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    • 1. 发明授权
    • System for heat treatment of semiconductor device
    • 半导体器件热处理系统
    • US07989736B2
    • 2011-08-02
    • US11598447
    • 2006-11-13
    • Wang Jun ParkJung Bae KimYoung Jae AhnHyoung June KimDong Hoon Shin
    • Wang Jun ParkJung Bae KimYoung Jae AhnHyoung June KimDong Hoon Shin
    • H01L21/02F27B9/12F27B9/36F27B9/39
    • H01L21/67109H01L21/67115H01L21/67173H01L21/67207H01L21/67236
    • Disclosed is a heat treatment system for semiconductor devices. The heat treatment system is used in a heat treatment process for semiconductor devices, such as a crystallization process for an amorphous silicon thin film or a dopant activation process for a poly-crystalline silicon thin film formed on a surface of a glass substrate of a flat display panel including a liquid crystal display (LCD) or an organic light emitting device (OLED). The heat treatment system transfers a semiconductor device after uniformly preheating the semiconductor device in order to prevent deformation of the semiconductor device during the heat treatment process, rapidly performs the heat treatment process under the high temperature condition by heating the semiconductor device using a lamp heater and induction heat derived from induced electromotive force, and unloads the semiconductor device after uniformly cooling the semiconductor device such that the semiconductor device is prevented from being deformed when the heat treatment process has been finished. The heat treatment system rapidly performs the heat treatment process while preventing deformation of the semiconductor device by gradually heating or cooling the semiconductor device.
    • 公开了一种用于半导体器件的热处理系统。 热处理系统用于半导体器件的热处理工艺,例如非晶硅薄膜的结晶工艺或形成在平坦的玻璃基板的表面上的多晶硅薄膜的掺杂剂活化工艺 显示面板包括液晶显示器(LCD)或有机发光器件(OLED)。 热处理系统在对半导体器件进行均匀预热之后传递半导体器件,以防止在热处理过程中半导体器件的变形,通过使用灯加热器加热半导体器件,在高温条件下快速地执行热处理工艺,以及 由感应电动势产生的感应热,并且在均匀冷却半导体器件之后卸载半导体器件,使得当热处理过程结束时,防止半导体器件变形。 热处理系统通过逐渐加热或冷却半导体器件来快速地执行热处理过程,同时防止半导体器件的变形。
    • 6. 发明授权
    • Apparatuses for heat-treatment of semiconductor films under low temperature
    • 低温半导体薄膜热处理设备
    • US06747254B2
    • 2004-06-08
    • US10146504
    • 2002-05-14
    • Hyoung June KimDong Hoon Shin
    • Hyoung June KimDong Hoon Shin
    • H05B610
    • H05B6/105H01L21/67109
    • The present invention relates to apparatuses for continuous and efficient heat-treatment of semiconductor films upon thermally susceptible non-conducting substrates at a minimum thermal budget, and more particularly, to a polycrystalline silicon thin-film transistors (poly-Si TFTs) and PN diodes on glass substrates for various applications of liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), and solar cells. According to the apparatuses of the present invention, the semiconductor films can be heat-treated without damaging the thermally susceptible substrates: e.g., crystallization of amorphous silicon films at the minimum thermal budget acceptable for the use of glass, enhancing kinetics of dopant activation at the minimum thermal budget acceptable for the use of glass.
    • 本发明涉及用于在热敏非导电衬底上以最小热预算连续且有效地对半导体膜进行热处理的装置,更具体地说,涉及多晶硅薄膜晶体管(多晶硅TFT)和PN二极管 在用于液晶显示器(LCD),有机发光二极管(OLED)和太阳能电池的各种应用的玻璃基板上。 根据本发明的装置,可以对半导体膜进行热处理,而不损害热敏基片:例如,在玻璃的使用可接受的最小热预算下,非晶硅薄膜的结晶化,增强在玻璃的掺杂剂激活的动力学 玻璃使用的最低热预算可接受。