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1. 发明授权

US4346745A Wafer slicing apparatus 失效
标题翻译：晶圆切片机
公开(公告)号：US4346745A
公开(公告)日：1982-08-31
申请号：US181314
申请日：1980-08-25
申请人： Jack Weavell , Horst J. Jatzek
发明人： Jack Weavell , Horst J. Jatzek
IPC分类号： B27L11/02 , B27C1/14
CPC分类号： B27L11/02
摘要： A rotatable carrier has a plurality of cutter knives protruding from a work face thereof. A feed passage is positioned to direct longitudinal sides of wood pieces against the carrier face to enable the knives to slice wafers from the pieces during rotation of the carrier. The feed passage is defined by opposed side walls each having a plurality of superimposed gripper chains with runs forming a moving inner surface of the respective wall. These chains are adapted to grip the ends of wood pieces and move said pieces along the passage. The chain arrangement of at least one side wall is mounted in floating relationship to that of the other side wall and is resiliently biased towards the latter.
摘要翻译：可旋转托架具有从其工作面突出的多个切割刀。进给通道被定位成将木片的纵向侧面对着承载面引导，以使得刀片能够在托架旋转期间将片材从碎片上分层。供给通道由相对的侧壁限定，每个侧壁具有多个叠置的夹持链，其中流动形成相应壁的移动的内表面。这些链条适于抓住木件的端部并沿着通道移动所述件。至少一个侧壁的链条布置与另一个侧壁的浮动关系安装，并朝着后侧弹性偏置。

2. 发明授权

US4346744A Wood waferizing apparatus 失效
标题翻译：木材晶圆装置
公开(公告)号：US4346744A
公开(公告)日：1982-08-31
申请号：US180257
申请日：1980-08-22
申请人： Douglas C. Beer , Horst J. Jatzek
发明人： Douglas C. Beer , Horst J. Jatzek
IPC分类号： B27L11/02 , B27C1/14
CPC分类号： B27L11/02
摘要： A rotatable carrier element has a plurality of elongate slots opening out from a work surface thereof with cutter knives projecting from the slots for slicing wafers off pieces of wood bearing against the work surface with the sides and the grain of the pieces extending substantially parallel to the work surface and the slots when the latter pass the wood. Each cutter knife forms part of a waferizing arrangement in each slot. Each waferizing arrangement includes a reactor guide in the slot positioned relative to the knife so as to be engaged by wafers cut by the knife to break the wafers longitudinally thereof into predetermined widths.
摘要翻译：可转动的载体元件具有多个从其工作表面开口的细长槽，其中切割刀从槽突出，用于将晶片从木材轴承抵靠着工作表面切片，其侧面和块的颗粒基本上平行于工作面和插槽，当后者通过木材。每个切割刀在每个槽中形成晶片排列的一部分。每个晶片化装置包括在相对于刀片定位的槽中的反应器引导件，以便被刀切割的晶片接合，以将晶片纵向破裂成预定宽度。

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