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1. 发明申请

US20110221461A1 METHOD FOR TESTING ELECTRONIC COMPONENTS OF A REPETITIVE PATTERN UNDER DEFINED THERMAL CONDITIONS 有权
标题翻译：根据定义的热条件测试重复图案的电子元件的方法
公开(公告)号：US20110221461A1
公开(公告)日：2011-09-15
申请号：US13119916
申请日：2009-09-01
申请人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
发明人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
IPC分类号： G01R31/00
CPC分类号： G01R31/319 , G01R1/07392 , G01R31/2891
摘要： The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.
摘要翻译：本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件（1）的方法，其包括用于保持部件（1）的卡盘（10）和用于保持个人的特殊保持装置（15）探针（12）。为了测试，组件（1）被调节到限定的温度，（12）和第一电子部件（1）通过至少一个定位装置相对于彼此定位，电子的接触垫（3）组件（1）随后被探针（12）接触，使得可以测试组件（1），然后重复定位和接触以测试重复图案的另一组件（1）。为了缩短在变化的温度下进行测量的测试时间，同时通过使用单个探针确保部件的可靠接触，组件（1）通过第一定位步骤定位和接触，第一定位步骤共同影响首先执行的所有探头（12）在中间位置，其结果是部件（1）位于探针尖端（13）下方的限定距离处，每个单独的探针尖端（13）的位置随后通过单独的操纵器被校正到相应的接触垫（3）与特定探针尖端（13）接触，使得每个探针尖端（13）位于接触垫（3）上方，并且探针尖端（13）进一步随后与通过前进运动，组件（1）的接触垫（3）。

2. 发明授权

US07659743B2 Method and apparatus for testing electronic components within horizontal and vertical boundary lines of a wafer 失效
标题翻译：用于测试晶片的水平和垂直边界线内的电子部件的方法和装置
公开(公告)号：US07659743B2
公开(公告)日：2010-02-09
申请号：US11947206
申请日：2007-11-29
申请人： Stojan Kanev , Jörg Kiesewetter
发明人： Stojan Kanev , Jörg Kiesewetter
IPC分类号： G01R31/02
CPC分类号： G01R31/2887
摘要： A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90° relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.
摘要翻译：提供了一种方法和装置，其使得当测试布置在晶片上的芯片时能够可选地测试布置在水平边界线上和垂直边界线上的两个附加组件。布置在水平边界线上的附加部件在晶片的第一位置被测试。为了测试布置在垂直边界线上的附加组件，晶片围绕其垂直轴线相对于第一位置旋转90°进入第二位置。该装置包括壳体，并且在壳体中，用于与电子部件接触的至少一个测试探针，用于移动晶片的卡盘和可操作地连接到卡盘的可旋转地安装的附加板。

3. 发明授权

US08368413B2 Method for testing electronic components of a repetitive pattern under defined thermal conditions 有权
标题翻译：在确定的热条件下测试重复图案的电子部件的方法
公开(公告)号：US08368413B2
公开(公告)日：2013-02-05
申请号：US13119916
申请日：2009-09-01
申请人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
发明人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
IPC分类号： G01R31/00
CPC分类号： G01R31/319 , G01R1/07392 , G01R31/2891
摘要： The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the probes (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.
摘要翻译：本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件（1）的方法，其包括用于保持部件（1）的卡盘（10）和用于保持个人的特殊保持装置（15）探针（12）。为了测试，将组件（1）调节到限定的温度，探针（12）和第一电子部件（1）通过至少一个定位装置相对于彼此定位，所述接触垫（3）电子部件（1）随后被探针（12）接触，使得可以测试部件（1），然后可以重复定位和接触以测试重复图案的另一部件（1）。为了缩短在变化的温度下进行测量的测试时间，同时通过使用单个探针确保部件的可靠接触，组件（1）通过第一定位步骤定位和接触，第一定位步骤共同影响首先执行的所有探头（12）在中间位置，其结果是部件（1）位于探针尖端（13）下方的限定距离处，每个单独的探针尖端（13）的位置随后通过单独的操纵器被校正到相应的接触垫（3）与特定探针尖端（13）接触，使得每个探针尖端（13）位于接触垫（3）上方，并且探针尖端（13）进一步随后与通过前进运动，组件（1）的接触垫（3）。

