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    • 1. 发明授权
    • Thin buffer layers for SiGe growth on mismatched substrates
    • 用于SiGe在不匹配衬底上生长的薄缓冲层
    • US07902046B2
    • 2011-03-08
    • US11524499
    • 2006-09-19
    • Yu-Hsuan KuoJames S. Harris, Jr.
    • Yu-Hsuan KuoJames S. Harris, Jr.
    • H01L21/20H01L21/36
    • C30B33/02C30B29/52H01L21/02381H01L21/0245H01L21/02502H01L21/02532
    • Growth of SiGe on a significantly lattice mismatched substrate (e.g., Si) is provided by depositing a SiGe buffer layer at a growth temperature, then annealing the resulting structure at a temperature higher than the growth temperature. Additional buffer layers can be included following the same steps. The SiGe buffer is significantly lattice mismatched with respect to the substrate, and is preferably substantially lattice matched with a SiGe device to be grown on top of the buffer. The resulting buffer structure is relatively thin and provides low defect density, and low surface roughness. Disadvantages of thick graded buffer layers, such as high cost, high surface roughness, mechanical fragility, and CTE mismatch, are thereby avoided.
    • 通过在生长温度下沉积SiGe缓冲层,然后在高于生长温度的温度下对所得到的结构进行退火来提供SiGe在显着晶格错配衬底(例如Si)上的生长。 可以按照相同的步骤包括附加的缓冲层。 SiGe缓冲液相对于衬底显着地晶格失配,并且优选地与要在缓冲器顶部生长的SiGe器件基本上晶格匹配。 得到的缓冲结构相对较薄,提供低缺陷密度和低表面粗糙度。 从而避免了诸如高成本,高表面粗糙度,机械脆性和CTE不匹配等厚梯度缓冲层的缺点。
    • 6. 发明授权
    • Low temperature grown optical detector
    • 低温生长光检测器
    • US06653706B1
    • 2003-11-25
    • US09567179
    • 2000-05-08
    • David A. B. MillerJames S. Harris, Jr.
    • David A. B. MillerJames S. Harris, Jr.
    • H01C3100
    • H01L31/1852H01L31/09H01L31/1085Y02E10/544
    • A high efficiency optical interconnect (OI) deposited directly on a silicon based IC by a low temperature process that utilizes a heterogeneous crystalline structure of a III-V compound material to convert light pulses into electrical signals. The high efficiency is established by pulsing the light beams with a shorter duration than the life time of the generated carriers and by reducing the structural volume and consequently the internal capacitance of the III-V compound to a functional height of approximately 1 micron. The analog MSM characteristic of the OI is bypassed by differential two-beam signal processing, wherein the intensity difference of two synchronous light beams is transformed in two parallel OI's into two electrical signals that compensate in a central node. The resulting polarity in the node switches either a PMOS or a NMOS transistor, which connect either a positive or negative voltage to the output node.
    • 通过利用III-V复合材料的异质晶体结构的低温工艺将直接沉积在硅基IC上的高效光学互连(OI)将光脉冲转换成电信号。 通过以比产生的载流子的寿命短的持续时间脉冲光束和通过将III-V族化合物的内部电容降低到大约1微米的功能高度来建立高效率。 OI的模拟MSM特性被差分双波束信号处理旁路,其中两个同步光束的强度差在两个并行OI中变换成两个电信号,在中心节点进行补偿。 在节点中产生的极性切换PMOS或NMOS晶体管,其将正电压或负电压连接到输出节点。
    • 7. 发明授权
    • Wavelength tunable narrow linewidth resonant cavity light detectors
    • 波长可调窄线宽谐振腔光检测器
    • US06380531B1
    • 2002-04-30
    • US09451470
    • 1999-11-30
    • Fred SugihwoJames S. Harris, Jr.
    • Fred SugihwoJames S. Harris, Jr.
    • H01L3100
    • B82Y20/00G01J3/02G01J3/0256G01J3/26G02B26/001G02B26/02H01L31/02325H01L31/035236H01L31/101
    • A light detector comprising a photodetector disposed within an etalon or microcavity. The light detector is sensitive to light having a wavelength resonant with the etalon. Preferably, the etalon is a solid state microcavity having distributed bragg reflectors. The photodetector may be a photodiode, phototransistor or the like. The etalon has a front reflector with reflectivity Rf and a back reflector with reflectivity Rb. The photodetector has a double-pass absorption of A. In the present invention, Rf, Rb, and A are selected such that Rf=Rb(1−A). The combination of the back reflector and absorbing photodetector is indistinguishable from a single reflector of reflectivity Rf. Therefore, the light detector behaves like an etalon with matched reflectors. Preferably, Rf is greater than 0.95 and Rb is greater than 0.98. The photodetector can have a relatively thin absorption layer, thereby providing high speed capability. Even with a low absorption, the photodetector provides high quantum efficiency since it is within the etalon. Preferably, the front reflector is movable such that an etalon cavity length is adjustable. This provides for adjustment of the wavelength at which the light detector is sensitive.
