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1. 发明授权

US07672111B2 Electrostatic chuck and method for manufacturing same 有权
标题翻译：静电吸盘及其制造方法
公开(公告)号：US07672111B2
公开(公告)日：2010-03-02
申请号：US11998463
申请日：2007-11-29
申请人： Jun Miyaji , Ikuo Itakura , Shoichiro Himuro
发明人： Jun Miyaji , Ikuo Itakura , Shoichiro Himuro
IPC分类号： H02N13/00 , H02H1/00
CPC分类号： H01L21/6831 , H01L21/68757 , Y10T29/49117
摘要： An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode, and the insulator film has a thickness of 0.6 mm or less. Alternatively, An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode selectively formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode. The insulative adhesive is interposed also between the insulator film and a portion of the surface of the dielectric substrate where the electrode is not formed, and the insulative adhesive has a thermal conductivity of 1 W/mK or more.
摘要翻译：静电卡盘包括：具有通过热喷涂形成在其表面上的绝缘膜的金属板; 以及在其表面上形成有电极的电介质基板。金属板和电介质基板通过插入其间的绝缘性粘合剂结合在一起，使得绝缘膜与电极相对，绝缘膜的厚度为0.6mm以下。或者，静电卡盘包括：具有通过热喷涂形成在其表面上的绝缘膜的金属板; 以及具有选择性地形成在其表面上的电极的电介质基板。金属板和电介质基板之间通过绝缘粘合剂粘合在一起，使得绝缘膜与电极相对。该绝缘性粘合剂还介于绝缘膜与不形成电极的电介质基板的表面的一部分之间，绝缘性粘接剂的导热率为1W / m·K以上。

2. 发明申请

US20060268491A1 Electrostatic chuck 有权
标题翻译：静电吸盘
公开(公告)号：US20060268491A1
公开(公告)日：2006-11-30
申请号：US11299802
申请日：2005-12-13
申请人： Ikuo Itakura , Syouichiro Himuro
发明人： Ikuo Itakura , Syouichiro Himuro
IPC分类号： H01T23/00
CPC分类号： H01L21/6831
摘要： The object of the present invention is to provide an electrostatic chuck which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.
摘要翻译：本发明的目的是提供一种具有高等离子体电阻和高夹持材料的高能力的静电卡盘。对于静电卡盘的基本结构，通过火焰喷涂在金属板的表面上形成绝缘膜，并且通过绝缘粘合剂层将电介质基板接合到绝缘膜上。电介质基板的上表面是用于安装诸如半导体晶片的被夹持W的材料的表面。在电介质基板的下表面上形成电极。

3. 发明申请

US20130026720A1 ELECTROSTATIC CHUCK 审中-公开
标题翻译：静电卡
公开(公告)号：US20130026720A1
公开(公告)日：2013-01-31
申请号：US13635757
申请日：2011-03-23
申请人： Hiroaki Hori , Shunpei Kondo , Yuki Anai , Ikuo Itakura , Takeshi Uchimura , Kazuki Anada
发明人： Hiroaki Hori , Shunpei Kondo , Yuki Anai , Ikuo Itakura , Takeshi Uchimura , Kazuki Anada
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck comprises: a ceramic plate provided with recesses on a major surface and provided with an electrode in an inner part of the ceramic plate; a temperature regulating plate bonded to the major surface of the ceramic plate; a first bonding agent provided between the ceramic plate and the temperature regulating plate; and a heater provided in the each of the recesses of the ceramic plate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded into the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of the first amorphous filler. A thickness of the first bonding agent is greater than or equal to the average diameter of the first spherical filler. A width of the each of the recesses is greater than a width of the heater, and a depth of the each of the recesses is greater than a thickness of the heater. The heater is adhered within the each of the recesses by a second bonding agent. A first distance between a major surface of the heater on the side of the temperature regulating plate and a major surface of the temperature regulating plate is greater than a second distance between the major surface between the recesses of the ceramic plate and the major surface of the temperature regulating plate.
摘要翻译：静电卡盘包括：陶瓷板，其在主表面上设置有凹部，并在陶瓷板的内部设置有电极; 温度调节板结合到陶瓷板的主表面; 设置在陶瓷板和温度调节板之间的第一粘合剂; 以及设置在陶瓷板的每个凹部中的加热器。第一粘结剂具有包括有机材料的第一主剂，包含无机材料的第一无定形填料和包含无机材料的第一球形填料。将第一无定形填料和第一球形填料分散混合到第一主剂中。第一主剂，第一无定形填料和第一球形填料由电绝缘材料制成。第一球形填料的平均直径大于第一无定形填料的短轴的最大值。第一粘合剂的厚度大于或等于第一球形填料的平均直径。每个凹部的宽度大于加热器的宽度，并且每个凹部的深度大于加热器的厚度。加热器通过第二粘合剂粘附在每个凹部内。加热器在温度调节板一侧的主表面和温度调节板的主表面之间的第一距离大于陶瓷板的凹部与主表面之间的主表面之间的第二距离调温板。

