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    • 2. 发明授权
    • Monolithic multiple beam semiconductor laser
    • 单片多光束半导体激光器
    • US5012478A
    • 1991-04-30
    • US412095
    • 1989-09-25
    • Ryo HattoriHitoshi KagawaMasaki Mori
    • Ryo HattoriHitoshi KagawaMasaki Mori
    • H01S3/08H01S5/00H01S5/028H01S5/10H01S5/40
    • H01S5/4031H01S5/028
    • A monolithic multiple beam semiconductor laser having a low power and a high power beam. A number of factors in the laser are coordinated in order to assure that both the low and high power beams operate at precisely the same frequency. The front and rear facet reflectances of the respective low and high power cavities are coordinated to each other and to the rated operating power levels of the respective lasers to achieve the same operating frequency from both beams. In a particular example, the low power cavity has front and rear facet reflectivities of 30% and a rated output power of 3 mw. The high power cavity has a rated operating power of 20 mw, a front facet reflectivity of 2%, and a rear facet reflectivity of 60%.
    • 具有低功率和高功率光束的单片多光束半导体激光器。 协调激光器中的许多因素以确保低功率和高功率光束在精确相同的频率下工作。 相应的低功率腔和高功率腔的前后面反射率彼此协调,并且相应于相应激光器的额定工作功率水平,从两个光束实现相同的工作频率。 在一个特定的例子中,低功率腔的前后面反射率为30%,额定输出功率为3 mw。 高功率空腔的额定工作功率为20mw,前端面反射率为2%,后面反射率为60%。
    • 7. 发明授权
    • Optical semiconductor device
    • 光半导体器件
    • US5483095A
    • 1996-01-09
    • US308254
    • 1994-09-19
    • Hitoshi KagawaKoji Yamashita
    • Hitoshi KagawaKoji Yamashita
    • H01L23/28H01L21/56H01L23/02H01L31/0203H01L31/0216H01S5/00H01S5/022H01L33/00H01L31/12
    • H01L33/483H01L31/0203H01L31/02161H01L31/02162H01L2224/45144H01L2224/48091H01S5/02212H01S5/02248H01S5/02296H01S5/0683
    • An optical semiconductor device including one of a light responsive semiconductor element, a light emitting semiconductor element, and a light responsive and light emitting semiconductor element, and a package hermetically sealing the semiconductor element. The package includes a window of silicon that selectively transmits light incident on the semiconductor element and emitted from the semiconductor element. The Si window is connected to the package body using a solder that makes a eutectic alloy with silicon. In this structure, since the eutectic alloy is produced at the junction of the Si window and the package body, the junction is not adversely affected by external influences, especially temperature. Further, since the Si window does not transmit light in the visible light region, the inside of the package cannot be seen from the outside through the Si window after fabrication of the device. Therefore, a completed device is not judged as a defective only from an abnormal appearance, whereby the production yield is improved. Further, since the Si window is produced using a conventional Si wafer and an apparatus used in a conventional wafer processing of semiconductor devices, the Si window is produced in a relatively simple process and at low cost.
    • 包括光响应半导体元件,发光半导体元件和光响应和发光半导体元件中的一个的光学半导体器件,以及密封半导体元件的封装。 封装包括硅窗口,其选择性地透射入射在半导体元件上并从半导体元件发射的光。 Si窗口使用与硅形成共晶合金的焊料连接到封装体。 在该结构中,由于在Si窗和封装体的接合部处产生共晶合金,所以不会受到外部影响,特别是温度的不利影响。 此外,由于Si窗口在可见光区域中不透光,所以在器件制造之后,通过Si窗口不能从外部看到封装的内部。 因此,完整的装置不会因异常外观而被判断为有缺陷,从而提高了生产率。 此外,由于使用传统的Si晶片和用于半导体器件的常规晶片处理中的装置制造Si窗口,所以以相对简单的工艺和低成本生产Si窗口。
    • 10. 发明授权
    • Method for making a semiconductor laser by cleaving a cantilever
heterostructure
    • 通过切割悬臂异质结构制造半导体激光器的方法
    • US4769342A
    • 1988-09-06
    • US917678
    • 1986-10-10
    • Tetsuya YagiHitoshi Kagawa
    • Tetsuya YagiHitoshi Kagawa
    • H01S5/00H01L21/304H01L21/78H01S5/02H01S5/026H01S5/16H01L21/208B01J17/00
    • H01S5/164H01L21/3043H01L21/78H01S5/0264H01S5/0201H01S5/0202Y10S148/026Y10S148/05Y10S148/065Y10S148/095
    • A semiconductor laser device comprises a substrate (7) formed of p type GaAs, a laser diode portion (10) capable of laser oscillation and a monitor photodiode portion (11) capable of photoelectric conversion formed on substrate (7). The laser diode portion (10) and the monitor photodiode portion (11) are both formed of an epitaxial separating layer (6) of p type AlAs, an epitaxial layer group (23) mainly formed of a material of AlGaAs system and an epitaxial window layer (9) formed on a cleavage plane of this epitaxial layer group (23). The cleavage plane of the epitaxial window layer (9) on the side of the laser diode portion (10) constitutes a laser resonator plane (16) for laser light output of said laser diode portion (10) while the cleavage plane of the epitaxial window layer (9) on the monitor photodiode portion (11) constitutes a light receiving plane (17) for receiving the laser light outputted from the laser resonator plane (16).
    • 半导体激光器件包括由p型GaAs形成的衬底(7),能够激光振荡的激光二极管部分(10)和能够在衬底(7)上形成光电转换的监视器光电二极管部分(11)。 激光二极管部分(10)和监视光电二极管部分(11)均由p型AlAs的外延分离层(6),主要由AlGaAs体系的材料形成的外延层组(23)和外延窗 层(9)形成在该外延层组(23)的解理面上。 激光二极管部分(10)侧的外延窗口层(9)的解理面构成激光二极管部分(10)的激光输出的激光谐振器平面(16),同时外延窗口的解理面 监视器光电二极管部分(11)上的层(9)构成用于接收从激光谐振器平面(16)输出的激光的光接收平面(17)。