US06217671B1
公开(公告)日：2001-04-17
申请号：US09461557
申请日：1999-12-14
申请人： Donald W. Henderson , James Spalik
发明人： Donald W. Henderson , James Spalik
IPC分类号： B23K35362
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/3617 , H05K3/3489
摘要： An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.
摘要翻译：用于焊接的活性不清洁助焊剂组合物包括在约2重量％至约4重量％范围内的二羧酸，有机溶剂和乙酸。

3. 发明授权

US5531838A Flux composition and corresponding soldering method 失效
标题翻译：助焊剂组成及相应的焊接方法
公开(公告)号：US5531838A
公开(公告)日：1996-07-02
申请号：US435896
申请日：1995-05-05
申请人： Roy L. Arldt , Susan H. Downey , Harry J. Goldlen , Issa S. Mahmoud , Clement A. Okoro , James Spalik
发明人： Roy L. Arldt , Susan H. Downey , Harry J. Goldlen , Issa S. Mahmoud , Clement A. Okoro , James Spalik
IPC分类号： B23K35/363 , B23K35/36 , C07C55/16 , H05K3/34 , B23K35/34
CPC分类号： H05K3/3489 , B23K35/3612 , B23K35/3618 , Y10T29/49144
摘要： A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
摘要翻译：公开了一种新的焊剂组合物，以及用于将电子部件焊接到印刷电路板的相应方法。新的助焊剂组合物包括庚二酸和两种有机溶剂。重要的是，新的助焊剂组合物在用于将电子部件安装到印刷电路板上的焊接工艺完成时基本上不留下离子残留物。

4. 发明授权

US5532024A Method for improving the adhesion of polymeric adhesives to nickel surfaces 失效
标题翻译：改善聚合物粘合剂对镍表面的粘附性的方法
公开(公告)号：US5532024A
公开(公告)日：1996-07-02
申请号：US431545
申请日：1995-05-01
申请人： Steven F. Arndt , Luis J. Matienzo , Irving Memis , James Spalik , Tien Y. Wu
发明人： Steven F. Arndt , Luis J. Matienzo , Irving Memis , James Spalik , Tien Y. Wu
IPC分类号： C01G53/04 , B05D3/10 , C09J5/02 , C23C8/16 , C23C22/68 , B05D3/00 , B05D3/12
CPC分类号： B05D3/102 , C09J5/02 , C23C22/68 , B05D2202/40 , C09J2400/166
摘要： The present invention provides a novel method for improving the adhesion of polymers, particularly adhesives, to nickel surfaces. The method involves contacting the nickel surface with a hydrogen peroxide solution having a temperature of at least about 40.degree. C. for a time sufficient to form a wettable oxide surface having a water contact angle of less than about 10.degree..
摘要翻译：本发明提供一种用于改善聚合物，特别是粘合剂对镍表面的粘合性的新方法。该方法包括使镍表面与至少约40℃的温度的过氧化氢溶液接触一段足以形成具有小于约10°的水接触角的可湿性氧化物表面的时间。

5. 发明授权

US06585150B1 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder 失效
标题翻译：倒装芯片器件的焊接保护涂层和无焊接接合在具有电镀焊料的层压板上
公开(公告)号：US06585150B1
公开(公告)日：2003-07-01
申请号：US09687524
申请日：2000-10-12
申请人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
发明人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
IPC分类号： B23K3102
CPC分类号： H01L24/81 , B23K35/226 , C23C8/00 , C23C26/00 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/014 , H05K3/282 , H05K3/3457
摘要： A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
摘要翻译：提供了一种用于保护氧化锡涂覆的焊料表面以防止进一步氧化的方法以及这种表面的无焊剂焊料接合的方法。

6. 发明授权

US06468363B2 Composition for increasing activity of a no-clean flux 有权
标题翻译：用于增加免清洁助焊剂活性的组合物
公开(公告)号：US06468363B2
公开(公告)日：2002-10-22
申请号：US09773488
申请日：2001-02-02
申请人： Donald W. Henderson , James Spalik
发明人： Donald W. Henderson , James Spalik
IPC分类号： B23K35362
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/3617 , H05K3/3489
摘要： An activated no-clean flux composition for soldering includes a dicarboxylic acid, an organic solvent, and acetic acid in the range of about 2% to about 4% by weight.
摘要翻译：用于焊接的活性不清洁助焊剂组合物包括在约2重量％至约4重量％范围内的二羧酸，有机溶剂和乙酸。