4. 发明授权

US07760484B2 Electrostatic chuck 有权
标题翻译：静电吸盘
公开(公告)号：US07760484B2
公开(公告)日：2010-07-20
申请号：US12217532
申请日：2008-07-07
申请人： Ikuo Itakura , Syouichiro Himuro
发明人： Ikuo Itakura , Syouichiro Himuro
IPC分类号： H02N13/00
CPC分类号： H01L21/6831
摘要： The present invention provides an electrostatic chuck, which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.
摘要翻译：本发明提供一种具有高等离子体电阻和高夹持材料的高能力的静电卡盘。对于静电卡盘的基本结构，通过火焰喷涂在金属板的表面上形成绝缘膜，并且通过绝缘粘合剂层将电介质基板接合到绝缘膜上。电介质基板的上表面是用于安装诸如半导体晶片的被夹持W的材料的表面。在电介质基板的下表面上形成电极。

5. 发明授权

US07468880B2 Electrostatic chuck 有权
标题翻译：静电吸盘
公开(公告)号：US07468880B2
公开(公告)日：2008-12-23
申请号：US11299802
申请日：2005-12-13
申请人： Ikuo Itakura , Syouichiro Himuro
发明人： Ikuo Itakura , Syouichiro Himuro
IPC分类号： H02N13/00
CPC分类号： H01L21/6831
摘要： The object of the present invention is to provide an electrostatic chuck which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.
摘要翻译：本发明的目的是提供一种具有高等离子体电阻和高夹持材料的高能力的静电卡盘。对于静电卡盘的基本结构，通过火焰喷涂在金属板的表面上形成绝缘膜，并且通过绝缘粘合剂层将电介质基板接合到绝缘膜上。电介质基板的上表面是用于安装诸如半导体晶片的被夹持W的材料的表面。在电介质基板的下表面上形成电极。

6. 发明授权

US08848335B2 Electrostatic chuck 有权
标题翻译：静电吸盘
公开(公告)号：US08848335B2
公开(公告)日：2014-09-30
申请号：US13635778
申请日：2011-03-23
申请人： Hiroaki Hori , Ikuo Itakura , Kazuki Anada
发明人： Hiroaki Hori , Ikuo Itakura , Kazuki Anada
IPC分类号： H01T23/00 , H01L21/683
CPC分类号： H01L21/6833 , H01L21/6831 , Y10T279/23
摘要： An electrostatic chuck includes: a ceramic substrate; a ceramic dielectric body provided on a top side of the ceramic substrate and having a first major surface where a processing target substrate is to be mounted; and an electrode provided between the ceramic substrate and the ceramic dielectric body. A material of the ceramic dielectric body is a ceramic sintered body. A plurality of protrusions and a groove for supplying a gas are provided on the first major surface of the ceramic dielectric body. A through hole is provided in a bottom face of the groove, the through hole penetrating to a second major surface of the ceramic substrate on a side opposite to the first major surface. A distance between the electrode and the groove is greater than or equal to a distance between the electrode and the first major surface.
摘要翻译：静电卡盘包括：陶瓷基板; 陶瓷电介质体，其设置在所述陶瓷基板的上侧，具有第一主面，所述第一主面安装有处理对象基板; 以及设置在陶瓷基板和陶瓷电介质体之间的电极。陶瓷电介质体的材料是陶瓷烧结体。在陶瓷电介质体的第一主表面上设置有用于供给气体的多个突起和沟槽。在所述槽的底面设有贯通孔，所述通孔在与所述第一主面相反的一侧贯穿所述陶瓷基板的第二主面。电极和沟槽之间的距离大于或等于电极与第一主表面之间的距离。

