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1. 发明授权

US08308072B2 Non-contact IC tag 有权
标题翻译：非接触式IC标签
公开(公告)号：US08308072B2
公开(公告)日：2012-11-13
申请号：US12937633
申请日：2009-04-15
申请人： Hikaru Satake , Kiyohiko Ito
发明人： Hikaru Satake , Kiyohiko Ito
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , H01Q1/2208 , H01Q1/38 , H01Q9/16 , H01Q9/24 , H01Q9/285
摘要： A non-contact IC tag includes an insulating substrate, an IC tag having an IC chip and a matching-circuit equipped dipole antenna connected with the IC chip, and a first and second parasitic antenna both provided at the other side of the insulating substrate. The matching-circuit equipped dipole antenna has two antenna sections, a connecting terminal section and a matching circuit section. Projection images of the first and second parasitic antennae onto the one side of the insulating substrate respectively overlap at least portions of the two antenna sections of the matching-circuit equipped dipole antenna. The first and second parasitic antennae are made electrically conductive by a connected portion, and the projection images of the first and second parasitic antennae, and the connected portion onto the one side of the insulating substrate do not overlap the IC chip and the connecting terminal section of the matching-circuit equipped dipole antenna.
摘要翻译：非接触IC标签包括绝缘基板，具有IC芯片的IC标签和与IC芯片连接的配备有匹配电路的偶极天线，以及设置在绝缘基板的另一侧的第一和第二寄生天线。配备匹配电路的偶极天线具有两个天线部分，一个连接终端部分和一个匹配电路部分。第一和第二寄生天线在绝缘基板的一侧上的投影图像分别与配备有匹配电路的偶极天线的两个天线部分的至少一部分重叠。第一和第二寄生天线通过连接部分导电，并且第一和第二寄生天线的投影图像以及连接部分到绝缘基板的一侧上不与IC芯片和连接端子部分重叠的匹配电路配备的偶极天线。

2. 发明申请

US20110024512A1 NON-CONTACT IC TAG 有权
标题翻译：非接触式IC标签
公开(公告)号：US20110024512A1
公开(公告)日：2011-02-03
申请号：US12937633
申请日：2009-04-15
申请人： Hikaru Satake , Kiyohiko Ito
发明人： Hikaru Satake , Kiyohiko Ito
IPC分类号： G06K19/077 , G06K19/073
CPC分类号： H01Q1/2225 , H01Q1/2208 , H01Q1/38 , H01Q9/16 , H01Q9/24 , H01Q9/285
摘要： A non-contact IC tag includes an insulating substrate, an IC tag having an IC chip and a matching-circuit equipped dipole antenna connected with the IC chip, and a first and second parasitic antenna both provided at the other side of the insulating substrate. The matching-circuit equipped dipole antenna has two antenna sections, a connecting terminal section and a matching circuit section. Projection images of the first and second parasitic antennae onto the one side of the insulating substrate respectively overlap at least portions of the two antenna sections of the matching-circuit equipped dipole antenna. The first and second parasitic antennae are made electrically conductive by a connected portion, and the projection images of the first and second parasitic antennae, and the connected portion onto the one side of the insulating substrate do not overlap the IC chip and the connecting terminal section of the matching-circuit equipped dipole antenna.
摘要翻译：非接触IC标签包括绝缘基板，具有IC芯片的IC标签和与IC芯片连接的配备有匹配电路的偶极天线，以及设置在绝缘基板的另一侧的第一和第二寄生天线。配备匹配电路的偶极天线具有两个天线部分，一个连接终端部分和一个匹配电路部分。第一和第二寄生天线在绝缘基板的一侧上的投影图像分别与配备有匹配电路的偶极天线的两个天线部分的至少一部分重叠。第一和第二寄生天线通过连接部分导电，并且第一和第二寄生天线的投影图像以及连接部分到绝缘基板的一侧上不与IC芯片和连接端子部分重叠的匹配电路配备的偶极天线。

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