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1. 发明申请

US20050248012A1 Mounting structure, electro-optical device, substrate for electro-optical device, and electronic apparatus 有权
标题翻译：安装结构，电光装置，电光装置用基板和电子装置
公开(公告)号：US20050248012A1
公开(公告)日：2005-11-10
申请号：US11124578
申请日：2005-05-05
申请人： Hiroaki Furihata
发明人： Hiroaki Furihata
IPC分类号： G02F1/13 , G02F1/1345 , G02F1/1362 , G02F1/1365 , G09F9/30 , H01L23/02 , H01L23/58
CPC分类号： H01L22/32 , G02F1/1345 , G02F1/13452 , G02F2001/13456 , G02F2001/136254 , H01L2924/0002 , H01L2924/00
摘要： A mounting structure includes a mounting substrate on which a plurality of mounting pads each constituting a portion of a conductive pattern extending in a Y direction are arranged in an X direction, the X direction and the Y direction being two directions orthogonal to each other, and a member that is mounted on the mounting substrate so as to be electrically connected to the mounting pads. In the mounting structure, a first conductive layer, an insulating layer, a second conductive layer, and a third conductive layer are formed on the mounting substrate in this order from a lower side to an upper side. In addition, each conductive pattern includes the mounting pad that has a three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is an outermost layer, in this order, a test pad that is positioned adjacent to a region where the mounting pad is formed, outside a region where the member is mounted, and that has the three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is the outermost layer, in this order, and a lead portion that extends from the test pad, and that has a two-layered structure of the first conductive layer and the insulating layer, which is an outermost layer.
摘要翻译：一种安装结构，包括：安装基板，在X方向上排列有构成Y方向延伸的导电图案的一部分的多个安装焊盘，X方向和Y方向为彼此正交的两个方向，安装在安装基板上以便与安装焊盘电连接的部件。在安装结构中，在安装基板上从下侧到上侧依次形成第一导电层，绝缘层，第二导电层和第三导电层。此外，每个导电图案包括具有通过层叠作为最外层的第一导电层，绝缘层和第三导电层而形成的三层结构的安装衬垫，该测试垫是位于与形成有安装垫的区域相邻的位置，在安装有该构件的区域的外侧，并且具有通过层叠第一导电层，绝缘层和第三导电层而形成的三层结构，该三层结构是最外层，以及从测试垫延伸的引线部分，并且具有作为最外层的第一导电层和绝缘层的两层结构。

2. 发明申请

US20100045982A1 PARTICLE COUNTER AND PARTICLE COUNTING DEVICE HAVING PARTICLE COUNTER, AND PARTICLE COUNTING SYSTEM AND ITS USE METHOD 审中-公开
标题翻译：具有颗粒计数器的颗粒计数器和颗粒计数装置，以及颗粒计数系统及其使用方法
公开(公告)号：US20100045982A1
公开(公告)日：2010-02-25
申请号：US12095465
申请日：2006-11-28
申请人： Haruhiro Tsuneta , Eiichi Sugioka , Hiroshi Tonouchi , Junichi Shiozawa , Kenichi Hayashi , Tetsuo Momose , Hiroaki Furihata
发明人： Haruhiro Tsuneta , Eiichi Sugioka , Hiroshi Tonouchi , Junichi Shiozawa , Kenichi Hayashi , Tetsuo Momose , Hiroaki Furihata
IPC分类号： G01N21/00 , G06F19/00 , G08B21/00
CPC分类号： G01N15/14 , G01N35/00613 , G01N2035/009
摘要： A particle counting device 11 for detecting and counting particles in a fluid to be measured comprises a measuring section 13 for detecting particles and a control section 12 for processing the output signal from the measuring section 13. When an abnormality occurs, a signal to issue a warning is generated. With this, a constant monitoring or observation is possible. Also, a particle counting system comprising a plurality of particle counting devices 11 and an information processing device 17 for processing the results of the counting by the particle processing devices 11 is also provided. The plurality of particle counting devices 11 are electrically connected to the information processing device 17 in multiple and in parallel. Alternately, a particle counting system comprising a plurality of particle counting devices 11 for detecting and counting particles in a fluid to be measured is also provided. To one of the plurality of particle counting devices 11, the other particle counting devices 11 are electrically connected in multiple and in parallel. Therefore, a particle counting system, the measurement time of which can be shortened while maintaining the accuracy of the measurement results, and its use method are provided relatively inexpensively.
摘要翻译：用于检测和计数待测流体中的颗粒的颗粒计数装置11包括用于检测颗粒的测量部分13和用于处理来自测量部分13的输出信号的控制部分12.当异常发生时，发出信号生成警告。因此，可以进行不断的监视或观察。此外，还提供了包括多个粒子计数装置11和用于处理粒子处理装置11的计数结果的信息处理装置17的粒子计数系统。多个粒子计数装置11以多个并行的方式与信息处理装置17电连接。或者，还提供了包括用于检测和计数待测量流体中的颗粒的多个颗粒计数装置11的颗粒计数系统。对于多个粒子计数装置11之一，其他粒子计数装置11以多个并联方式电连接。因此，在保持测定结果的精度的同时可以缩短测定时间的粒子计数系统及其使用方法相对便宜。

