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    • 7. 发明申请
    • LEAD FRAME AND A METHOD OF MANUFACTURING THEREOF
    • 引导框架及其制造方法
    • US20140203418A1
    • 2014-07-24
    • US14158321
    • 2014-01-17
    • Dawei XINGJie LIUHong Wei GUANYue Gen YUSeow Kiang KHOO
    • Dawei XINGJie LIUHong Wei GUANYue Gen YUSeow Kiang KHOO
    • H01L21/48H01L23/495
    • H01L21/4828H01L21/561H01L23/3121H01L23/49548H01L23/49582H01L23/49861H01L24/97H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/97H01L2924/181H01L2924/00014H01L2924/00H01L2224/85H01L2224/83H01L2924/00012
    • A method of manufacturing a lead frame, comprising the steps of: providing an electrically-conductive base material having first and second planar sides; forming a patterned conductive layer on the first planar side of the base material; etching the second planar side of the base material at portions with respect to exposed portions on the first planar side of the base material comprising the patterned conductive layer, to form partially-etched portions on the second planar side of the base material; providing a non-conductive filling material over the second planar side of the base material, wherein the filling material fills spaces inside the partially-etched portions on the second planar side of the base material to form adjacent portions of the filling material and a plurality of conductive portions on the second planar side of the base material; and etching the exposed portions of the first planar side of the base material comprising the patterned conductive layer to form partially-etched portions on the first planar side of the base material that combine with the partially-etched portions on the second planar side of the base material to thereby form a plurality of separate conductive regions on the first planar side of the base material, each conductive region being electrically conductive with at least a respective one of the plurality of conductive portions on the second planar side of the base material.
    • 一种制造引线框架的方法,包括以下步骤:提供具有第一和第二平面侧面的导电基材; 在基材的第一平面侧上形成图案化的导电层; 在相对于包括图案化导电层的基材的第一平面侧上的暴露部分的部分处蚀刻基材的第二平面侧,以在基材的第二平面侧上形成部分蚀刻部分; 在所述基材的所述第二平面侧上设置不导电的填充材料,其中所述填充材料填充所述基材的所述第二平面侧上的部分蚀刻部分内的空间,以形成所述填充材料的相邻部分, 在基材的第二平面侧的导电部分; 并且蚀刻包括图案化导电层的基材的第一平面侧的暴露部分,以在基材的第一平面侧上形成部分蚀刻部分,其与基底的第二平面侧上的部分蚀刻部分组合 从而在基材的第一平面侧上形成多个单独的导电区域,每个导电区域与基材的第二平面侧上的多个导电部分中的至少一个导电部分导电。
    • 10. 发明申请
    • PLUG EXTRACTION TEST APPARATUS
    • 胶囊提取试验装置
    • US20130309878A1
    • 2013-11-21
    • US13610276
    • 2012-09-11
    • Hong-Wei LEE
    • Hong-Wei LEE
    • H01R12/75
    • G01R1/0408
    • A plug extraction test apparatus is disclosed. The plug extraction test apparatus is used for electrically connecting a device to be tested that has an adapter to a testing host, wherein the plug extraction test apparatus includes a first circuit board and a second circuit board. The first circuit board includes at least one connection port and at least one first slot, wherein the at least one connection port allows the adapter to be plugged into it. The second circuit board includes a plurality of conductive contacts used for being electrically connected to the testing host, such that an electrical signal in the second circuit board is transmitted to the testing host. The second circuit board is electrically connected to the first circuit board via the first slot so that an electrical signal in the first circuit board is transmitted to the second circuit.
    • 公开了插塞拔出试验装置。 塞子提取测试装置用于将具有适配器的被测试装置电连接到测试主机,其中插头提取测试装置包括第一电路板和第二电路板。 第一电路板包括至少一个连接端口和至少一个第一插槽,其中至少一个连接端口允许适配器插入其中。 第二电路板包括用于电连接到测试主机的多个导电触点,使得第二电路板中的电信号被传送到测试主机。 第二电路板经由第一槽电连接到第一电路板,使得第一电路板中的电信号被传输到第二电路。