7. 发明授权

US06921015B2 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder 失效
标题翻译：倒装芯片器件的焊接保护涂层和无焊接接合在具有电镀焊料的层压板上
公开(公告)号：US06921015B2
公开(公告)日：2005-07-26
申请号：US10417690
申请日：2003-04-17
申请人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
发明人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
IPC分类号： B23K35/22 , C23C8/00 , C23C26/00 , H01L21/60 , H05K3/28 , H05K3/34 , B23K31/02
CPC分类号： H01L24/81 , B23K35/226 , C23C8/00 , C23C26/00 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/014 , H05K3/282 , H05K3/3457
摘要： A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
摘要翻译：提供了一种用于保护氧化锡涂覆的焊料表面以防止进一步氧化的方法以及这种表面的无焊剂焊料接合的方法。

8. 发明授权

US06550667B2 Flux composition and soldering method for high density arrays 有权
标题翻译：高密度阵列的焊剂组成和焊接方法
公开(公告)号：US06550667B2
公开(公告)日：2003-04-22
申请号：US09726697
申请日：2000-11-29
申请人： William E. Bernier , Donald W. Henderson , James Spalik
发明人： William E. Bernier , Donald W. Henderson , James Spalik
IPC分类号： B23K35362
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/3617 , H05K3/3489
摘要： A single phase flux composition suitable for use with high density arrays, that comprises dicarboxylic acid in an amount sufficient to react with the oxidized surface area in a high-density array, a first organic solvent, and a second organic solvent having a higher evaporation temperature than that of said first organic solvent. Preferred dicarboxylic acids are adipic, pimelic, suberic, azelaic and sebacic acids. Preferably, the composition comprises greater than 6% dicarboxylic acid, more preferably greater that 6% to about 15%, and even more preferably from about 8% to about 10% of the dicarboxylic acid. Preferred amounts of the first organic solvent are in the range of from about 25% to about 75% by weight and preferred amounts of the second organic solvent are from about 10% to about 35% by weight. Preferably, the ratio of the first organic solvent to the second organic solvent is about 3:1. A method for using the inventive composition to solder high density arrays which, for eutectic lead/tin solder, involves heating at extended dwell times and high temperature relative to typical compositions.
摘要翻译：适用于高密度阵列的单相通量组合物，其包含足以与高密度阵列中的氧化表面积反应的二羧酸，第一有机溶剂和具有较高蒸发温度的第二有机溶剂比所述第一有机溶剂的。优选的二羧酸是己二酸，庚二酸，辛二酸，壬二酸和癸二酸。优选地，组合物包含大于6％的二羧酸，更优选大于6％至约15％，甚至更优选约8％至约10％的二羧酸。第一有机溶剂的优选量为约25重量％至约75重量％，优选的第二有机溶剂的量为约10重量％至约35重量％。优选地，第一有机溶剂与第二有机溶剂的比例为约3:1。使用本发明组合物来焊接高密度阵列的方法，对于共晶铅/锡焊料，其涉及相对于典型组合物在延长的停留时间和高温下加热。

9. 发明授权

US5615827A Flux composition and corresponding soldering method 失效
标题翻译：助焊剂组成及相应的焊接方法
公开(公告)号：US5615827A
公开(公告)日：1997-04-01
申请号：US251806
申请日：1994-05-31
申请人： Roy L. Arldt , Susan H. Downey , Harry J. Golden , Issa S. Mahmoud , Clement A. Okoro , James Spalik
发明人： Roy L. Arldt , Susan H. Downey , Harry J. Golden , Issa S. Mahmoud , Clement A. Okoro , James Spalik
IPC分类号： B23K35/363 , B23K35/36 , C07C55/16 , H05K3/34 , B05D5/12 , B23K1/20
CPC分类号： H05K3/3489 , B23K35/3612 , B23K35/3618 , Y10T29/49144
摘要： A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.
摘要翻译：公开了一种新的焊剂组合物，以及用于将电子部件焊接到印刷电路板的相应方法。新的助焊剂组合物包括庚二酸和两种有机溶剂。重要的是，新的助焊剂组合物在用于将电子部件安装到印刷电路板上的焊接工艺完成时基本上不留下离子残留物。

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