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1. 发明申请

US20130092186A1 REMOVAL OF PARTICLES ON BACK SIDE OF WAFER 审中-公开
标题翻译：去除水面背面的颗粒
公开(公告)号：US20130092186A1
公开(公告)日：2013-04-18
申请号：US13275492
申请日：2011-10-18
申请人： Hsun-Peng Lin , Hsin-Kuo Chang , Han-Chih Chung , Yueh-Chih Wang , Chi-Jen Hsieh
发明人： Hsun-Peng Lin , Hsin-Kuo Chang , Han-Chih Chung , Yueh-Chih Wang , Chi-Jen Hsieh
IPC分类号： B08B1/00 , A46B13/00 , B08B5/04
CPC分类号： H01L21/0209 , B08B1/002 , B08B15/04 , H01L21/02057 , H01L21/02087 , H01L21/67046 , H01L21/68 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a mechanical structure that is operable to secure a position of a semiconductor wafer. The wafer has a front surface and a back surface. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface. The predetermined region of the wafer at least partially overlaps with one or more alignment marks. The present disclosure also provides a method of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side. The alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system.
摘要翻译：本公开提供了一种用于制造半导体器件的装置。该装置包括可操作以固定半导体晶片的位置的机械结构。晶片具有前表面和后表面。该装置包括可操作以清洁背面上的晶片的预定区域的晶片清洁装置。晶片的预定区域至少部分地与一个或多个对准标记重叠。本公开还提供了制造半导体器件的方法。该方法包括将半导体晶片加载到晶片处理系统中。该方法包括从背面从晶片的边缘区域去除污染物颗粒。对准标记位于边缘区域。该方法包括收集去除的污染物颗粒并将收集的杂质颗粒丢弃出晶片处理系统。

2. 发明授权

US06927363B1 Distribution manifold for exhausting photoresist vapors 失效
标题翻译：用于排出光致抗蚀剂蒸汽的分配歧管
公开(公告)号：US06927363B1
公开(公告)日：2005-08-09
申请号：US10197048
申请日：2002-07-17
申请人： Yao-Hwan Kao , Hsun-Peng Lin , Wen-Hwo Liu , Yuan-Ting Huang
发明人： Yao-Hwan Kao , Hsun-Peng Lin , Wen-Hwo Liu , Yuan-Ting Huang
IPC分类号： F27B5/14 , F27B17/00 , H01L21/00
CPC分类号： H01L21/67017 , F27B17/0025
摘要： An exhaust apparatus for evacuating vapor during baking of liquid chemicals deposited on substrates including a heating chamber containing a hot plate for horizontally supporting and heating a substrate. A cover plate is suspended horizontally over the hot plate; the cover plate has a plurality of exhaust ports extending from the top to its bottom surfaces. The ports are radially and evenly disposed midway between the periphery and a centered port with a manifold mounted to the top of the cover plate. The manifold has tubular conduits connected underneath to each exhaust port. Each conduit has an adjustable damper disposed at its front opening for regulating the vapor being exhausted. The tubular conduits converge from each exhaust port towards a common enclosure with an exhaust pipe coupled to its top for exhausting vapor to an external recovery facility.
摘要翻译：一种排气装置，用于在沉积在基板上的液体化学品的烘烤过程中排出蒸汽，该排气装置包括一个含有用于水平支撑和加热基板的热板的加热室。盖板水平悬挂在热板上; 盖板具有从顶部延伸到其底表面的多个排气口。端口径向均匀地设置在周边和中心端口之间的中间，并具有安装到盖板顶部的歧管。歧管具有连接到每个排气口下方的管状导管。每个管道具有设置在其前开口处的可调节阻尼器，用于调节被排出的蒸汽。管状导管从每个排气口朝向共同的外壳会聚，排气管与顶部连接，以将蒸气排放到外部回收设施。

3. 发明授权

US5964257A Apparatus and method for cleaning a liquid dispensing nozzle 失效
标题翻译：清洗液体分配喷嘴的设备和方法
公开(公告)号：US5964257A
公开(公告)日：1999-10-12
申请号：US941714
申请日：1997-09-30
申请人： Hsun-Peng Lin , Fu-Tein Wung , Chih-Hsiung Lee
发明人： Hsun-Peng Lin , Fu-Tein Wung , Chih-Hsiung Lee
IPC分类号： B05B15/02 , B65B1/04
CPC分类号： B05B15/025
摘要： The present invention provides an apparatus and a method for cleaning a liquid dispensing nozzle that is utilized in semiconductor process machines by providing a cleaning solvent reservoir tank capable of receiving a dispensing nozzle and then flowing a cleaning solvent through the nozzle under pressure, and then purging through the dispensing nozzle with a processing fluid to later be utilized such that any residual cleaning solvent is purged out of the dispensing nozzle to prevent the possible back-flow or syphoning of the cleaning solvent into a processing fluid supply and the dilution of such processing fluid. The present invention apparatus is further equipped with a cleaning solvent buffer tank for holding and feeding a cleaning solvent to the reservoir tank such that the pressure in the reservoir tank can be suitably controlled.
摘要翻译：本发明提供了一种用于清洗液体分配喷嘴的装置和方法，所述设备和方法通过提供能够接收分配喷嘴然后在压力下使清洗溶剂流过喷嘴的清洗溶剂储存罐而在半导体处理机器中使用，然后清洗通过分配喷嘴与处理流体一起被利用，使得任何残留的清洁溶剂被清除出分配喷嘴，以防止清洗溶剂进入处理流体供应的可能的回流或虹吸，并且这种处理流体的稀释。本发明的装置还配备有清洗溶剂缓冲罐，用于将清洗溶剂保持并供给到储存罐，使得能够适当地控制储存罐中的压力。

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