3. 发明授权

US07495927B2 Mount structure, electro-optical device, and electronic apparatus 有权
标题翻译：安装结构，电光装置和电子设备
公开(公告)号：US07495927B2
公开(公告)日：2009-02-24
申请号：US11956478
申请日：2007-12-14
申请人： Hiroaki Furihata , Hiroyuki Onodera
发明人： Hiroaki Furihata , Hiroyuki Onodera
IPC分类号： H05K7/00
CPC分类号： H05K1/0269 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K3/305 , H05K3/325 , H05K2201/0108 , H05K2201/0133 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , H05K2201/10977 , H01L2924/00
摘要： A mounting structure includes a base member and an electronic component having a protruded electrode which is formed on a transparent substrate. The electrode includes pads and elastic projections that are covered with a conductive film. On the transparent substrate, terminals connected to the conductive film are formed. Dummy projections are provided on the surface of the base member. When mounting the electronic component, the electrodes are deformed by the pressure for the mounting. The dummy projections formed on the base member are also deformed. A pattern, for visually inspecting the deformation volume of dummy projections, is marked on the transparent substrate.
摘要翻译：安装结构包括基底构件和具有形成在透明基板上的突出电极的电子部件。电极包括用导电膜覆盖的垫和弹性突起。在透明基板上形成与导电膜连接的端子。在基部件的表面上设置有虚拟突起。当安装电子部件时，电极由于安装的压力而变形。形成在基底构件上的虚拟突起也变形。在透明基板上标记用于目视检查虚拟突起的变形体积的图案。

4. 发明申请

US20080174979A1 MOUNT STRUCTURE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS 有权
标题翻译：安装结构，电光设备和电子设备
公开(公告)号：US20080174979A1
公开(公告)日：2008-07-24
申请号：US11956478
申请日：2007-12-14
申请人： Hiroaki Furihata , Hiroyuki Onodera
发明人： Hiroaki Furihata , Hiroyuki Onodera
IPC分类号： H05K7/02
CPC分类号： H05K1/0269 , H01L23/49816 , H01L23/49838 , H01L23/4985 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K3/305 , H05K3/325 , H05K2201/0108 , H05K2201/0133 , H05K2201/0367 , H05K2201/09781 , H05K2201/10674 , H05K2201/10977 , H01L2924/00
摘要： A mounting structure includes a base member and an electronic component having a protruded electrode which is formed on a transparent substrate. The electrode includes pads and elastic projections that are covered with a conductive film. On the transparent substrate, terminals connected to the conductive film are formed. Dummy projections are provided on the surface of the base member. When mounting the electronic component, the electrodes are deformed by the pressure for the mounting. The dummy projections formed on the base member are also deformed. A pattern, for visually inspecting the deformation volume of dummy projections, is marked on the transparent substrate.
摘要翻译：安装结构包括基底构件和具有形成在透明基板上的突出电极的电子部件。电极包括用导电膜覆盖的垫和弹性突起。在透明基板上形成与导电膜连接的端子。在基部件的表面上设置有虚拟突起。当安装电子部件时，电极由于安装的压力而变形。形成在基底构件上的虚拟突起也变形。在透明基板上标记用于目视检查虚拟突起的变形体积的图案。

5. 发明授权

US07268416B2 Mounting structure, electro-optical device, substrate for electro-optical device, and electronic apparatus 有权
标题翻译：安装结构，电光装置，电光装置用基板和电子装置
公开(公告)号：US07268416B2
公开(公告)日：2007-09-11
申请号：US11124578
申请日：2005-05-05
申请人： Hiroaki Furihata
发明人： Hiroaki Furihata
IPC分类号： H01L23/02 , H01L23/001 , H01L23/194 , H01L21/53
CPC分类号： H01L22/32 , G02F1/1345 , G02F1/13452 , G02F2001/13456 , G02F2001/136254 , H01L2924/0002 , H01L2924/00
摘要： A mounting structure includes a mounting substrate on which a plurality of mounting pads each constituting a portion of a conductive pattern extending in a Y direction are arranged in an X direction, the X direction and the Y direction being two directions orthogonal to each other, and a member that is mounted on the mounting substrate so as to be electrically connected to the mounting pads. In the mounting structure, a first conductive layer, an insulating layer, a second conductive layer, and a third conductive layer are formed on the mounting substrate in this order from a lower side to an upper side. In addition, each conductive pattern includes the mounting pad that has a three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is an outermost layer, in this order, a test pad that is positioned adjacent to a region where the mounting pad is formed, outside a region where the member is mounted, and that has the three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is the outermost layer, in this order, and a lead portion that extends from the test pad, and that has a two-layered structure of the first conductive layer and the insulating layer, which is an outermost layer.
摘要翻译：一种安装结构，包括：安装基板，在X方向上排列有构成Y方向延伸的导电图案的一部分的多个安装焊盘，X方向和Y方向为彼此正交的两个方向，安装在安装基板上以便与安装焊盘电连接的部件。在安装结构中，在安装基板上从下侧到上侧依次形成第一导电层，绝缘层，第二导电层和第三导电层。此外，每个导电图案包括具有通过层叠作为最外层的第一导电层，绝缘层和第三导电层而形成的三层结构的安装衬垫，该测试垫是位于与形成有安装垫的区域相邻的位置，在安装有该构件的区域的外侧，并且具有通过层叠第一导电层，绝缘层和第三导电层而形成的三层结构，该三层结构是最外层，以及从测试垫延伸的引线部分，并且具有作为最外层的第一导电层和绝缘层的两层结构。

