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1. 发明授权

US07820355B2 Radiation sensitive resin composition 有权
标题翻译：辐射敏感树脂组合物
公开(公告)号：US07820355B2
公开(公告)日：2010-10-26
申请号：US10534459
申请日：2003-11-19
申请人： Hiroshi Kurakata
发明人： Hiroshi Kurakata
IPC分类号： G03F7/004 , G03F7/028
CPC分类号： G03F7/0382
摘要： A radiation sensitive resin composition which contains an alicyclic olefin resin obtained by ring-opening polymerization of a polymerizable monomer containing an alicyclic olefin monomer having carboxyl group using a ruthenium catalyst, followed by hydrogenation, an acid-generating agent, a crosslinking agent and a solvent; and a transparent resin pattern film formed on a substrate obtained by laminating a resin film formed by using the resin composition described above to the substrate, followed by irradiation with an active radiation to form a latent pattern and developing the pattern by bringing the resin film having the latent pattern into contact with a developing solution. The resin composition exhibits excellent property for development and storage stability. The transparent resin pattern film obtained from the resin composition exhibits excellent specific permittivity, transparency, dimensional stability under heating, solvent resistance and flatness and can be utilized as the resin film for electronic parts.
摘要翻译：一种辐射敏感性树脂组合物，其含有通过使用钌催化剂，含有具有羧基的脂环族烯烃单体，然后氢化，产酸剂，交联剂和溶剂的可聚合单体的开环聚合获得的脂环式烯烃树脂 ; 以及透明树脂图案膜，其形成在基板上，所述透明树脂图案膜通过将使用上述树脂组合物形成的树脂膜层压到基板上，然后用活性辐射照射形成潜像，并使树脂膜具有潜在图案与显影液接触。树脂组合物显示出优良的显影性和储存稳定性。由树脂组合物获得的透明树脂图案膜的比介电常数，透明度，加热时的尺寸稳定性，耐溶剂性和平坦性均可以使用，可用作电子部件的树脂膜。

2. 发明申请

US20060040201A1 Radiation sensitive resin composition 有权
标题翻译：辐射敏感树脂组合物
公开(公告)号：US20060040201A1
公开(公告)日：2006-02-23
申请号：US10534459
申请日：2003-11-19
申请人： Hiroshi Kurakata
发明人： Hiroshi Kurakata
IPC分类号： G03C1/76
CPC分类号： G03F7/0382
摘要： A radiation sensitive resin composition which contains an alicyclic olefin resin obtained by ring-opening polymerization of a polymerizable monomer containing an alicyclic olefin monomer having carboxyl group using a ruthenium catalyst, followed by hydrogenation, an acid-generating agent, a crosslinking agent and a solvent; and a transparent resin pattern film formed on a substrate obtained by laminating a resin film formed by using the resin composition described above to the substrate, followed by irradiation with an active radiation to form a latent pattern and developing the pattern by bringing the resin film having the latent pattern into contact with a developing solution. The resin composition exhibits excellent property for development and storage stability. The transparent resin pattern film obtained from the resin composition exhibits excellent specific permittivity, transparency, dimensional stability under heating, solvent resistance and flatness and can be utilized as the resin film for electronic parts.
摘要翻译：一种辐射敏感性树脂组合物，其含有通过使用钌催化剂，含有具有羧基的脂环族烯烃单体，然后氢化，产酸剂，交联剂和溶剂的可聚合单体的开环聚合获得的脂环式烯烃树脂 ; 以及透明树脂图案膜，其形成在基板上，所述透明树脂图案膜通过将使用上述树脂组合物形成的树脂膜层压到基板上，然后用活性辐射照射形成潜像，并使树脂膜具有潜在图案与显影液接触。树脂组合物显示出优良的显影性和储存稳定性。由树脂组合物获得的透明树脂图案膜的比介电常数，透明度，加热时的尺寸稳定性，耐溶剂性和平坦性均可以使用，可用作电子部件的树脂膜。

3. 发明授权

US07611747B2 Insulating material, method for producing insulating material, method for manufacturing multilayer circuit board 失效
标题翻译：绝缘材料，绝缘材料的制造方法，多层电路板的制造方法
公开(公告)号：US07611747B2
公开(公告)日：2009-11-03
申请号：US10240215
申请日：2001-03-30
申请人： Kazuyuki Onishi , Toshiyasu Matsui , Hiroshi Kurakata , Masahiko Sugimura
发明人： Kazuyuki Onishi , Toshiyasu Matsui , Hiroshi Kurakata , Masahiko Sugimura
IPC分类号： B05D5/12
CPC分类号： H05K3/4673 , H05K3/227 , H05K2201/0209 , H05K2203/066 , Y10T29/49172 , Y10T428/25 , Y10T428/31678 , Y10T428/31681
摘要： This invention provides a material for a multi-layer circuit board, excellent in insulating property and burying properties and free from occurrence of cracks, a production method, and a multi-layer circuit board using the insulating material. The invention provides an insulating material having a curable composition layer wherein the curable composition layer contains 0 to 50 pieces/cm2 of foreign matter having particle sizes falling within a range of 30 to 50 μm, a production method, and a production method for a multi-layer circuit board using the insulating material.
摘要翻译：本发明提供了一种多层电路板的材料，其绝缘性能和掩埋性能优良，不发生裂纹，制造方法和使用绝缘材料的多层电路板。本发明提供了一种具有固化性组合物层的绝缘材料，其中固化性组合物层含有0〜50个/ cm 2的粒径在30〜50μm的范围内的异物，其制造方法以及制造方法使用绝缘材料的电路板。

4. 发明授权

US06653424B1 Norbornene open-ring polymers, products of hydrogenation thereof and processes for the production of both 有权
标题翻译：降冰片烯开环聚合物，其氢化产物和两者的生产方法
公开(公告)号：US06653424B1
公开(公告)日：2003-11-25
申请号：US10049648
申请日：2002-02-25
申请人： Masato Sakamoto , Daisuke Uchida , Yasuo Tsunogae , Hiroshi Kurakata
发明人： Masato Sakamoto , Daisuke Uchida , Yasuo Tsunogae , Hiroshi Kurakata
IPC分类号： C08F3208
CPC分类号： C08G61/08
摘要： Using a polymerization catalyst comprising as a main ingredient a metal compound containing a transition metal of group 6 of the periodic table and having at least one imide group and at least two substituent (A) selected from the group consisting of an alkoxy group, an aryloxy group, an alkylamide group and an arylamide group, a polycyclic norbornene monomer is polymerized to give a ring-opened norbornene polymer having a weight average molecular weight of 500 to 1,000,000 as expressed in terms of polystyrene and a melting point of 140° C. or higher. This polymer is hydrogenated to give a hydrogenated product having a melting point of 140° C. or higher.
摘要翻译：使用包含作为主要成分的含有元素周期表第6族过渡金属并具有至少一个酰亚胺基团的金属化合物和至少两个选自烷氧基，芳氧基基团，烷基酰胺基和芳基酰胺基，多环降冰片烯单体聚合得到如聚苯乙烯和熔点为140℃表示的重均分子量为500至1,000,000的开环降冰片烯聚合物，或更高。将该聚合物氢化，得到熔点为140℃以上的氢化物。

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