4. 发明授权

US07057408B2 Method and prober for contacting a contact area with a contact tip 有权
标题翻译：用于将接触区域与接触尖端接触的方法和探测器
公开(公告)号：US07057408B2
公开(公告)日：2006-06-06
申请号：US10879622
申请日：2004-06-29
申请人： Stefan Schneidewind , Claus Dietrich , Jörg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jürgen Fleischer
发明人： Stefan Schneidewind , Claus Dietrich , Jörg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jürgen Fleischer
IPC分类号： G01R31/02
CPC分类号： G01R31/2886
摘要： A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
摘要翻译：接触区域与探针中的接触针尖（接触尖端）接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的接触小尺寸接触垫时的接触面和接触面积。探测器基本上包括具有移动装置的基架，该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。接触尖端的接触最初需要半导体晶片的水平定位，使得接触面和接触尖端彼此之间并且彼此间隔一定距离，随后沿接触尖端的方向垂直移动，直到接触尖端与接触区域的接触被建立。该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的，为此目的，观察装置以这样的方式布置，使得观察轴以间隔在自由晶片表面上方。

5. 发明授权

US08240650B2 Chuck with triaxial construction 有权
标题翻译：夹头三轴结构
公开(公告)号：US08240650B2
公开(公告)日：2012-08-14
申请号：US12048323
申请日：2008-03-14
申请人： Michael Teich , Karsten Stoll , Axel Schmidt , Stojan Kanev , Jörg Kiesewetter
发明人： Michael Teich , Karsten Stoll , Axel Schmidt , Stojan Kanev , Jörg Kiesewetter
IPC分类号： B25B1/00 , B23Q3/00 , G01R31/20 , F28F7/00 , B23B31/30 , B23B31/12
CPC分类号： G01R1/04 , G01R31/2865 , H01L21/68714 , H01L21/68757 , Y10T279/11 , Y10T279/18
摘要： A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element. A chuck for very low current measurements which can be used to prevent the occurrence of leakage currents and a triboelectric charge and which is configured favourably in terms of production, is achieved because at least one of the electrically conductive surface elements is mechanically connected to at least one insulation element and has an elasticity that compensates for an expansion difference resulting from differences in different coefficients of expansion between a respective surface element and an adjoining insulation element.
摘要翻译：具有三轴结构的卡盘包括用于测试基板的接收表面并且布置在接收表面下方：导电的第一表面元件，与其电绝缘的导电的第二表面元件和与其电绝缘的导电的第三表面元件，在第一和第二表面元件之间，第一绝缘元件和第二和第三表面元件之间的第二绝缘元件。实现了用于非常低的电流测量的卡盘，其可用于防止泄漏电流和摩擦电荷的发生，并且在生产方面被有利地配置，这是因为至少一个导电表面元件至少机械地连接到一个绝缘元件并且具有补偿由相应的表面元件和相邻绝缘元件之间的不同膨胀系数的差异引起的膨胀差的弹性。

6. 发明授权

US07579854B2 Probe station and method for measurements of semiconductor devices under defined atmosphere 有权
标题翻译：探测台和测量在确定的气氛下的半导体器件的方法
公开(公告)号：US07579854B2
公开(公告)日：2009-08-25
申请号：US11943975
申请日：2007-11-21
申请人： Jörg Kiesewetter , Stefan Kreissig , Stojan Kanev , Claus Dietrich
发明人： Jörg Kiesewetter , Stefan Kreissig , Stojan Kanev , Claus Dietrich
IPC分类号： G01R31/02
CPC分类号： G01R31/2881
摘要： A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.
摘要翻译：描述了适用于在大气条件下偏离环境条件的半导体衬底的测试的探测器。探测器包括用于安装半导体衬底的卡盘和用于安装用于半导体衬底的电接触的测试尖端的探针保持器。半导体衬底和测试尖端布置在相对于周围大气密封的壳体内。壳体包括与密封件连接的两个壳体部件。密封件可以用两种不同的压力充气，并且在较高压力下可变形较小。为了测试半导体衬底，半导体衬底相对于测试尖端的粗略定位发生在大气条件下，然后在密封件的较高压力下产生密封件的较低可变形性之前用密封壳体和可变形密封件进行精细定位，半导体衬底被测试头接触并进行测试。

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