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1. 发明授权

US09442325B2 Liquid crystal display device and method of manufacturing the same 有权
标题翻译：液晶显示装置及其制造方法
公开(公告)号：US09442325B2
公开(公告)日：2016-09-13
申请号：US13794623
申请日：2013-03-11
申请人： Isao Nojiri , Toshiro Taniguchi
发明人： Isao Nojiri , Toshiro Taniguchi
IPC分类号： G02F1/1341 , G02F1/1339
CPC分类号： G02F1/1339 , G02F1/1341
摘要： The present invention includes liquid crystal held between an array substrate including a display area and a color filter substrate, a seal material pasting the both substrates together outside in plan view of the display area, and column spacers between the both substrates. The seal material includes a seal periphery surrounding the display area, and seal extending portions forming an injection port of the liquid crystal by extending the seal periphery outside in plan view of the display area from both end of a partial opening. The seal periphery includes no spacer therein, and the seal extending portions include spacers therein.
摘要翻译：本发明包括保持在包括显示区域的阵列基板和滤色器基板之间的液晶，在显示区域的平面图中将两个基板粘合在一起的密封材料和两个基板之间的柱间隔件。密封材料包括围绕显示区域的密封周边，以及通过在部分开口的两端的显示区域的平面图中将密封周边外延伸而形成液晶的注入口的密封延伸部分。密封周边不包括间隔件，密封件延伸部分包括间隔件。

2. 发明授权

US09392644B2 Energization heating device and method 有权
标题翻译：通电加热装置及方法
公开(公告)号：US09392644B2
公开(公告)日：2016-07-12
申请号：US14129662
申请日：2011-07-19
申请人： Isao Nojiri , Shinji Ishii
发明人： Isao Nojiri , Shinji Ishii
IPC分类号： H05B3/02 , B21D37/16 , C21D1/40 , H05B3/03 , C21D7/13 , C21D8/00 , H05B3/00
CPC分类号： H05B3/023 , B21D37/16 , C21D1/40 , C21D7/13 , C21D2261/00 , H05B3/0004 , H05B3/03
摘要： An electrically heating device is provided with a pair of clamp units serving as electrodes for energization and applying tension to a workpiece to be heated clamped between the clamp units by moving the clamp units in the direction in which the clamp units separate from each other during energization heating. The clamp units each include a facing surface inclined with respect to the moving direction of the clamp units and form, by the facing surface, a preform including an inclined surface inclined with respect to the plane direction of the workpiece in a clamping portion clamped between the clamp units in the workpiece.
摘要翻译：电加热装置设置有一对夹持单元，用作通电的电极，并且通过在通电期间夹紧单元彼此分离的方向移动夹持单元，向被夹持在夹具单元之间的待加热工件施加张力加热。所述夹紧单元各自包括相对于所述夹紧单元的移动方向倾斜的面对表面，并且由所述面对表面形成预制件，所述预制件包括相对于所述工件的平面方向倾斜的倾斜表面，夹紧单元在工件上。

3. 发明申请

US20140069163A1 HOT-PRESSING DIE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：热压成型机及其制造方法
公开(公告)号：US20140069163A1
公开(公告)日：2014-03-13
申请号：US14117776
申请日：2011-05-16
申请人： Isao Nojiri , Shinji Ishii
发明人： Isao Nojiri , Shinji Ishii
IPC分类号： B21D22/02 , B21D37/20
CPC分类号： B21D22/022 , B21D37/16 , B21D37/20 , B21J1/06 , C21D1/673
摘要： A hot-pressing die and a method for manufacturing the hot-pressing die are disclosed. The die which presses and cools a heated workpiece at the same time to form a product with a hat-shape includes a lower die and an upper die. The lower die has a protrusion which protrudes from the forming surface thereof, and the upper die has a recess corresponding to the protrusion. The lower die is modified into a modified lower die by forming, on the forming surface of the protruding end of the protrusion, a buildup part with a convex shape to gradually change in position in the protruding direction of the protrusion toward the middle thereof.
摘要翻译：公开了一种热压模及其制造方法。同时挤压和加热加热的工件以形成具有帽子形状的产品的模具包括下模和上模。下模具有从其成形表面突出的突起，并且上模具有与突起相对应的凹部。下模通过在突起的突出端的成形表面上形成具有凸形的积聚部分，在突起的突出方向上朝向其中间逐渐变化的位置，将下模改造成修改的下模。

