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    • 3. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US07534553B2
    • 2009-05-19
    • US11264427
    • 2005-10-31
    • Sung-Kwon LeeGyu-Dong Park
    • Sung-Kwon LeeGyu-Dong Park
    • G03F7/26
    • H01L21/02118G03F7/09H01L21/022H01L21/02337H01L21/312
    • A method for fabricating a semiconductor device is provided. The method includes: preparing a substrate defined as active regions and inactive regions and provided with a plurality of conductive patterns; forming a buffer layer over the plurality of conductive patterns; forming an organic material having fluidity better than that of a photoresist layer on the buffer layer; flowing the organic material between the conductive patterns through a thermal treatment process, thereby filling a portion of each gap between the conductive patterns; forming the photoresist layer over the organic material and the buffer layer; forming a plurality of photoresist patterns opening the active regions through a photo-exposure process and a developing process; and performing an ion-implantation process using the plurality of photoresist patterns, thereby forming a plurality of junction regions in the active regions of the substrate.
    • 提供一种制造半导体器件的方法。 该方法包括:制备定义为有源区和非活性区的衬底,并设置有多个导电图案; 在所述多个导电图案上形成缓冲层; 形成流动性优于缓冲层上的光致抗蚀剂层的有机材料; 通过热处理工艺使有机材料在导电图案之间流动,由此填充导电图案之间的每个间隙的一部分; 在有机材料和缓冲层上形成光致抗蚀剂层; 形成通过曝光过程和显影过程打开活性区域的多个光致抗蚀剂图案; 以及使用所述多个光致抗蚀剂图案进行离子注入工艺,从而在所述衬底的有源区域中形成多个结区域。