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1. 发明授权

US4766364A Parallel power systems 失效
标题翻译：并联电力系统
公开(公告)号：US4766364A
公开(公告)日：1988-08-23
申请号：US116855
申请日：1987-11-04
申请人： Robert A. Biamonte , Joseph W. Bogdanski , Kevin R. Covi , Herman P. Meyer , Daniel I. Rafkind
发明人： Robert A. Biamonte , Joseph W. Bogdanski , Kevin R. Covi , Herman P. Meyer , Daniel I. Rafkind
IPC分类号： G05F1/59 , H02H7/20 , H02J1/10 , H02J9/06 , H02M3/28 , G05F1/46
CPC分类号： G05F1/59 , H02M3/285 , Y10T307/582 , Y10T307/707
摘要： A d.c. power supply system comprises a plurality of voltage regulating power supplies connected in a master slave configuration, the number of regulators being one greater than required to provide load current requirements. The master regulator generates a control signal to control the output of the individual slave regulators to provide balanced load sharing. Failure of one of the slave regulators is detected and the failed regulator replaced by the redundant regulator without interference to the output load current. Failure of the master regulator is detected by steering circuitry within each slave which senses an improper master error signal and transfers control to the reference error amplifier circuity of the slave regulators. Diagnosis of the error conditions is provided by logical analysis of output currents.

2. 发明授权

US5446314A Low profile metal-ceramic-metal packaging 失效
标题翻译：薄型金属陶瓷金属包装
公开(公告)号：US5446314A
公开(公告)日：1995-08-29
申请号：US157721
申请日：1992-06-09
申请人： Paul J. Melnick , Anthony J. Mennella, Jr. , Herman P. Meyer
发明人： Paul J. Melnick , Anthony J. Mennella, Jr. , Herman P. Meyer
IPC分类号： H01L23/02 , H01L21/98 , H01L23/32 , H01L25/07 , H01L23/12 , H01L23/16 , H01L23/42
CPC分类号： H01L25/50 , H01L25/071 , H01L2924/0002
摘要： A heat-conductive honeycomb ceramic spacer having an array of apertures for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks using a low-profile contact comprising a foil with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet. Use of such a foil also allows disconnection of defective stacks in the device. Extra stacks are provided to compensate for defective stacks, according to an n-x design philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.
摘要翻译：一种具有孔阵列的导热蜂窝陶瓷间隔物，其具有便于使用包括多个半导体叠层的半透明触点组装的半导体器件的组件，所述薄型触点包括具有对应于陶瓷间隔件中的孔的位置的凸起部分的箔，用于形成触点当间隔物和叠层夹在箔和另一导电片之间时，半导体堆叠。使用这样的箔还允许断开装置中的有缺陷的堆叠。根据n-x设计理念，提供额外的堆栈来补偿有缺陷的堆叠。焊料预成型件可以包括在堆叠中，并且通过引起焊料预成型件的回流而与导电片的箔片形成增强的连接。本发明也可以应用于多层设备结构。

3. 发明授权

US5140298A Ceramic base component packaging assembly 失效
标题翻译：陶瓷基部件包装装配
公开(公告)号：US5140298A
公开(公告)日：1992-08-18
申请号：US578698
申请日：1990-09-04
申请人： James C. Gordon , Eric P. Lovgren , Herman P. Meyer , Donald P. Rearick
发明人： James C. Gordon , Eric P. Lovgren , Herman P. Meyer , Donald P. Rearick
IPC分类号： H01C1/02 , H01C1/08 , H01C1/084
CPC分类号： H01C1/084
摘要： A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device.

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