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    • 1. 发明授权
    • System and method for thermal processing of a semiconductor substrate
    • 半导体衬底的热处理系统和方法
    • US06403925B1
    • 2002-06-11
    • US09695899
    • 2000-10-25
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • C23C1600
    • C23C16/4411C23C16/46C23C16/466C30B25/10C30B31/12
    • A semiconductor substrate processing system and method using a stable heating source with a large thermal mass relative to conventional lamp heated systems. The system dimensions and processing parameters are selected to provide a substantial heat flux to the wafer while minimizing heat loss to the surrounding environment (particularly from the edges of the heat source and wafer). The heat source provides a wafer temperature uniformity profile that has a low variance across temperature ranges at low pressures. A resistively heated block is substantially enclosed within an insulated vacuum cavity used to heat the wafer. A vacuum region is preferably provided between the heated block and the insulating material as well as between the insulating material and the chamber wall. Heat transfer across the vacuum regions is primarily achieved by radiation, while heat transfer through the insulating material is achieved by conduction. The wafer is placed on or near the heated block within the vacuum cavity for heating by conduction and radiation. The rate of heating may be controlled by varying pressure across a range of very low pressures.
    • 相对于传统的灯加热系统,使用具有大热质量的稳定的热源的半导体衬底处理系统和方法。 选择系统尺寸和处理参数以向晶片提供实质的热通量,同时最小化对周围环境(特别是从热源和晶片的边缘)的热损失。 热源提供晶片温度均匀性分布,在低压下在温度范围内具有低的方差。 电阻加热块基本封闭在用于加热晶片的绝缘真空腔内。 优选地,在加热块和绝缘材料之间以及绝缘材料和室壁之间设置真空区域。 通过真空区域的热传递主要通过辐射来实现,而通过绝缘材料的传热通过传导实现。 将晶片放置在真空腔内的加热块上或附近,以通过传导和辐射进行加热。 加热速率可以通过在非常低的压力范围内变化的压力来控制。
    • 2. 发明授权
    • Thermal processing system with supplemental resistive heater and shielded optical pyrometry
    • 具有补充电阻加热器和屏蔽光学高温计的热处理系统
    • US06200634B1
    • 2001-03-13
    • US09133844
    • 1998-08-14
    • Kristian E. JohnsgardJames McDiarmid
    • Kristian E. JohnsgardJames McDiarmid
    • C23C1600
    • H01L21/67248C23C16/481G01J5/0003H01L21/67115
    • System and method for determining thermal characteristics, such as temperature, temperature uniformity and emissivity, during thermal processing using shielded pyrometry. The surface of a semiconductor substrate is shielded to prevent interference from extrinsic light from radiant heating sources and to form an effective black-body cavity. An optical sensor is positioned to sense emitted light in the cavity for pyrometry. The effective emissivity of the cavity approaches unity independent of the semiconductor substrate material which simplifies temperature calculation. The shield may be used to prevent undesired backside deposition. Multiple sensors may be used to detect temperature differences across the substrate and in response heaters may be adjusted to enhance temperature uniformity.
    • 在使用屏蔽高温测量的热处理期间确定热特性的温度,温度均匀性和发射率的系统和方法。 屏蔽半导体衬底的表面以防止来自辐射加热源的外在光的干扰并形成有效的黑体腔。 定位光学传感器以感测空腔中的发射光用于高温测量。 空腔的有效发射率与简化温度计算的半导体衬底材料无关,达到单位。 屏蔽可用于防止不希望的背面沉积。 可以使用多个传感器来检测穿过基底的温差,并且可以调节加热器以提高温度均匀性。
    • 7. 发明授权
    • System and method for thermal processing of a semiconductor substrate
    • 半导体衬底的热处理系统和方法
    • US06399921B1
    • 2002-06-04
    • US09490741
    • 2000-01-25
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • A21B100
    • C23C16/4411C23C16/46C23C16/466C30B25/10C30B31/12H01L21/67109H01L21/687
    • A semiconductor substrate processing system and method using a stable heating source with a large thermal mass relative to conventional lamp heated systems. The system dimensions and processing parameters are selected to provide a substantial heat flux to the wafer while minimizing heat loss to the surrounding environment (particularly from the edges of the heat source and wafer). The heat source provides a wafer temperature uniformity profile that has a low variance across temperature ranges at low pressures. A resistively heated block is substantially enclosed within an insulated vacuum cavity used to heat the wafer. Insulating walls comprising a reflective material, such as polished tungsten, encapsulated within an inert insulating material such as quartz, may be used to provide insulation. The isothermal nature of the processing region may be enhanced by using multiple layers of insulating walls, actively heated insulating walls or a conductive gas to enhance heat transfer to the semiconductor substrate. A semiconductor substrate may be heated and cooled in stages in the processing system to avoid slip. Proximity, conductive gases and cooling gases may be used to increase or decrease the level of heating in stages.
