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1. 发明申请

US20220133936A1 Flatulence cleaning apparatus 有权
公开(公告)号：US20220133936A1
公开(公告)日：2022-05-05
申请号：US16974174
申请日：2020-11-03
申请人： Hong Min Kim
发明人： Hong Min Kim
IPC分类号： A61L9/014 , B08B5/04 , B08B3/08 , B01D53/04 , A61L9/14
摘要： An apparatus is for cleaning flatulence of obnoxious odor, infectious virus and/or bacteria, and other contaminants. It can be mounted underneath a seat or bed provided with a flatulence collecting means. Flatulence is drawn through a series of chambers with charcoal provided in a first chamber for removing the obnoxious odor, copper wool provided in a second chamber having plurality of maze-like chambers for capturing and exterminating virus and/or bacteria; and a final chamber having sanitizing mist for eliminating contaminants.

2. 发明授权

US10497675B2 Semiconductor device including multiple semiconductor chips 有权
公开(公告)号：US10497675B2
公开(公告)日：2019-12-03
申请号：US15331801
申请日：2016-10-21
申请人： Byoung Soo Kwak , Tae Hong Min , In Young Lee , Tae Je Cho
发明人： Byoung Soo Kwak , Tae Hong Min , In Young Lee , Tae Je Cho
IPC分类号： H01L25/065 , H01L23/498 , H01L21/56 , H01L23/00 , H01L25/00 , H01L25/10
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/49827 , H01L24/83 , H01L25/0652 , H01L25/50 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/92 , H01L25/105 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/131 , H01L2224/13082 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/26145 , H01L2224/26175 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06544 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2224/131 , H01L2924/014 , H01L2924/00014 , H01L2224/73204 , H01L2224/16145 , H01L2224/32145 , H01L2924/00 , H01L2224/14181 , H01L2224/1403
摘要： There is provided a semiconductor device, enhanced with process capability and reliability by way of flow control of an adhesive material to fix semiconductor chips. The semiconductor device includes a first semiconductor chip including a first surface and a second surface opposite to each other, a flow regulating structure formed at the first surface of the first semiconductor chip, and a second semiconductor chip mounted on the first surface of the first semiconductor chip. The second semiconductor chip overlaps at least a portion of the flow regulating structure.

3. 发明申请

US20190090804A1 System for detecting and logging of flatulence for health indication 审中-公开
公开(公告)号：US20190090804A1
公开(公告)日：2019-03-28
申请号：US15732160
申请日：2017-09-28
申请人： Hong Min Kim
发明人： Hong Min Kim
IPC分类号： A61B5/00 , B01D53/04 , B01J20/20 , A61L9/014 , G01N33/48 , A61B10/00
CPC分类号： A61B5/42 , A61B10/00 , A61B2010/0083 , A61L9/014 , A61L2209/22 , B01D53/0407 , B01D2253/102 , B01D2257/304 , B01D2259/40084 , B01J20/20 , G01N33/48
摘要： A system is provided for collecting and logging the frequency of flatulence of a person in a selected time period as well as the duration of each occurrence of flatulence. The log entries provide determination of the body cells signaling of the person indicative of the person's health condition whereby underlying diseases may be detected and treated in their early stage.

4. 发明授权

US10155894B2 Thermal interface material with ion scavenger 有权
公开(公告)号：US10155894B2
公开(公告)日：2018-12-18
申请号：US15322691
申请日：2014-07-07
申请人： HONEYWELL INTERNATIONAL INC. , Ya Qun Liu , Liang Zeng , Hui Wang , Bright Zhang , Hong Min Huang
发明人： Ya Qun Liu , Liang Zeng , Hui Wang , Bright Zhang , Hong Min Huang
IPC分类号： H05K7/20 , C09K5/14 , H01L23/42 , C08K13/02 , C08L23/08 , C09K5/06 , C09K15/06 , C09K15/22 , C09K15/24 , C09K15/30 , H01L23/367 , H01L23/00 , H01L23/373 , G06F1/20
摘要： A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

5. 发明授权

US10090278B2 Semiconductor packages 有权
公开(公告)号：US10090278B2
公开(公告)日：2018-10-02
申请号：US15393754
申请日：2016-12-29
申请人： Sang-Sick Park , Geol Nam , Tae Hong Min , Jihwan Hwang
发明人： Sang-Sick Park , Geol Nam , Tae Hong Min , Jihwan Hwang
IPC分类号： H01L25/065 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/00
摘要： A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.

