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1. 发明授权

US08138803B2 Apparatus and method for selectively enabling and disabling a squelch circuit across AHCI and SATA power states 有权
标题翻译：用于选择性地启用和禁用跨AHCI和SATA电源状态的静噪电路的装置和方法
公开(公告)号：US08138803B2
公开(公告)日：2012-03-20
申请号：US11902944
申请日：2007-09-26
申请人： Jien-Hau Ng , Tea M. Lee
发明人： Jien-Hau Ng , Tea M. Lee
IPC分类号： H03K5/22
CPC分类号： H03G3/342
摘要： An apparatus and a method are provided for selectively enabling and disabling a squelch circuit in a Serial Advanced Technology Attachment (SATA) host or SATA device while maintaining proper operation of the host and device. An apparatus and method are provided which allow the squelch circuit to be selectively enabled and disabled across SATA power states (PHY Ready, Partial, and Slumber) and in Advanced Host Controller Interface (AHCI) Listen mode.
摘要翻译：提供了一种装置和方法，用于选择性地启用和禁用串行高级技术附件（SATA）主机或SATA设备中的静噪电路，同时保持主机和设备的适当操作。提供了一种装置和方法，其允许在SATA功率状态（PHY就绪，部分和睡眠）以及高级主机控制器接口（AHCI）监听模式中选择性地启用和禁用静噪电路。

2. 发明申请

US20080001480A1 Serial advanced technology attachment device presence detection and hot-plug in low power mode 有权
标题翻译：串行高级技术附件设备存在检测和低功耗模式下的热插拔
公开(公告)号：US20080001480A1
公开(公告)日：2008-01-03
申请号：US11479413
申请日：2006-06-30
申请人： Eng Hun Ooi , Fei Deng , Jien Hau Ng , Serge Bedwani , Siang Lin Tan
发明人： Eng Hun Ooi , Fei Deng , Jien Hau Ng , Serge Bedwani , Siang Lin Tan
IPC分类号： H02J1/00 , H02J3/00
CPC分类号： G06F13/4081 , Y10T307/724
摘要： A method, circuit, and system are disclosed. In one embodiment, the method comprises sending a step pulse across a serial advanced technology attachment (SATA) transmission line, determining the length of time the transmission line takes to charge from common mode voltage to supply voltage, and determining whether a device is connected to the SATA transmission line based on the length of the transmission line charge time.
摘要翻译：公开了一种方法，电路和系统。在一个实施例中，该方法包括在串行高级技术附件（SATA）传输线上发送步进脉冲，确定传输线从共模电压充电到电源电压所需的时间长度，以及确定设备是否连接到 SATA传输线基于传输线充电时间的长短。

3. 发明申请

US20060223237A1 Method of manufacturing enhanced thermal dissipation integrated circuit package 审中-公开
标题翻译：制造增强散热集成电路封装的方法
公开(公告)号：US20060223237A1
公开(公告)日：2006-10-05
申请号：US11367708
申请日：2006-03-06
申请人： Edward Combs , Robert Sheppard , Tai Pun , Hau Ng , Chan Fan , Neil McLellan
发明人： Edward Combs , Robert Sheppard , Tai Pun , Hau Ng , Chan Fan , Neil McLellan
IPC分类号： H01L21/00
CPC分类号： H01L21/4871 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
摘要翻译：本发明涉及具有热耦合到半导体管芯和散热器的导热元件的集成电路封装以及制造所述集成电路封装的方法。导热元件集成到封装中以增强封装的散热特性。