    • 相对于传统的灯加热系统,使用具有大热质量的稳定的热源的半导体衬底处理系统和方法。 选择系统尺寸和处理参数以向晶片提供实质的热通量,同时最小化对周围环境(特别是从热源和晶片的边缘)的热损失。 热源提供晶片温度均匀性分布,在低压下在温度范围内具有低的方差。 电阻加热块基本封闭在用于加热晶片的绝缘真空腔内。 可以使用包含诸如抛光的钨的反射材料的绝缘壁,其包封在诸如石英的惰性绝缘材料内,以提供绝缘。 可以通过使用多层绝缘壁,主动加热的绝缘壁或导电气体来增强对半导体衬底的热传递来增强处理区域的等温性质。 半导体衬底可以在处理系统中分阶段加热和冷却以避免滑动。 靠近,导电气体和冷却气体可用于逐级增加或降低加热水平。
    • 9. 发明授权
    • System and method for thermal processing of a semiconductor substrate
    • 半导体衬底的热处理系统和方法
    • US06172337B2
    • 2001-01-09
    • US09349523
    • 1999-07-08
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • C23C1600
    • C23C16/4411C23C16/46C23C16/466C30B25/10C30B31/12
    • A semiconductor substrate processing system and method using a stable heating source with a large thermal mass relative to conventional lamp heated systems. The system dimensions and processing parameters are selected to provide a substantial heat flux to the wafer while minimizing heat loss to the surrounding environment (particularly from the edges of the heat source and wafer). The heat source provides a wafer temperature uniformity profile that has a low variance across temperature ranges at low pressures. A resistively heated block is substantially enclosed within an insulated vacuum cavity used to heat the wafer. A vacuum region is preferably provided between the heated block and the insulating material as well as between the insulating material and the chamber wall. Heat transfer across the vacuum regions is primarily achieved by radiation, while heat transfer through the insulating material is achieved by conduction. The wafer is placed on or near the heated block within the vacuum cavity for heating by conduction and radiation. The rate of heating may be controlled by varying pressure across a range of very low pressures.
    • 相对于传统的灯加热系统,使用具有大热质量的稳定的热源的半导体衬底处理系统和方法。 选择系统尺寸和处理参数以向晶片提供实质的热通量,同时最小化对周围环境(特别是从热源和晶片的边缘)的热损失。 热源提供晶片温度均匀性分布,在低压下在温度范围内具有低的方差。 电阻加热块基本封闭在用于加热晶片的绝缘真空腔内。 优选地,在加热块和绝缘材料之间以及绝缘材料和室壁之间设置真空区域。 通过真空区域的热传递主要通过辐射来实现,而通过绝缘材料的传热通过传导实现。 将晶片放置在真空腔内的加热块上或附近,以通过传导和辐射进行加热。 加热速率可以通过在非常低的压力范围内变化的压力来控制。
    • 10. 发明授权
    • System and method for thermal processing of a semiconductor substrate
    • 半导体衬底的热处理系统和方法
    • US6046439A
    • 2000-04-04
    • US876788
    • 1997-06-16
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • Kristian E. JohnsgardBrad S. MattsonJames McDiarmidVladimir J. Zeitlin
    • C23C16/46C30B25/10C30B31/12H01L21/00H01L21/687H05B3/68
    • C23C16/4411C23C16/46C23C16/466C30B25/10C30B31/12H01L21/67109H01L21/687
    • A semiconductor substrate processing system and method using a stable heating source with a large thermal mass relative to conventional lamp heated systems. The system dimensions and processing parameters are selected to provide a substantial heat flux to the wafer while minimizing heat loss to the surrounding environment (particularly from the edges of the heat source and wafer). The heat source provides a wafer temperature uniformity profile that has a low variance across temperature ranges at low pressures. A resistively heated block is substantially enclosed within an insulated vacuum cavity used to heat the wafer. Insulating walls comprising a reflective material, such as polished tungsten, encapsulated within an inert insulating material, such as quartz, may be used to provide insulation. The isothermal nature of the processing region may be enhanced by using multiple layers of insulating walls, actively heated insulating walls or a conductive gas to enhance heat transfer to the semiconductor substrate. A semiconductor substrate may be heated and cooled in stages in the processing system to avoid slip. Proximity, conductive gases and cooling gases may be used to increase or decrease the level of heating in stages.
    • 相对于传统的灯加热系统,使用具有大热质量的稳定的热源的半导体衬底处理系统和方法。 选择系统尺寸和处理参数以向晶片提供实质的热通量,同时最小化对周围环境(特别是从热源和晶片的边缘)的热损失。 热源提供晶片温度均匀性分布,在低压下在温度范围内具有低的方差。 电阻加热块基本封闭在用于加热晶片的绝缘真空腔内。 可以使用包含诸如石英在惰性绝缘材料中的反射材料(例如抛光的钨)的绝缘壁来提供绝缘。 可以通过使用多层绝缘壁,主动加热的绝缘壁或导电气体来增强对半导体衬底的热传递来增强处理区域的等温性质。 半导体衬底可以在处理系统中分阶段加热和冷却以避免滑动。 靠近,导电气体和冷却气体可用于逐级增加或降低加热水平。