6. 发明授权

US10020290B2 Semiconductor device having stacked semiconductor chips interconnected via TSV 有权
公开(公告)号：US10020290B2
公开(公告)日：2018-07-10
申请号：US15662764
申请日：2017-07-28
申请人： Yeong-Hwan Choe , Tae-Joo Hwang , Tae-Hong Min , Young-Kun Jee , Sang-Uk Han
发明人： Yeong-Hwan Choe , Tae-Joo Hwang , Tae-Hong Min , Young-Kun Jee , Sang-Uk Han
IPC分类号： H01L25/065 , H01L23/48 , H01L25/00 , H01L23/00
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/71 , H01L24/81 , H01L25/50 , H01L2224/06156 , H01L2224/10125 , H01L2224/131 , H01L2224/14156 , H01L2224/16145 , H01L2224/16146 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/75305 , H01L2224/81007 , H01L2224/81191 , H01L2924/15311 , H01L2924/3511 , H01L2924/00 , H01L2924/014
摘要： A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one through-silicon-via (TSV) through at least the first semiconductor chip of the first and second semiconductor chips, a contact pad on the at least one TSV of the first semiconductor chip, the contact pad electrically connecting the TSV of the first semiconductor chip to the second semiconductor chip, and a plurality of dummy pads on the first semiconductor chip, the plurality of dummy pads being spaced apart from each other and from the contact pad along a second direction, and the dummy pads having same heights as the contact pads as measured between respective top and bottom surfaces along the first direction.

7. 发明授权

US09796789B2 Biomemory device comprising heterolayer of recombinant protein and inorganic particle 有权
公开(公告)号：US09796789B2
公开(公告)日：2017-10-24
申请号：US13564136
申请日：2012-08-01
申请人： Jeong Woo Choi , Taek Lee , Jun Hong Min
发明人： Jeong Woo Choi , Taek Lee , Jun Hong Min
IPC分类号： C07K17/14 , C12N11/14 , G11C13/00 , B82Y10/00 , B82Y5/00 , B82Y30/00 , B82Y15/00
CPC分类号： C07K17/14 , B82Y10/00 , B82Y15/00 , B82Y30/00 , C12N11/14 , G11C13/0019
摘要： The present invention relates to a biomemory device, comprising (a) a substrate; and (b) a heterolayer comprising a protein having a redox potential and an inorganic particle; wherein the heterolayer is immobilized on the substrate. By applying inorganic particles, the present invention provides a biomemory device capable of enhancing low current signals detected electron transfer between biomolecules and substrates up to at least five (5) times greater signals. The present invention is capable of controlling the redox states with help of redox potentials of proteins depending on applied potential. The present invention provides a new-concept biomemory device as an information storage device based on the principle of electron transfer of a naturally occurring biomolecule.