7. 发明申请

US20130027838A1 ELECTROSTATIC CHUCK 有权
标题翻译：静电卡
公开(公告)号：US20130027838A1
公开(公告)日：2013-01-31
申请号：US13635778
申请日：2011-03-23
申请人： Hiroaki Hori , Ikuo Itakura , Kazuki Anada
发明人： Hiroaki Hori , Ikuo Itakura , Kazuki Anada
IPC分类号： H01L21/683 , B23B31/28
CPC分类号： H01L21/6833 , H01L21/6831 , Y10T279/23
摘要： An electrostatic chuck includes: a ceramic substrate; a ceramic dielectric body provided on a top side of the ceramic substrate and having a first major surface where a processing target substrate is to be mounted; and an electrode provided between the ceramic substrate and the ceramic dielectric body. A material of the ceramic dielectric body is a ceramic sintered body. A plurality of protrusions and a groove for supplying a gas are provided on the first major surface of the ceramic dielectric body. A through hole is provided in a bottom face of the groove, the through hole penetrating to a second major surface of the ceramic substrate on a side opposite to the first major surface. A distance between the electrode and the groove is greater than or equal to a distance between the electrode and the first major surface.
摘要翻译：静电卡盘包括：陶瓷基板; 陶瓷电介质体，其设置在所述陶瓷基板的上侧，具有第一主面，所述第一主面安装有处理对象基板; 以及设置在陶瓷基板和陶瓷电介质体之间的电极。陶瓷电介质体的材料是陶瓷烧结体。在陶瓷电介质体的第一主表面上设置有用于供给气体的多个突起和沟槽。在所述槽的底面设有贯通孔，所述通孔在与所述第一主面相反的一侧贯穿所述陶瓷基板的第二主面。电极和沟槽之间的距离大于或等于电极与第一主表面之间的距离。

8. 发明申请

US20130093145A1 ELECTROSTATIC CHUCK 审中-公开
标题翻译：静电卡
公开(公告)号：US20130093145A1
公开(公告)日：2013-04-18
申请号：US13635736
申请日：2011-03-23
申请人： Hiroaki Hori , Hiroki Matsui , Ikuo Itakura
发明人： Hiroaki Hori , Hiroki Matsui , Ikuo Itakura
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , C04B35/6269 , C04B35/63436 , C04B35/63452 , C04B37/005 , C04B37/008 , C04B37/028 , C04B2235/3217 , C04B2235/3418 , C04B2235/36 , C04B2235/3865 , C04B2235/483 , C04B2235/528 , C04B2235/5296 , C04B2235/5436 , C04B2235/5481 , C04B2235/76 , C04B2235/9607 , C04B2237/062 , C04B2237/064 , C04B2237/08 , C04B2237/10 , C04B2237/32 , C04B2237/343 , C04B2237/402 , C04B2237/59 , C04B2237/595 , C04B2237/704 , C04B2237/708 , Y10T279/23
摘要： An electrostatic chuck comprises a ceramic dielectric body having an electrode formed on a surface of the ceramic dielectric body; a ceramic substrate supporting the ceramic dielectric body; and a first bonding agent bonding the ceramic dielectric body to the ceramic substrate. The first bonding agent has a first major agent including an organic material, a first amorphous filler including an inorganic material, and a first spherical filler including an inorganic material. The first amorphous filler and the first spherical filler are dispersion-compounded in the first major agent. The first major agent, the first amorphous filler, and the first spherical filler are made of an electrically insulating material. An average diameter of the first spherical filler is greater than a maximum value of a minor axis of all of the first amorphous filler. A thickness of the first bonding agent is equal to or greater than the average diameter of the first spherical filler.
摘要翻译：静电卡盘包括：陶瓷电介质体，其具有在陶瓷电介质体的表面上形成的电极; 支撑陶瓷电介质体的陶瓷基板; 以及将陶瓷电介质体接合到陶瓷基板的第一粘合剂。第一粘结剂具有包括有机材料的第一主剂，包含无机材料的第一无定形填料和包含无机材料的第一球形填料。第一无定形填料和第一球形填料分散复合在第一主剂中。第一主剂，第一无定形填料和第一球形填料由电绝缘材料制成。第一球形填料的平均直径大于所有第一非晶填料的短轴的最大值。第一粘合剂的厚度等于或大于第一球形填料的平均直径。

