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1. 发明授权

US09974172B2 Epoxy resin compound and radiant heat circuit board using the same 有权
公开(公告)号：US09974172B2
公开(公告)日：2018-05-15
申请号：US14241961
申请日：2012-08-30
申请人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
发明人： Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
IPC分类号： H05K1/05 , B32B27/38 , C08L63/00 , C09J163/00 , C08K3/22 , C08G59/22 , C08G59/24 , C08G59/38 , C08L63/04 , C09K5/14
CPC分类号： H05K1/056 , C08G59/226 , C08G59/245 , C08G59/38 , C08K3/013 , C08L63/00 , C08L63/04 , C09K5/14 , C08K3/0033
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

2. 发明授权

US09549458B2 Radiant heat circuit board, heat generating device package having the same, and backlight unit 有权
标题翻译：辐射热电路板，具有相同的发热装置封装和背光单元
公开(公告)号：US09549458B2
公开(公告)日：2017-01-17
申请号：US13878319
申请日：2011-10-05
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K1/02 , H01L25/075 , H05K1/05 , H01L23/367 , H01L23/498 , H01L33/64
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供一种用于安装多个发热装置的辐射热电路板。辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。因此，可以在发热装置之间设置辐射突起以改善热辐射。

3. 发明授权

US09357630B2 Epoxy resin compound and radiant heat circuit board using the same 有权
标题翻译：环氧树脂复合物和使用其的辐射热电路板
公开(公告)号：US09357630B2
公开(公告)日：2016-05-31
申请号：US14235692
申请日：2012-07-27
申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
发明人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
IPC分类号： C08G59/18 , C08G59/20 , C08G59/50 , C08L63/00 , H05K1/05 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0201 , C08G59/184 , C08K3/22 , C08K2003/2227 , C08L63/00 , H01L23/142 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H01L2924/00
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译：公开了一种环氧树脂化合物和使用其的辐射热电路板。环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。

4. 发明申请

US20130188359A1 RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 有权
标题翻译：辐射热电路板，其制造方法，具有该发光装置的发热装置包和背光
公开(公告)号：US20130188359A1
公开(公告)日：2013-07-25
申请号：US13878637
申请日：2011-10-10
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K7/20 , H05K13/00 , H05K3/30 , F21V29/00
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译：提供一种用于安装多个发热装置的辐射热电路板。辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。因此，可以在发热装置之间设置辐射突起以改善热辐射。

5. 发明申请

US20130118782A1 RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：辐射热电路板及其制造方法
公开(公告)号：US20130118782A1
公开(公告)日：2013-05-16
申请号：US13811365
申请日：2011-07-15
申请人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
发明人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
IPC分类号： H05K1/18 , H05K1/03 , H05K1/09
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
摘要翻译：公开了一种辐射热电路板及其制造方法。用于在其上安装发热装置的辐射热电路板包括金属板，该金属板包括金属突起，该金属突起具有焊料，发光装置附着到该金属突起上，金属突起上的接合层，金属板以暴露金属突起，以及绝缘层上的电路图案。通过在安装垫下方设置包括散热突起的金属板，将从发热装置发出的热量直接传递到金属板，从而提高散热效率。热辐射突起的表面镀有包含铜的合金，从而提高相对于焊料的粘合性，从而降低了故障率。

6. 发明申请

US20130002388A1 MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20130002388A1
公开(公告)日：2013-01-03
申请号：US13292803
申请日：2011-11-09
申请人： Jong Han KIM , Jae Man Park , Hyun Chul Jeong
发明人： Jong Han KIM , Jae Man Park , Hyun Chul Jeong
IPC分类号： H01F5/00 , B05D5/12 , H01G4/12
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12
摘要： There is provided a multilayered ceramic electronic component capable of securing capacitance by controlling electrode connectivity. The multilayered ceramic electronic component includes: a ceramic main body; and internal electrodes formed in the interior of the ceramic main body and having a central portion and a tapered portion becoming thinner from the central portion toward edges thereof, respectively, wherein the ratio of the area of the tapered portion to the overall area of the internal electrodes is 35% or less. A desired capacitance can be obtained by controlling an electrode connectivity even in the small high capacitance multilayered ceramic capacitor.
摘要翻译：提供了一种能够通过控制电极连接来确保电容的多层陶瓷电子部件。多层陶瓷电子部件包括：陶瓷主体; 以及形成在陶瓷主体内部并具有中心部分和锥形部分的内部电极分别从其中心部分朝向其边缘变薄，其中锥形部分的面积与内部的总面积的比率电极为35％以下。通过控制即使在小的高电容多层陶瓷电容器中的电极连接也可以获得所需的电容。

