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    • 1. 发明授权
    • Integral differential and static pressure transducer
    • 积分微分和静压传感器
    • US4528855A
    • 1985-07-16
    • US626804
    • 1984-07-02
    • Gurnam Singh
    • Gurnam Singh
    • G01L9/00G01L9/06G01L19/00
    • G01L19/0092G01L15/00G01L9/0054G01L9/065
    • Differential and static pressure transducers are provided with piezoresistive elements connected in Wheatstone bridges on the 100 surface of a silicon chip over a diaphragm etched into the chip from the back. A thin disk diaphragm is used for differential pressure (DP) and a thicker annular diaphragm around the disk diaphragm is used for static pressure (SP) measurements. Two of the elements opposite each other in each bridge are produced along one crystallographic direction (110), and the other two are produced along an orthogonal crystallographic direction (110). Extra elements are produced for each pair to permit selection of a more closely matched set of four elements. A plurality of DP diaphragms with different diameters and respective bridges are provided along with a multiplexer for selecting a DP bridge in order to provide different ranges of sensitivity for the differential pressure measurements.
    • 差分和静态压力传感器提供了压电元件,其连接在硅芯片的100个表面的惠斯通电桥中,从背面蚀刻到芯片上的隔膜上。 薄膜隔膜用于差压(DP),环形隔膜周围的较厚环形隔膜用于静压(SP)测量。 在每个桥中彼此相对的两个元件沿着一个晶体学方向(110)产生,而另外两个元件沿着正交晶体学方向(1& upbar&10)产生。 为每对产生额外的元素,以允许选择更紧密匹配的四个元素集合。 提供具有不同直径的多个DP隔膜和相应的桥,以及用于选择DP桥的多路复用器,以便为差压测量提供不同的灵敏度范围。
    • 3. 发明授权
    • Method for low temperature bonding of silicon and silicon on sapphire
and spinel to nickel and nickel steel and apparatus using such _a
bonding technique
    • 将蓝宝石和尖晶石上的硅和硅低温键合到镍和镍钢的方法以及使用这种键合技术的设备
    • US4278195A
    • 1981-07-14
    • US965350
    • 1978-12-01
    • Gurnam Singh
    • Gurnam Singh
    • B23K35/00B23K35/28C03C27/00H01L21/60H05K5/06
    • H01L24/83B23K35/004B23K35/286C03C27/00H01L24/26B23K2035/008H01L2224/8319H01L2224/83801H01L2924/01006H01L2924/01013H01L2924/01014H01L2924/01322H01L2924/09701
    • A method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel using a layered structure with an aluminum interface between the nickel or nickel steel and the silicon. The bonding is achieved in a reducing atmosphere using a temperature of 640 to 650 degrees C. with a pressure of 100 to 150 psi on the layered structure for a period of approximately five minutes with a subsequent cooling to avoid strains in the bond. An example of the transducer apparatus utilizing such a bonding technique includes a nickel steel housing and a silicon on spinel transducer wafer having a silicon peripheral pad with an aluminum layer bonding the silicon pad to the nickel steel housing.BACKGROUND OF THE INVENTION1. Field of the InventionThe present invention relates to bonding techniques. More specifically, the present invention is directed to a method for bonding silicon to nickel and a transducer apparatus utilizing such a bonding technique.2. Description of the Prior ArtThe development of transducers such as those shown in U.S. Pat. Nos. 3,230,763 and 3,537,319 has led to a composite structure using silicon on sapphire (SOS). The sapphire with a silicon epitaxial layer grown on it may be used for pressure transducers and provides, in effect, strain sensitive resistors. The strain sensitive elements are shaped on the sapphire wafer by a suitable etching process with the resulting wafer being cut into a desired configuration by a diamond saw. A recent development has taken advantage of an improved stress transmission characteristic which is produced by having the composite transducer structure utilize silicon on spinel. Such a structure results in a superior transducer while retaining its electrical insulating characteristics. The production of such silicon on sapphire and silicon on spinel is a well-known technique and is discussed in the Journal of Crystal Growth (1971) in an article by G. W. Cullen on pages 107 to 125 entitled "The preparation and Properties of Chemically Vapor Deposited Silicon on Sapphire and Spinel." In both of these structures the composite end product must be ultimately bonded to a metal support or transducer housing in order to produce a viable transducer. The poor wettability of spinel and sapphire by many metals is well-known and offers a serious problem to the bonding of these materials to metals as well as to ceramics and glasses. One prior art attempt to bond sapphire to metal involved the growing of multiple metallic layers on one or both of the elements and then fusing them together at relatively high temperatures. However, the high temperatures involved can damage the strain elements deposited on the sapphire. On the other hand, the bonding of silicon on spinel to metal remains a problem which has limited the use of the corresponding composite transducer in a useful product.SUMMARY OF THE INVENTIONAn object of the present invention is to produce a method for bonding silicon to nickel.Another of the present invention is to produce an improved transducer apparatus utilizing a novel method of bonding of silicon to nickel.In accomplishing these and other objects, there has been provided, in accordance with the present invention, a low temperature bonding method for bonding silicon to nickel by introducing therebetween a layer of aluminum and subjecting the layered structure to a pressure of 100 to 150 psi at a temperature of 640 to 650 degrees C. for a period of approximately five minutes in a reducing atmosphere. An example of a transducer apparatus utilizing such a bonding technique includes a nickel steel housing and a silicon on spinel transducer wafer having silicon peripheral pads with an aluminum layer bonding the silicon pads to the nickel steel housing.