    • 一种光检测器,包括设置在标准具或微腔内的光电检测器。 光检测器对具有与标准具共振的波长的光敏感。 优选地,标准具是具有分布式布拉格反射器的固态微腔。 光电检测器可以是光电二极管,光电晶体管等。 标准具具有反射率为Rf的前反射器和具有反射率Rb的后反射器。 光电检测器具有A的双程吸收。在本发明中,选择Rf,Rb和A使得Rf = Rb(1-A)。 背反射器和吸收光电探测器的组合与反射率Rf的单个反射器无法区分。 因此,光检测器的行为就像具有匹配反射器的标准具。 优选地,Rf大于0.95,Rb大于0.98。 光电检测器可以具有相对较薄的吸收层,从而提供高速能力。 即使具有低吸收,光电探测器也提供高量子效率,因为它在标准具内。 优选地,前反射器是可移动的,使得标准具腔长度可调。 这提供了光检测器敏感的波长的调整。
    • 9. 发明授权
    • Optical modulator and optical modulator array
    • 光调制器和光调制器阵列
    • US5909303A
    • 1999-06-01
    • US778817
    • 1997-01-03
    • John A. TrezzaMartin MorfJames S. Harris
    • John A. TrezzaMartin MorfJames S. Harris
    • G02F1/015G02F1/21G02F1/03
    • G02F1/218G02F2001/0157G02F2001/213
    • A reversible and conservative photon routing switch is implemented as a room temperature, optical, vertical cavity X-gate (also sometimes known as a Fredkin gate). Such gates are primitive structures into which all logic functions can be decomposed. The construction of the device makes it uniquely suited to dense packed arrays of optoelectronic components for optical routing and logic. In one of the switching states, light incident on the device from either side of the wafer will pass through the device (the device is bi-directionally transmissive). In the other switching state, light incident from either side of the wafer will be reflected. Switching can be performed using either electrical or optical control. Thus incident photons are either routed through the device or reflected from the device. The characteristics of the device operation for both transmission and reflection are designed to be nearly identical regardless of whether the incident light impinges upon the top of the device or the bottom of the device (after passing through the substrate). This ability to have input light from either side makes the device reversible. This dual reversible and conservative nature along with the vertical cavity format allows for dense two dimensional arrays of devices to be formed on a single substrate. Furthermore, because the incident photon stream is recoverable in both the on and off states and can be recovered from either the top or the bottom of the wafer, device layers can be vertically stacked. Thus the device is useful for 3-D device geometry in which optical outputs from one set of devices can be directly used as the inputs to other sets of devices.
    • 可逆和保守的光子路由开关实现为室温,光学,垂直腔X型门(有时也称为Fredkin门)。 这种门是原始结构,所有的逻辑功能都可以分解到其中。 该器件的结构使其独特地适用于用于光路由和逻辑的光电组件的密集封装阵列。 在切换状态之一中,从晶片的任一侧入射到器件上的光将穿过器件(器件是双向透射的)。 在另一个切换状态下,从晶片的任一侧入射的光将被反射。 可以使用电气或光学控制来执行切换。 因此,入射光子被路由穿过设备或从设备反射。 无论入射光入射到器件的顶部还是器件的底部(通过衬底)之后,传输和反射两者的器件操作的特性被设计为几乎相同。 这种从任一侧输入光线的能力使设备可逆。 这种双重可逆性和保守性以及垂直腔形式允许在单个衬底上形成致密的二维阵列阵列。 此外,由于入射光子流可以在导通和截止状态下恢复,并且可以从晶片的顶部或底部恢复,所以器件层可以垂直堆叠。 因此,该装置对于三维装置几何形状是有用的,其中来自一组装置的光学输出可以直接用作其他装置组的输入。
    • 10. 发明授权
    • (110) GaAs microwave FET
    • (110)GaAs微波FET
    • US4939557A
    • 1990-07-03
    • US311903
    • 1989-02-15
    • Yi-Ching PaoJames S. Harris
    • Yi-Ching PaoJames S. Harris
    • H01L29/04H01L29/423H01L29/812
    • H01L29/8128H01L29/045H01L29/42316
    • A field effect transistor (FET) structure suitable for use at microwave frequencies is fabricated on a planar surface of a semi-insulating single crystal GaAs substrate which has been cut and polished to present the (110) surface. This orientation is selected because of its non-polar and other unique surface and interface properties. The (110) crystal axis is tilted from the normal of the planar surface in the direction to expose more of the (111) Ga face about 5.degree. to facilitate molecular beam epitaxial (MBE) growth of smooth, defect-free thin films. An elongate gate electrode is formed along the bottom of an anisotropically etched trench having a pair of longitudinal sidewalls, one vertical and the other tilted outwardly. The trench is selectively oriented on the substrate to facilitate such anisotropic etching. Source and drain electrodes are respectively formed proximate the outwardly tilted and vertical trench sidewalls thereby forming a FET with a higher drain-to-gate breakdown voltage combined with lower parasitic resistance between the source and gate electrode. The invention has demonstrated potential for high speed digital circuits as well a microwave power FET applications.
    • 在半绝缘单晶GaAs衬底的平面上制造适用于微波频率的场效应晶体管(FET)结构,其被切割和抛光以呈现(110)表面。 由于其非极性和其他独特的表面和界面性质,选择此取向。 (110)晶轴从平面的法线方向倾斜,以使(111)Ga面的多数暴露于约5°,以促进平滑无缺陷薄膜的分子束外延(MBE)生长。 沿着各向异性蚀刻的沟槽的底部形成细长的栅电极,其具有一对纵向侧壁,一个垂直的另一个向外倾斜。 沟槽选择性地定向在衬底上以促进这种各向异性蚀刻。 源电极和漏电极分别形成在向外倾斜和垂直沟槽侧壁附近,从而形成具有较高漏极 - 栅极击穿电压的FET,并与源电极和栅电极之间的较低寄生电阻相结合。 本发明已经证明了高速数字电路以及微波功率FET应用的潜力。