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    • 1. 发明申请
    • Touch Screen Control Panel Interface
    • 触摸屏控制面板界面
    • US20160306482A1
    • 2016-10-20
    • US14686189
    • 2015-04-14
    • Hollis J. GmyrWeidong PanJames H. RitchieEric Christopher WoodAndrew S. Kadah
    • Hollis J. GmyrWeidong PanJames H. RitchieEric Christopher WoodAndrew S. Kadah
    • G06F3/041G09G3/36G06F3/044
    • G09G3/36G05D23/19G06F1/3265G09G3/3406G09G3/3413G09G2330/02H03K17/9622H03K2217/94052H03K2217/960755H03K2217/96076H03K2217/960785Y02D10/153Y02D50/20
    • A touch-screen control panel interface has a dielectric flat or curved front panel and a printed circuit board with a front side and a reverse side which is the component side. Alphanumeric display module(s) or an LCD display and optional protective cap mounted on the reverse side of the circuit board are visible through window cutout(s) on the board. An array of LED indicators can be mounted on the back side of the circuit board and visible through cutouts in the board. Metallized capacitive pads on or adjacent the back side of the front panel at touch locations permit selection of various modes, functions, and settings. These pads may be formed on the flat front side of the circuit board, on the back of the front plate, or on an intermediate membrane. A microprocessor is connected with the various components and with capacitive pad. Icons may be printed onto the flat panel, in registry with the metallized capacitive electrode pads. A potting dam is formed of a back plate configured to adhere to the front panel and an open frame extending rearwards. Synthetic resin potting material fills the frame and hermetically seals the circuit board. Positions of the capacitive touch pads can be illuminated when active, as a guide for the user or operator. A second circuit board may be positioned in the frame directly proximal of the first circuit board, and optionally encapsulated.
    • 触摸屏控制面板接口具有电介质平坦或弯曲的前面板和作为组件侧的正面和反面的印刷电路板。 通过电路板上的窗口切口可以看到安装在电路板背面的字母数字显示模块或LCD显示屏和可选的保护盖。 一组LED指示灯可以安装在电路板的背面,可以通过板上的切口看到。 在接触位置的前面板背面或相邻的金属化电容焊盘允许选择各种模式,功能和设置。 这些焊盘可以形成在电路板的平坦前侧,前板的背面或中间膜上。 微处理器与各种组件和电容式接头连接。 图标可以打印在平板上,与金属化的电容电极垫对齐。 灌封坝由配置成粘附到前面板的背板和向后延伸的开放框架形成。 合成树脂灌封材料填充框架并密封电路板。 电容触摸板的位置可以在激活时亮起,作为用户或操作者的指南。 第二电路板可以定位在第一电路板的直接近侧的框架中,并且可选地封装。