    • 使用在镍或镍钢与硅之间具有铝界面的分层结构将蓝宝石和尖晶石上的硅和硅低温键合到镍和镍钢的方法。 在还原气氛中使用640至650℃的温度在100至150psi的压力下在层状结构上实现约5分钟的接合,随后冷却以避免粘结中的应变。 使用这种接合技术的传感器装置的示例包括镍钢外壳和尖晶石换能器晶片上的硅,其具有硅外围垫,其具有将硅垫接合到镍钢外壳的铝层。
    • 5. 发明授权
    • Pressure measuring apparatus
    • 压力测量仪
    • US4395915A
    • 1983-08-02
    • US408296
    • 1982-08-16
    • Gurnam Singh
    • Gurnam Singh
    • G01L9/00G01L9/06G01L13/02G01L19/00G01L9/04
    • G01L19/0092G01L13/025G01L9/0052G01L9/0055G01L9/06
    • An apparatus which utilizes solid state piezoresistive strain sensing means to measure the static pressure as well as the differential pressure across a primary element, such as an orifice plate, venturi tube, nozzle or wedge. In a preferred embodiment, the apparatus includes a dual pressure sensing transducer comprising a body, means for applying two different pressures to the body, first and second pressure diaphragms respectively, hermetically sealed to the body at first and second spaced apart portions of the body with a back wall of the second diaphragm forming one wall of a chamber which contains a desired reference pressure, a compliant cantilever beam fixedly mounted at one end thereof to the body, a strut wire coupled between the beam and the first diaphragm to cause deflection of the beam in response to movement of the first diaphragm due to an applied differential pressure, a first plurality of piezoresistive strain elements contained on a thinned portion of the beam for deflection therewith so that movement of the first diaphragm will result in changes in the electrical resistance of the first plurality of elements that are indicative of the differential pressure applied across the first diaphragm, a second plurality of piezoresistive strain elements contained on a front wall of the second diaphragm for deflection therewith so that movement of the second diaphragm in response to the static (line) pressure will result in changes in the electrical resistance of the second plurality of elements that are indicative of the static pressure with respect to the reference pressure.
    • 利用固态压阻应变传感装置来测量静压力以及诸如孔板,文丘里管,喷嘴或楔子之类的主要元件之间的差压的装置。 在一个优选实施例中,该装置包括双重压力传感换能器,其包括主体,用于向主体施加两个不同压力的装置,第一和第二压力隔膜,分别在主体的第一和第二间隔部分处与主体气密密封, 第二隔膜的后壁形成包含期望的参考压力的室的一个壁,其一端固定地安装在主体上的顺从悬臂梁,连接在梁和第一隔膜之间的支柱线, 响应于由于施加的压差而引起的第一隔膜的移动而产生的第一多个压阻应变元件包含在用于偏转的梁的变薄部分上,使得第一隔膜的移动将导致电阻的变化 指示施加在第一隔膜上的差压的第一多个元件 m,第二多个压阻应变元件,包含在第二隔膜的前壁上,用于与其一起偏转,使得响应于静态(线)压力的第二隔膜的移动将导致第二多个 指示相对于参考压力的静压力的元件。
    • 8. 发明授权
    • Pressure measuring apparatus
    • 压力测量仪
    • US4347745A
    • 1982-09-07
    • US309331
    • 1981-10-06
    • Gurnam Singh
    • Gurnam Singh
    • G01L9/00G01L9/06G01L13/02G01L19/00G01L19/02G01L19/04
    • G01L19/0092G01L13/025G01L19/02G01L9/0052G01L9/0055G01L9/065
    • An apparatus which utilizes solid state piezoresistive strain sensing means to measure the static pressure as well as the differential pressure across a primary element, such as an orifice plate, venturi tube, nozzle or wedge. In a preferred embodiment, the apparatus includes a dual pressure sensing transducer comprising a body, means for applying two different pressures to the body, first and second pressure diaphragms respectively, hermetically sealed to the body at first and second spaced apart portions of the body with a back wall of the second diaphragm forming one wall of a chamber which contains a desired reference pressure, a compliant cantilever beam fixedly mounted at one end thereof to the body, a strut wire coupled between the beam and the first diaphragm to cause deflection of the beam in response to movement of the first diaphragm due to an applied differential pressure, a first plurality of piezoresistive strain elements contained on a thinned portion of the beam, a second plurality of piezoresistive strain elements contained on a front wall of the second diaphragm.
    • 利用固态压阻应变传感装置来测量静压力以及诸如孔板,文丘里管,喷嘴或楔子之类的主要元件之间的差压的装置。 在一个优选实施例中,该装置包括双重压力传感换能器,其包括主体,用于向主体施加两个不同压力的装置,第一和第二压力隔膜,分别在主体的第一和第二间隔部分处与主体气密密封, 第二隔膜的后壁形成包含期望的参考压力的室的一个壁,其一端固定地安装在主体上的顺从悬臂梁,连接在梁和第一隔膜之间的支柱线, 响应于由施加的压差引起的第一隔膜的移动,包含在梁的减薄部分上的第一多个压阻应变元件,包含在第二隔膜的前壁上的第二多个压阻应变元件。