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1. 发明申请

US20130034259A1 EARPHONE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：耳机及其制造方法
公开(公告)号：US20130034259A1
公开(公告)日：2013-02-07
申请号：US13451781
申请日：2012-04-20
申请人： YI XIONG , ZHI-HUA LIN , HAI-BING JIANG
发明人： YI XIONG , ZHI-HUA LIN , HAI-BING JIANG
IPC分类号： H04R1/10 , B23P11/00
CPC分类号： H04R1/1033 , H04R1/10 , H04R1/1058 , H04R1/1075 , H04R31/00 , Y10T29/49002 , Y10T29/49005 , Y10T29/4908 , Y10T29/49826
摘要： An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.
摘要翻译：耳机包括耳机壳体，位于耳机中的扬声器和连接到扬声器的耳机电缆。耳机壳体具有第一壳体和第二壳体。第一壳体形成第一连接表面，并且第二壳体形成第二连接表面。第一连接表面和第二连接表面彼此抵接并且超声熔合在一起，其中形成多余的塑料并且沿着熔合线布置。还提供了制造上述耳机的方法。该方法还包括沿着形成在第一壳体和在超声波融合期间制造的第二壳体之间的定影线布置的多余塑料的形成，通过切割器去除耳机电话的多余塑料，以及通过研磨装置。

2. 发明授权

US08887375B2 Method for manufacturing earphone 有权
标题翻译：制造耳机的方法
公开(公告)号：US08887375B2
公开(公告)日：2014-11-18
申请号：US13451781
申请日：2012-04-20
申请人： Yi Xiong , Zhi-Hua Lin , Hai-Bing Jiang
发明人： Yi Xiong , Zhi-Hua Lin , Hai-Bing Jiang
IPC分类号： H04R31/00 , H04R1/10
CPC分类号： H04R1/1033 , H04R1/10 , H04R1/1058 , H04R1/1075 , H04R31/00 , Y10T29/49002 , Y10T29/49005 , Y10T29/4908 , Y10T29/49826
摘要： An earphone includes an earphone housing, a speaker positioned in the earphone, and an earphone cable connected to the speaker. The earphone housing has a first housing and a second housing. The first housing forms a first connecting surface, and the second housing forms a second connecting surface. The first connecting surface and the second connecting surface abut against each other and are ultrasonically fused together, in which excess plastic is formed and arranged along a fusing line. A method of manufacturing above-described earphone is also provided. The method also includes the forming of an excess plastic arranged along a fusing line formed between the first housing and the second housing made during ultrasonic fusion, the removing of excess plastic of the earphone phone by a cutter, and the grinding of the earphone housing by a grinding device.
摘要翻译：耳机包括耳机壳体，位于耳机中的扬声器和连接到扬声器的耳机电缆。耳机壳体具有第一壳体和第二壳体。第一壳体形成第一连接表面，并且第二壳体形成第二连接表面。第一连接表面和第二连接表面彼此抵接并且超声熔合在一起，其中形成多余的塑料并且沿着熔合线布置。还提供了制造上述耳机的方法。该方法还包括沿着形成在第一壳体和在超声波融合期间制造的第二壳体之间的定影线布置的多余塑料的形成，通过切割器去除耳机电话的多余塑料，以及通过研磨装置。

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