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    • 2. 发明授权
    • Non-volatile semiconductor memory device and method of manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US07785964B2
    • 2010-08-31
    • US12078406
    • 2008-03-31
    • Jin-Jun ParkHee-Jin KwakBeom-Jun Jin
    • Jin-Jun ParkHee-Jin KwakBeom-Jun Jin
    • H01L21/336
    • H01L21/28273H01L27/115H01L29/66825
    • Example embodiments relate to a non-volatile semiconductor memory device and a method of manufacturing the same. A semiconductor device includes an isolation layer protruding from a substrate, a spacer, a tunnel insulation layer, a floating gate, a dielectric layer pattern and a control gate. The spacer may be formed on a sidewall of a protruding portion of the isolation layer. The tunnel insulation layer may be formed on the substrate between adjacent isolation layers. The floating gate may be formed on the tunnel insulation layer. The floating gate contacts the spacer and has a width that gradually increases from a lower portion toward an upper portion. The dielectric layer pattern and the control gate may be sequentially formed on the floating gate.
    • 示例性实施例涉及非易失性半导体存储器件及其制造方法。 半导体器件包括从衬底突出的隔离层,间隔物,隧道绝缘层,浮动栅极,电介质层图案和控制栅极。 间隔件可以形成在隔离层的突出部分的侧壁上。 隧道绝缘层可以形成在相邻隔离层之间的衬底上。 浮栅可以形成在隧道绝缘层上。 浮动栅极接触间隔件,并且具有从下部朝向上部逐渐增加的宽度。 电介质层图案和控制栅极可以顺序地形成在浮动栅极上。