4. 发明申请

US20130291614A1 MOLD FOR PRESS FORMING 有权
标题翻译：模压成型
公开(公告)号：US20130291614A1
公开(公告)日：2013-11-07
申请号：US13879632
申请日：2011-01-28
申请人： Naoki Ichijo , Yoshiya Sato , Isao Nojiri
发明人： Naoki Ichijo , Yoshiya Sato , Isao Nojiri
IPC分类号： B21D22/02
CPC分类号： B21D22/02 , B21D37/10 , B21D37/20 , B30B15/02
摘要： A lightweight mold for press forming is presented. Molds are characterized in that design forming portions thereof, these design forming portions making contact with a workpiece at the time of press forming and thereby forming a target design on the workpiece, are constructed of rod shaped members (design forming rods). By having the design forming portions be constructed of rod shaped members, the weight of the mold is reduced. It is preferred that the molds are further provided with supporting rods which support the design forming rods, these rod members constituting a framework structure.
摘要翻译：提出了一种用于冲压成型的轻质模具。模具的特征在于，其设计形成部分，这些在压制成型时与工件接触并由此在工件上形成目标设计的设计形成部分由杆形构件（设计成型杆）构成。通过使设计形成部分由棒状构件构成，模具的重量减小。优选地，模具还设置有支撑杆，支撑杆支撑设计形成杆，这些杆构件构成框架结构。

5. 发明授权

US08462285B2 Scanning line driving circuit for active matrix and image display device 有权
标题翻译：扫描线驱动电路用于有源矩阵和图像显示装置
公开(公告)号：US08462285B2
公开(公告)日：2013-06-11
申请号：US12342215
申请日：2008-12-23
申请人： Isao Nojiri , Hiroyuki Murai , Takashi Miyayama
发明人： Isao Nojiri , Hiroyuki Murai , Takashi Miyayama
IPC分类号： G02F1/136
CPC分类号： G02F1/13454
摘要： A first contact hole formed in a gate driving circuit is covered with an electrically conductive oxide film formed to be connected to the first contact hole and having a first pattern. The periphery of the electrically conductive oxide film is surrounded by an electrically conductive oxide film (a sacrifice electrode) formed simultaneously with the electrically conductive oxide film and having a second pattern form.
摘要翻译：形成在栅极驱动电路中的第一接触孔被形成为连接到第一接触孔并具有第一图案的导电氧化物膜覆盖。导电氧化物膜的周围由与导电氧化物膜同时形成并具有第二图案形式的导电氧化物膜（牺牲电极）包围。

6. 发明授权

US08314912B2 Liquid crystal display device 有权
标题翻译：液晶显示装置
公开(公告)号：US08314912B2
公开(公告)日：2012-11-20
申请号：US12777541
申请日：2010-05-11
申请人： Isao Nojiri , Yasuo Fujita , Hiroyuki Murai
发明人： Isao Nojiri , Yasuo Fujita , Hiroyuki Murai
IPC分类号： G02F1/1343
CPC分类号： G02F1/133512 , G02F1/13454 , G09G3/3674 , G09G2310/0286
摘要： Provided is a liquid crystal display device including contact hole parts in a gate line driving circuit, and light shielding layers formed of a metal material on a color filter substrate, where an insulating film is formed so as to cover the light shielding layer of the color filter substrate in a region on the array substrate, the area being opposed to the contact hole parts.
摘要翻译：提供一种液晶显示装置，其包括栅极线驱动电路中的接触孔部分和由滤色器基板上的金属材料形成的遮光层，其中形成绝缘膜以覆盖颜色的遮光层在阵列基板上的区域中的过滤器基板，该区域与接触孔部分相对。

