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    • 6. 发明授权
    • Semiconductor integrated circuit having multi-level interconnection, CAD method and CAD tool for designing the semiconductor integrated circuit
    • 具有多层互连的半导体集成电路,用于设计半导体集成电路的CAD方法和CAD工具
    • US07272810B2
    • 2007-09-18
    • US11019922
    • 2004-12-20
    • Hiroshige Orita
    • Hiroshige Orita
    • G06F17/50
    • G06F17/5022G06F17/5077G06F2217/78H01L2924/0002H01L2924/00
    • A computer-aided design method of an integrated circuit includes: calculating current dissipation consumed by logic elements, in a ladder network embracing a plurality of current paths connected between subject first- and second-potential-level power supply wiring; analyzing a tolerable electro-migration current of the subject first-potential-level power supply wiring; analyzing an interval voltage drop between a control point and a specific position on the subject first-potential-level power supply wiring; and comparing a summation of through-currents flowing the logic elements from the control point to the specific point, with the tolerable electro-migration current, and comparing the interval voltage drop with a tolerable voltage drop to determine an optimum location of a via configured to supply power from the subject first-potential-level power supply wiring to the logic elements.
    • 集成电路的计算机辅助设计方法包括:在包含连接在对象第一和第二电位电源布线之间的多个电流路径的梯形网络中计算由逻辑元件消耗的电流消耗; 分析对象第一电位电源布线的可容许的电迁移电流; 分析所述对象第一电位电源布线上的控制点与特定位置之间的间隔电压降; 以及将来自控制点的逻辑元件的流过的电流与允许的电迁移电流进行比较,并将间隔电压降与可容忍的电压降进行比较,以确定通孔的最佳位置被配置为 从主体第一电位电源布线向逻辑元件供电。