6. 发明授权

US06506978B1 Flexible wiring board, electrooptical device and electronic equipment 有权
标题翻译：柔性线路板，电光设备和电子设备
公开(公告)号：US06506978B1
公开(公告)日：2003-01-14
申请号：US09654119
申请日：2000-09-01
申请人： Hiroaki Furihata
发明人： Hiroaki Furihata
IPC分类号： H05K100
CPC分类号： H05K3/4635 , G02F1/13452 , H05K1/0393 , H05K3/28 , H05K3/323 , H05K3/361 , H05K3/4617 , H05K2201/0367 , H05K2203/1572
摘要： A flexible wiring board 100 includes a first single-sided flexible board 10 and a second single-sided flexible board 20. The first single-sided flexible board 10 includes a first base body 12 having an insulative property, and a first wiring layer 14 formed in a predetermined pattern on the first base body. The second single-sided flexible board 20 includes a second base body 22 having an insulative property, and a second wiring layer 24 formed in a predetermined pattern on the second base body. The first and second single-sided flexible boards respectively have insulating layers 16 and 26 covering the wiring layers 14 and 24, and the insulating layers are provided with contact sections C10 and C20. The first single-sided flexible board 10 and the second single-sided flexible board 20 are arranged so that the first wiring layer and the second wiring layer face each other, and are bonded through an anisotropically conductive adhesive layer 30.
摘要翻译：柔性布线板100包括第一单面柔性板10和第二单面柔性板20.第一单面柔性板10包括具有绝缘性的第一基体12和形成的第一布线层14 在第一基体上以预定图案。第二单面柔性板20包括具有绝缘性的第二基体22和在第二基体上以预定图案形成的第二布线层24。第一和第二单面柔性板分别具有覆盖布线层14和24的绝缘层16和26，并且绝缘层设置有接触部分C10和C20。第一单面柔性基板10和第二单面柔性基板20配置成使得第一布线层和第二布线层彼此面对，并且通过各向异性导电粘合剂层30接合。

7. 发明申请

US20050051908A1 Diode exhibiting a high breakdown voltage 审中-公开
标题翻译：二极管表现出高的击穿电压
公开(公告)号：US20050051908A1
公开(公告)日：2005-03-10
申请号：US10898887
申请日：2004-07-26
申请人： Masaki Ichinose , Akira Amano , Hideaki Ito , Hiroaki Furihata
发明人： Masaki Ichinose , Akira Amano , Hideaki Ito , Hiroaki Furihata
IPC分类号： H01L21/329 , H01L23/29 , H01L23/31 , H01L25/07 , H01L25/11 , H01L29/861 , H01L29/06 , H01L31/107
CPC分类号： H01L25/117 , H01L23/293 , H01L23/3135 , H01L24/33 , H01L29/861 , H01L2924/12036 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A diode exhibiting a high reverse breakdown voltage is manufactured by employing a flame-resisting epoxy resin, the extract of which when extracted under predetermined conditions exhibits electrical conductivity of 250 μS/cm or lower. According to the invention, sealant resins for high-voltage diodes with excellent moisture resistance are selected by employing the electrical resistance value found to be appropriate for a reference value not by assembling a high-voltage diode, but rather by conducting the predetermined humidity resistance test on the sealant resins. The sealant resin selection according to the invention facilitates reducing the resin costs, and, therefore, manufacturing high-voltage diodes exhibiting excellent humidity resistance with low manufacturing costs.
摘要翻译：表现出高反向击穿电压的二极管通过采用阻燃环氧树脂制造，其中提取物在预定条件下提取时表现出250μS/ cm以下的电导率。根据本发明，通过采用不是通过组装高压二极管的参考值而发现的电阻值，而是通过进行预定的耐湿性试验来选择具有优异耐湿性的高压二极管用密封树脂在密封剂树脂上。根据本发明的密封剂树脂选择有利于降低树脂成本，并因此制造具有优异的耐湿性和低制造成本的高压二极管。

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