9. 发明申请

US20080273284A1 Electrostatic chuck 有权
标题翻译：静电吸盘
公开(公告)号：US20080273284A1
公开(公告)日：2008-11-06
申请号：US12217532
申请日：2008-07-07
申请人： Ikuo Itakura , Syouichiro Himuro
发明人： Ikuo Itakura , Syouichiro Himuro
IPC分类号： H01T23/00
CPC分类号： H01L21/6831
摘要： The present invention provides an electrostatic chuck, which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate is bonded onto the insulating film by an insulating adhesive layer. The top surface of the dielectric substrate is a surface for mounting a material to be clamped W such as a semiconductor wafer. Electrodes are formed on the lower surface of the dielectric substrate.
摘要翻译：本发明提供一种具有高等离子体电阻和高夹持材料的高能力的静电卡盘。对于静电卡盘的基本结构，通过火焰喷涂在金属板的表面上形成绝缘膜，并且通过绝缘粘合剂层将电介质基板接合到绝缘膜上。电介质基板的上表面是用于安装诸如半导体晶片的被夹持W的材料的表面。在电介质基板的下表面上形成电极。

10. 发明申请

US20080212255A1 Electrostatic chuck and method for manufacturing same 有权
标题翻译：静电吸盘及其制造方法
公开(公告)号：US20080212255A1
公开(公告)日：2008-09-04
申请号：US11998463
申请日：2007-11-29
申请人： Jun Miyaji , Ikuo Itakura , Shoichiro Himuro
发明人： Jun Miyaji , Ikuo Itakura , Shoichiro Himuro
IPC分类号： H01L21/683 , H05K3/00
CPC分类号： H01L21/6831 , H01L21/68757 , Y10T29/49117
摘要： An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode, and the insulator film has a thickness of 0.6 mm or less. Alternatively, An electrostatic chuck includes: a metal plate with an insulator film formed on a surface thereof by thermal spraying; and a dielectric substrate with an electrode selectively formed on a surface thereof. The metal plate and the dielectric substrate are bonded together via an insulative adhesive interposed therebetween so that the insulator film is opposed to the electrode. The insulative adhesive is interposed also between the insulator film and a portion of the surface of the dielectric substrate where the electrode is not formed, and the insulative adhesive has a thermal conductivity of 1 W/mK or more.
摘要翻译：静电卡盘包括：具有通过热喷涂形成在其表面上的绝缘膜的金属板; 以及在其表面上形成有电极的电介质基板。金属板和电介质基板通过插入其间的绝缘性粘合剂结合在一起，使得绝缘膜与电极相对，绝缘膜的厚度为0.6mm以下。或者，静电卡盘包括：具有通过热喷涂形成在其表面上的绝缘膜的金属板; 以及具有选择性地形成在其表面上的电极的电介质基板。金属板和电介质基板之间通过绝缘粘合剂粘合在一起，使得绝缘膜与电极相对。该绝缘性粘合剂还介于绝缘膜与不形成电极的电介质基板的表面的一部分之间，绝缘性粘合剂的导热率为1W / m·K以上。

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