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    • 8. 发明申请
    • Efficient Thermoelectric Cooling of Photonic Integrated Circuits
    • 光电集成电路的高效热电冷却
    • US20110129192A1
    • 2011-06-02
    • US12627255
    • 2009-11-30
    • Xiao A. ShenHongbing LeiYu Sheng Bai
    • Xiao A. ShenHongbing LeiYu Sheng Bai
    • G02B6/00
    • H01S5/02415H01L23/38H01L2924/0002H01S5/0268H01S5/4025H01L2924/00
    • An apparatus comprising a carrier comprising at least one heat-generating component and a thermoelectric cooler (TEC) coupled to a surface of the carrier, wherein the cross-sectional area of the TEC is less than the cross-sectional area of the carrier, and wherein the TEC is aligned with the heat-generating component. Included is an apparatus comprising a carrier comprising a plurality of optical transmitters and an active component, at least one TEC coupled to the surface of the carrier, and a support post coupled to the surface of the carrier, wherein the support post has a higher thermal resistivity than the TEC, wherein the cross-sectional area of the TEC is less than the cross-sectional area of the carrier, and wherein the TEC is aligned with the optical transmitters, the active component, or both.
    • 一种包括载体的装置,其包括耦合到所述载体的表面的至少一个发热部件和热电冷却器(TEC),其中所述TEC的横截面面积小于所述载体的横截面面积,并且 其中TEC与发热部件对准。 包括一种包括载体的装置,其包括多个光发射器和有源部件,耦合到载体表面的至少一个TEC以及耦合到载体表面的支撑柱,其中支撑柱具有较高的热 电阻率大于TEC,其中TEC的横截面面积小于载体的横截面面积,并且其中TEC与光发射器,有源部件或两者对准。