7. 发明申请

US20090174695A1 SCANNING LINE DRIVING CIRCUIT FOR ACTIVE MATRIX AND IMAGE DISPLAY DEVICE 有权
标题翻译：用于主动矩阵和图像显示装置的扫描线驱动电路
公开(公告)号：US20090174695A1
公开(公告)日：2009-07-09
申请号：US12342215
申请日：2008-12-23
申请人： Isao Nojiri , Hiroyuki Murai , Takashi Miyayama
发明人： Isao Nojiri , Hiroyuki Murai , Takashi Miyayama
IPC分类号： G09G5/00
CPC分类号： G02F1/13454
摘要： A first contact hole formed in a gate driving circuit is covered with an electrically conductive oxide film formed to be connected to the first contact hole and having a first pattern. The periphery of the electrically conductive oxide film is surrounded by an electrically conductive oxide film (a sacrifice electrode) formed simultaneously with the electrically conductive oxide film and having a second pattern form.
摘要翻译：形成在栅极驱动电路中的第一接触孔被形成为连接到第一接触孔并具有第一图案的导电氧化物膜覆盖。导电氧化物膜的周围由与导电氧化物膜同时形成并具有第二图案形式的导电氧化物膜（牺牲电极）包围。

8. 发明申请

US20080023848A1 Semiconductor device and its wiring method 审中-公开
公开(公告)号：US20080023848A1
公开(公告)日：2008-01-31
申请号：US11902827
申请日：2007-09-26
申请人： Isao Nojiri , Ryu Makabe
发明人： Isao Nojiri , Ryu Makabe
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05552 , H01L2224/05554 , H01L2224/06051 , H01L2224/1132 , H01L2224/16145 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48599 , H01L2224/4911 , H01L2224/49112 , H01L2224/49113 , H01L2224/4912 , H01L2224/49175 , H01L2224/4918 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.

9. 发明申请

US20080023847A1 Semiconductor device and its wiring method 失效
标题翻译：半导体器件及其布线方法
公开(公告)号：US20080023847A1
公开(公告)日：2008-01-31
申请号：US11902826
申请日：2007-09-26
申请人： Isao Nojiri , Ryu Makabe
发明人： Isao Nojiri , Ryu Makabe
IPC分类号： H01L23/49
CPC分类号： H01L25/0657 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0401 , H01L2224/05552 , H01L2224/05554 , H01L2224/06051 , H01L2224/1132 , H01L2224/16145 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/48599 , H01L2224/4911 , H01L2224/49112 , H01L2224/49113 , H01L2224/4912 , H01L2224/49175 , H01L2224/4918 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.
摘要翻译：安装在母板上的半导体器件具有位于母板上的电路板和位于电路板上的半导体芯片。电路板具有连接焊盘，与连接焊盘间隔开的继电器焊盘，以及在支撑半导体芯片的电路板的表面上连接在连接焊盘和继电器焊盘之间的电线。此外，半导体芯片具有与形成在电路板上的连接焊盘相对应的连接焊盘。此外，电路板上的连接焊盘和半导体芯片上的连接焊盘通过接合线彼此电连接。

10. 发明申请

US20070216631A1 IMAGE DISPLAY DEVICE 审中-公开
标题翻译：图像显示设备
公开(公告)号：US20070216631A1
公开(公告)日：2007-09-20
申请号：US11616139
申请日：2006-12-26
申请人： Isao NOJIRI
发明人： Isao NOJIRI
IPC分类号： G09G3/36
CPC分类号： G09G3/3688 , G09G2310/027 , G09G2310/0297 , G09G2310/08
摘要： An image display device includes a liquid crystal display part, a gate line driving circuit, a source line driving circuit, and a timing controller. The source line driving circuit includes a horizontal shift register, a first latch circuit, a second latch circuit, a D/A converter circuit, and a demultiplexer capable of driving a plurality of source lines divided into a plurality of batches. The timing controller includes a pulse generating circuit, a signal transmission circuit, and a shift pulse generating circuit for generating a second latch signal and for sending a shifted start signal back to the signal transmission circuit.
摘要翻译：图像显示装置包括液晶显示部分，栅极线驱动电路，源极线驱动电路和定时控制器。源极线驱动电路包括能够驱动分成多个批次的多个源极线的水平移位寄存器，第一锁存电路，第二锁存电路，D / A转换器电路和解复用器。定时控制器包括脉冲发生电路，信号传输电路和移位脉冲发生电路，用于产生第二锁存信号并将移位的起始信号发送回信号传输电路。

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