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    • 1. 发明授权
    • High modulus, low dielectric constant coatings
    • 高模量,低介电常数涂层
    • US06576300B1
    • 2003-06-10
    • US09528835
    • 2000-03-20
    • Ivan Louis Berry, IIIKyuha ChungQingyuan HanYoufan LiuEric Scott MoyerMichael John Spaulding
    • Ivan Louis Berry, IIIKyuha ChungQingyuan HanYoufan LiuEric Scott MoyerMichael John Spaulding
    • C08J718
    • H01L21/3122C01B33/126H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02337H01L21/0234H01L21/31695Y10T428/31663
    • Low dielectric constant films with improved elastic modulus. The method of making such coatings involves providing a porous network coating produced from a resin containing at least 2 Si—H groups where the coating has been thermally cured and has a dielectric constant in the range of from about 1.1 to about 3.5, and plasma treating the coating to convert the coating into porous silica. Plasma treatment of the network coating yields a coating with improved modulus, but with a higher dielectric constant. The coating is plasma treated for between about 15 and 120 seconds at a temperature less than or about 350° C. The plasma treated coating can optionally be annealed. Rapid thermal processing (RTP) of the plasma treated coating reduces the dielectric constant of the coating while maintaining an improved elastic modulus as compared to the initial porous coating. The annealing temperature is preferably in excess of or about 350° C., and the annealing time is preferably at least or about 120 seconds. The annealed, plasma treated coating has a dielectric constant in the range of from about 1.1 to about 2.4 and an improved elastic modulus.
    • 具有改善的弹性模量的低介电常数膜。 制备这种涂层的方法包括提供由包含至少2个Si-H基团的树脂制备的多孔网络涂层,其中涂层已经被热固化并且介电常数在约1.1至约3.5的范围内,等离子体处理 将涂层转化成多孔二氧化硅的涂层。 网络涂层的等离子体处理产生具有改进模量但具有较高介电常数的涂层。 该涂层在低于或约350℃的温度下等离子体处理约15至120秒。等离子体处理的涂层可任选地退火。 与初始多孔涂层相比,等离子体处理的涂层的快速热处理(RTP)降低了涂层的介电常数,同时保持了改进的弹性模量。 退火温度优选超过或约350℃,退火时间优选为至少或约120秒。 退火的等离子体处理的涂层的介电常数在约1.1至约2.4的范围内,并具有改进的弹性模量。
    • 2. 发明授权
    • High modulus, low dielectric constant coatings
    • 高模量,低介电常数涂层
    • US06759133B2
    • 2004-07-06
    • US10413034
    • 2003-04-14
    • Ivan Louis Berry, IIIKyuha ChungQingyuan HanYoufan LiuEric Scott MoyerMichael John Spaulding
    • Ivan Louis Berry, IIIKyuha ChungQingyuan HanYoufan LiuEric Scott MoyerMichael John Spaulding
    • B32B900
    • H01L21/3122C01B33/126H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02337H01L21/0234H01L21/31695Y10T428/31663
    • Low dielectric constant films with improved elastic modulus. An SiO2-containing plasma treated coating is provided, the coating being formed by providing a porous network coating produced from a resin molecule containing at least 2 Si—H groups, curing the porous network coating by heating to a temperature sufficient to convert the porous network coating into a ceramic, and plasma treating the porous network coating to reduce an amount of Si—H bonds. Plasma treating the porous network coating provides a coating with improved modulus, but with a higher dielectric constant. Accordingly, the plasma treated coating can be annealed to provide an annealed, plasma treated coating having a lower dielectric constant and a comparable elastic modulus. The annealed, SiO2-containing plasma treated coating can have a dielectric constant between about 1.1 and about 3.5, and an elastic modulus greater than or about 4 GPa. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72(b).
    • 具有改善的弹性模量的低介电常数膜。 提供含SiO 2等离子体处理的涂层,通过提供由含有至少2个Si-H基团的树脂分子产生的多孔网络涂层形成涂层,通过加热至足以将多孔网络 涂覆到陶瓷中,并且等离子体处理多孔网络涂层以减少Si-H键的量。 处理多孔网络涂层的等离子体处理提供了具有改进模量但具有较高介电常数的涂层。 因此,等离子体处理的涂层可以退火以提供具有较低介电常数和可比的弹性模量的退火等离子体处理的涂层。 退火的含SiO 2的等离子体处理的涂层的介电常数可以在约1.1至约3.5之间,弹性模量大于或约4GPa。 要强调的是,该摘要被提供以符合要求摘要的规则,这将允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。 37 CFR§1.72(b)。