7. 发明授权

US08941973B2 Multilayer ceramic electronic component and method of manufacturing the same 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08941973B2
公开(公告)日：2015-01-27
申请号：US13620559
申请日：2012-09-14
申请人： Jong Han Kim , Jae Man Park
发明人： Jong Han Kim , Jae Man Park
IPC分类号： H01G4/005 , H01G7/00
CPC分类号： H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/30 , Y10T29/43
摘要： There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied.
摘要翻译：提供了一种多层陶瓷电子部件及其制造方法，所述多层陶瓷电子部件包括：包含电介质层的陶瓷体; 多个内部电极彼此面对，介电层插入其间; 电连接到内部电极的外部电极，其中内部电极的厚度t 1满足0.1μm＆lt; NE; Te＆NlE;0.5μm，并且当在长度和厚度方向上取下的陶瓷体的截面中，在陶瓷体的宽度方向上的距离最接近内部电极的断开部分的内部电极纹理的中心部分的长度方向的距离为Tc，长度方向上的距离，的内部电极颗粒在其中心部分的上方或下方的厚度的25％的点处表示为T1，0.7＆nlE; T1 / Tc＆lt; N1; 1.3。

8. 发明申请

US20140290996A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME 审中-公开
标题翻译：环氧树脂化合物和使用它的辐射热电路板
公开(公告)号：US20140290996A1
公开(公告)日：2014-10-02
申请号：US14232489
申请日：2012-07-12
申请人： Sung Bae Moon , Hae Yeon Kim , Jae Man Park , Jong Heum Yoon , In Hee Cho
发明人： Sung Bae Moon , Hae Yeon Kim , Jae Man Park , Jong Heum Yoon , In Hee Cho
IPC分类号： H05K1/03 , H05K1/05 , H05K1/02
CPC分类号： H05K1/0373 , C08K3/22 , C08K3/28 , C08K3/36 , C08K3/38 , C08L21/00 , C08L63/00 , H05K1/0203 , H05K1/0346 , H05K1/056
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译：公开了一种环氧树脂化合物和使用其的辐射热电路板。环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。环氧树脂包括结晶环氧树脂和将无机填料分散到环氧树脂中的橡胶添加剂。在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。

9. 发明申请

US20130321976A1 NICKEL NANOPARTICLE, METHOD OF PREPARING THE SAME, AND MULTILAYER CERAMIC CAPACITOR USING THE SAME 有权
标题翻译：镍基纳米粒子，其制备方法和使用其的多层陶瓷电容器
公开(公告)号：US20130321976A1
公开(公告)日：2013-12-05
申请号：US13585024
申请日：2012-08-14
申请人： Ro Woon LEE , Jae Man PARK , Sung Koo KANG , Yoon Hee LEE , Young Ho KIM
发明人： Ro Woon LEE , Jae Man PARK , Sung Koo KANG , Yoon Hee LEE , Young Ho KIM
IPC分类号： H01B1/08 , H01G4/30 , B32B5/16 , B82Y30/00 , B82Y40/00
CPC分类号： H01G4/008 , Y10T428/2982
摘要： There is provided a method of preparing a nickel nanoparticle, the method including: forming an aqueous solution by mixing water and a solution containing a hydroxyl group; forming a mixed liquid by adding carboxylic acid to the aqueous solution at a ratio of 10 to 20 wt % with regard to the solution containing a hydroxyl group; and adding a nickel salt to the mixed liquid and stirring the mixed liquid.
摘要翻译：提供了制备镍纳米颗粒的方法，所述方法包括：通过混合水和含有羟基的溶液形成水溶液; 相对于含有羟基的溶液，以10〜20重量％的比例，向该水溶液中添加羧酸，形成混合液; 并向混合液中加入镍盐并搅拌混合液。

10. 发明申请

US20130286538A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20130286538A1
公开(公告)日：2013-10-31
申请号：US13620559
申请日：2012-09-14
申请人： Jong Han KIM , Jae Man Park
发明人： Jong Han KIM , Jae Man Park
IPC分类号： H01G4/012 , H01G4/008
CPC分类号： H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/30 , Y10T29/43
摘要： There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied.
摘要翻译：提供了一种多层陶瓷电子部件及其制造方法，所述多层陶瓷电子部件包括：包含电介质层的陶瓷体; 多个内部电极彼此面对，介电层插入其间; 以及与内部电极电连接的外部电极，其中，内部电极的厚度t 1满足0.1μm@Te≤0.5μm，并且当在陶瓷体的长度和厚度方向的截面中切断中心在陶瓷体的宽度方向上的距离最接近内部电极的断开部分的内部电极纹理的中心部分的长度方向的距离为Tc，长度方向上的距离，的内部电极颗粒在等于其中心部分上方或下方的厚度的25％的点处由T1表示，满足0.7≤Tl/ Tc @ 1.3。

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