8. 发明授权

US09507457B2 Method of determining touch coordinate and touch panel assembly for performing the same 有权
标题翻译：确定触摸坐标和触摸面板组件执行相同的方法
公开(公告)号：US09507457B2
公开(公告)日：2016-11-29
申请号：US13016122
申请日：2011-01-28
申请人： Won-Ki Hong , Jee-Hong Min , Seong-Mo Hwang , Il-Ho Lee
发明人： Won-Ki Hong , Jee-Hong Min , Seong-Mo Hwang , Il-Ho Lee
IPC分类号： G06F3/045 , G06F3/041
CPC分类号： G06F3/0416 , G06F3/045 , G06F2203/04104
摘要： A method of determining a touch coordinate in a touch panel includes detecting a touch cell among a plurality of touch cells, wherein the plurality of touch cells are defined by a plurality of areas in the touch panel in which a first touch electrode and a second touch electrode overlap with each other, detecting a touch position in the detected touch cell based on a first electrical signal measured at least one of a plurality of terminals of the first and second touch electrodes, determining a number of touches based on a distance between a first touch and a second touch, determining expected touch coordinates corresponding to the number of touches, and determining the touch coordinate based on a second electrical signal measured at least one of the plurality of terminals of the first and second touch electrodes and the expected touch coordinates.
摘要翻译：一种确定触摸面板中的触摸坐标的方法包括检测多个触摸单元中的触摸单元，其中多个触摸单元由触摸面板中的多个区域限定，其中第一触摸电极和第二触摸电极彼此重叠，基于测量到第一和第二触摸电极的多个端子中的至少一个端子的第一电信号来检测检测到的触摸单元中的触摸位置，基于第一和第二触摸电极之间的距离来确定触摸的数量触摸和第二触摸，确定对应于触摸次数的预期触摸坐标，以及基于测量到第一和第二触摸电极的多个终端中的至少一个的第二电信号和预期触摸坐标来确定触摸坐标。

9. 发明申请

US20160056101A1 CHIP-STACKED SEMICONDUCTOR PACKAGE 有权
标题翻译：芯片堆叠半导体封装
公开(公告)号：US20160056101A1
公开(公告)日：2016-02-25
申请号：US14818682
申请日：2015-08-05
申请人： Young-kun JEE , Tae-hong MIN , Sun-kyoung SEO
发明人： Young-kun JEE , Tae-hong MIN , Sun-kyoung SEO
IPC分类号： H01L23/498 , H01L25/065 , H01L23/31
CPC分类号： H01L25/0657 , H01L21/563 , H01L23/3128 , H01L23/3142 , H01L23/3178 , H01L23/481 , H01L2224/16145 , H01L2224/73204 , H01L2225/06513
摘要： A chip-stacked semiconductor package including a first chip having a plurality of first real bump pads and a plurality of first dummy bump pads, a second chip on the first chip, the second chip including a plurality of real bumps and a plurality of bridge dummy bumps, the plurality of real bumps electrically connected to the plurality of first real bump pads, the plurality of bridge dummy bumps connected to the plurality of first dummy bump pads, and a sealing member sealing the first chip and the second chip may be provided.
摘要翻译：一种芯片堆叠半导体封装，包括具有多个第一实际凸块焊盘和多个第一虚拟凸块焊盘的第一芯片，第一芯片上的第二芯片，所述第二芯片包括多个实际凸块和多个桥模可以提供电连接到多个第一真实凸块焊盘的多个真实凸块，连接到多个第一虚拟凸块焊盘的多个桥接虚拟凸起以及密封第一芯片和第二芯片的密封构件。

10. 发明授权

US09235622B2 System and method for an efficient query sort of a data stream with duplicate key values 有权
标题翻译：具有重复键值的数据流的高效查询排序的系统和方法
公开(公告)号：US09235622B2
公开(公告)日：2016-01-12
申请号：US12394572
申请日：2009-02-27
申请人： Yefim Shuf , Hong Min , Hubertus Franke , Allan B. Lebovitz
发明人： Yefim Shuf , Hong Min , Hubertus Franke , Allan B. Lebovitz
IPC分类号： G06F17/30
CPC分类号： G06F17/30486
摘要： An apparatus and method for efficiently performing a query sort on a data set with duplicate key values is disclosed. The method includes identifying unique key values for a key in a data set after determining that a number of duplicate key values for the key exceed a predefined threshold. The method also includes recording an association of each unique key value with a record in the data set and sorting unique key values. The method further includes storing the unique key values in a sorted order, wherein each unique key value is associated with an appropriate record in the data set.
摘要翻译：公开了一种用于对具有重复键值的数据集有效执行查询排序的装置和方法。该方法包括在确定密钥的重复密钥值的数量超过预定阈值之后，识别数据集中的密钥的唯一密钥值。该方法还包括记录每个唯一密钥值与数据集中的记录的关联并排序唯一密钥值。该方法还包括以排序顺序存储唯一键值，其中每个唯一键值与数据集中的适当记录相关联。

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