4. 发明申请

US20050003585A1 Method of manufacturing an enhanced thermal dissipation integrated circuit package 失效
标题翻译：制造增强散热集成电路封装的方法
公开(公告)号：US20050003585A1
公开(公告)日：2005-01-06
申请号：US10803782
申请日：2004-03-18
申请人： Edward Combs , Robert Sheppard , Tai Pun , Hau Ng , Chun Fan , Neil McLellen
发明人： Edward Combs , Robert Sheppard , Tai Pun , Hau Ng , Chun Fan , Neil McLellen
IPC分类号： H01L23/433 , H01L21/44
CPC分类号： H01L21/4871 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
摘要翻译：本发明涉及具有热耦合到半导体管芯和散热器的导热元件的集成电路封装以及制造所述集成电路封装的方法。导热元件集成到封装中以增强封装的散热特性。

5. 发明授权

US08686757B2 Apparatus and method for selectively enabling and disabling a squelch circuit across AHCI and SATA power states 有权
标题翻译：用于选择性地启用和禁用跨AHCI和SATA电源状态的静噪电路的装置和方法
公开(公告)号：US08686757B2
公开(公告)日：2014-04-01
申请号：US13423926
申请日：2012-03-19
申请人： Jien-Hau Ng , Tea M. Lee
发明人： Jien-Hau Ng , Tea M. Lee
IPC分类号： H03K5/22
CPC分类号： H03G3/342
摘要： An apparatus and a method are provided for selectively enabling and disabling a squelch circuit in a Serial Advanced Technology Attachment (SATA) host or SATA device while maintaining proper operation of the host and device. An apparatus and method are provided which allow the squelch circuit to be selectively enabled and disabled across SATA power states (PHY Ready, Partial, and Slumber) and in Advanced Host Controller Interface (AHCI) Listen mode.
摘要翻译：提供了一种装置和方法，用于选择性地启用和禁用串行高级技术附件（SATA）主机或SATA设备中的静噪电路，同时保持主机和设备的适当操作。提供了一种装置和方法，其允许在SATA功率状态（PHY就绪，部分和睡眠）以及高级主机控制器接口（AHCI）监听模式中选择性地启用和禁用静噪电路。

6. 发明申请

US20120280719A1 Apparatus and Method for Selectively Enabling and Disabling a Squelch Circuit Across AHCI and SATA Power States 有权
标题翻译：选择性地启用和禁用AHCI和SATA电源状态下的静噪电路的装置和方法
公开(公告)号：US20120280719A1
公开(公告)日：2012-11-08
申请号：US13423926
申请日：2012-03-19
申请人： Jien-Hau Ng , Tea M. Lee
发明人： Jien-Hau Ng , Tea M. Lee
IPC分类号： H03K5/22
CPC分类号： H03G3/342
摘要： An apparatus and a method are provided for selectively enabling and disabling a squelch circuit in a Serial Advanced Technology Attachment (SATA) host or SATA device while maintaining proper operation of the host and device. An apparatus and method are provided which allow the squelch circuit to be selectively enabled and disabled across SATA power states (PHY Ready, Partial, and Slumber) and in Advanced Host Controller Interface (AHCI) Listen mode.
摘要翻译：提供了一种装置和方法，用于选择性地启用和禁用串行高级技术附件（SATA）主机或SATA设备中的静噪电路，同时保持主机和设备的适当操作。提供了一种装置和方法，其允许在SATA功率状态（PHY就绪，部分和睡眠）以及高级主机控制器接口（AHCI）监听模式中选择性地启用和禁用静噪电路。

7. 发明申请

US20090083587A1 Apparatus and method for selectively enabling and disabling a squelch circuit across AHCI and SATA power states 有权
标题翻译：用于选择性地启用和禁用跨AHCI和SATA电源状态的静噪电路的装置和方法
公开(公告)号：US20090083587A1
公开(公告)日：2009-03-26
申请号：US11902944
申请日：2007-09-26
申请人： Jien-Hau Ng , Tea M. Lee
发明人： Jien-Hau Ng , Tea M. Lee
IPC分类号： G06F11/30
CPC分类号： H03G3/342
摘要： An apparatus and a method are provided for selectively enabling and disabling a squelch circuit in a Serial Advanced Technology Attachment (SATA) host or SATA device while maintaining proper operation of the host and device. An apparatus and method are provided which allow the squelch circuit to be selectively enabled and disabled across SATA power states (PHY Ready, Partial, and Slumber) and in Advanced Host Controller Interface (AHCI) Listen mode.
摘要翻译：提供了一种装置和方法，用于选择性地启用和禁用串行高级技术附件（SATA）主机或SATA设备中的静噪电路，同时保持主机和设备的适当操作。提供了一种装置和方法，其允许在SATA功率状态（PHY就绪，部分和睡眠）以及高级主机控制器接口（AHCI）监听模式中选择性地启用和禁用静噪电路。

8. 发明授权

US07565457B2 Serial advanced technology attachment device presence detection and hot-plug in low power mode 有权
标题翻译：串行高级技术附件设备存在检测和低功耗模式下的热插拔
公开(公告)号：US07565457B2
公开(公告)日：2009-07-21
申请号：US11479413
申请日：2006-06-30
申请人： Eng Hun Ooi , Fei Deng , Jien Hau Ng , Serge Bedwani , Siang Lin Tan
发明人： Eng Hun Ooi , Fei Deng , Jien Hau Ng , Serge Bedwani , Siang Lin Tan
IPC分类号： G06F3/00 , G06F13/00
CPC分类号： G06F13/4081 , Y10T307/724
摘要： A method, circuit, and system are disclosed. In one embodiment, the method comprises sending a step pulse across a serial advanced technology attachment (SATA) transmission line, determining the length of time the transmission line takes to charge from common mode voltage to supply voltage, and determining whether a device is connected to the SATA transmission line based on the length of the transmission line charge time.
摘要翻译：公开了一种方法，电路和系统。在一个实施例中，该方法包括在串行高级技术附件（SATA）传输线上发送步进脉冲，确定传输线从共模电压充电到电源电压所需的时间长度，以及确定设备是否连接到 SATA传输线基于传输线充电时间的长短。

9. 发明申请

US20090012825A1 Method for determining and/or managing corrosion and/or contamination 审中-公开
标题翻译：用于确定和/或控制腐蚀和/或污染的方法
公开(公告)号：US20090012825A1
公开(公告)日：2009-01-08
申请号：US11708173
申请日：2007-02-20
申请人： Ik-Hau Ng
发明人： Ik-Hau Ng
IPC分类号： G06Q10/00 , G06Q50/00
CPC分类号： G06Q10/06 , G06Q10/06395 , G06Q30/0203
摘要： The present invention generally relates to methods for determining and/or managing corrosion and/or contamination. More specifically, the present invention relates to various methods to identify, determine and/or quantify the nature, amount and/or extent of corrosion and/or contamination situations, issues and/or concerns in various commercial, production and/or industrial supply chains. In another embodiment, the present invention permits one to identify, determine and/or quantify the nature, amount and/or extent of corrosion and/or contamination situations, issues and/or concerns in various commercial and/or industrial supply chains and recommends various methods by which to mitigate, reduce and/or eliminate such corrosion and/or contamination. In still another embodiment, the present invention provides a method for matching and/or developing specific products, systems, and/or services to solve, address and/or identify corrosion and/or contamination situations, issues and/or concerns.
摘要翻译：本发明一般涉及用于确定和/或控制腐蚀和/或污染的方法。更具体地，本发明涉及用于识别，确定和/或量化各种商业，生产和/或工业供应链中的腐蚀和/或污染情况，问题和/或问题的性质，数量和/或程度的各种方法。在另一个实施方案中，本发明允许在各种商业和/或工业供应链中识别，确定和/或量化腐蚀和/或污染情况，问题和/或问题的性质，数量和/或程度，并推荐各种减轻和/或消除这种腐蚀和/或污染的方法。在另一个实施例中，本发明提供了一种用于匹配和/或开发特定产品，系统和/或服务以解决，解决和/或识别腐蚀和/或污染情况，问题和/或问题的方法。

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