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1. 发明授权

US07543917B2 Integrated circuit and method for manufacturing 有权
标题翻译：集成电路及制造方法
公开(公告)号：US07543917B2
公开(公告)日：2009-06-09
申请号：US11540321
申请日：2006-09-29
申请人： Simon Dodd , S. Jonathan Wang , Dennis W. Tom , Frank R. Bryant , Terry E. McMahon , Richard Todd Miller , Gregory T. Hindman
发明人： Simon Dodd , S. Jonathan Wang , Dennis W. Tom , Frank R. Bryant , Terry E. McMahon , Richard Todd Miller , Gregory T. Hindman
IPC分类号： B41J2/05
CPC分类号： B41J2/1628 , B41J2/14129 , B41J2/1603 , B41J2202/13 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a semiconductor device, the method including forming a substrate including a first surface having a non-doped region, forming an insulative material over the first surface of the substrate, forming a first conductive material over the first insulative material, forming an opening in the first conductive material that forms a path to the substrate that is substantially free of the first conductive material and the first insulative material, forming a second insulative material over the first conductive material, and forming a second conductive material over the second insulative material, wherein the second conductive material is formed in the opening and contacts the non-doped region of the substrate.
摘要翻译：一种形成半导体器件的方法，所述方法包括形成包括具有非掺杂区域的第一表面的衬底，在所述衬底的第一表面上形成绝缘材料，在所述第一绝缘材料上形成第一导电材料，形成第在所述第一导电材料中开口，所述第一导电材料形成基本上不含所述第一导电材料和所述第一绝缘材料的路径，在所述第一导电材料上形成第二绝缘材料，以及在所述第二绝缘材料上形成第二导电材料，其中所述第二导电材料形成在所述开口中并接触所述衬底的非掺杂区域。

2. 发明授权

US5443713A Thin-film structure method of fabrication 失效
标题翻译：薄膜结构制造方法
公开(公告)号：US5443713A
公开(公告)日：1995-08-22
申请号：US336355
申请日：1994-11-08
申请人： Gregory T. Hindman
发明人： Gregory T. Hindman
IPC分类号： B41J2/16 , C25D1/10
CPC分类号： B41J2/1625 , B41J2/162 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： A process for fabricating a thin-film structure using a transparent substrate is disclosed. A first structure, such as a ring, is formed of a dielectric material on a conductive material layer. The conductive material is partially removed, such as within the center of the ring structure. A photoresist material pillar is formed to fill the center of the ring structure, protruding above the ring structure rim. Such structures are useful as mandrel structures in the forming of precision components, such as nozzle plates, mesh ink filter screens, and the like, for ink-jet pens.
摘要翻译：公开了一种使用透明基板制造薄膜结构的方法。诸如环的第一结构由介电材料形成在导电材料层上。导电材料被部分去除，例如在环结构的中心内。形成光致抗蚀剂材料柱以填充环形结构的中心，突出在环形结构边缘上方。这种结构在形成用于喷墨笔的精密部件（例如喷嘴板，网眼滤网等）中的心轴结构是有用的。

3. 发明授权

US06441838B1 Method of treating a metal surface to increase polymer adhesion 失效
标题翻译：处理金属表面以增加聚合物粘合力的方法
公开(公告)号：US06441838B1
公开(公告)日：2002-08-27
申请号：US09765825
申请日：2001-01-19
申请人： Gregory T. Hindman , Domingo A. Figueredo , Ronald L. Enck
发明人： Gregory T. Hindman , Domingo A. Figueredo , Ronald L. Enck
IPC分类号： G01D928
CPC分类号： B41J2/1606 , B41J2/14129
摘要： A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF4), fluoroform (CHF3), hexafluoroethane (C2F6), difluoromethane (CH2F2), pentafluoroethane (C2HF5), tetrafluoroethane (C2H2F4), or octafluorobutene (C4F8).
摘要翻译：一种热喷墨打印头，其包括具有多个薄膜层的薄膜基板，多个薄膜层中限定的多个喷墨加热电阻器，设置在所述多个薄膜层上的图案化钽层，设置在图案化的钽层上的粘合层，设置在阻挡粘附层上的油墨阻挡层和在各个薄膜电阻器上形成在油墨阻挡层中的各个油墨室，每个室由阻挡层中的开口形成，层更具体地包括氮化钽层或沉积的钽，碳，氟和含氧层，其是通过将图案化的钽层暴露于等离子体而形成的，所述等离子体包括氟化烃如四氟化碳（CF 4），氟代（ CHF3），六氟乙烷（C2F6），二氟甲烷（CH2F2），五氟乙烷（C2HF5），四氟乙烷（C2H2F4）或八氟（C4F8）。

4. 发明授权

US07150516B2 Integrated circuit and method for manufacturing 有权
标题翻译：集成电路及制造方法
公开(公告)号：US07150516B2
公开(公告)日：2006-12-19
申请号：US10977091
申请日：2004-10-29
申请人： Simon Dodd , S. Jonathan Wang , Dennis W. Tom , Frank R. Bryant , Terry E. McMahon , Richard Todd Miller , Gregory T. Hindman
发明人： Simon Dodd , S. Jonathan Wang , Dennis W. Tom , Frank R. Bryant , Terry E. McMahon , Richard Todd Miller , Gregory T. Hindman
IPC分类号： B41J2/05
CPC分类号： B41J2/1628 , B41J2/14129 , B41J2/1603 , B41J2202/13 , H01L2924/0002 , H01L2924/00
摘要： A fluid ejection device including: a substrate having a first surface having an non-doped region; a first insulative material disposed on a portion of the first surface, the first insulative material having a plurality of openings forming a path to the first surface; a first conductive material disposed on the first insulative material, the first conductive material being disposed so that the plurality of openings are substantially free of the first conductive material; a second insulative material disposed on the first conductive material and portions of the first insulative material, the second insulative material being disposed so that the plurality of openings are substantial free of the second insulative material and a second conductive material being disposed on second insulative material and within plurality of openings so that some of the second conductive material disposed upon the second insulative material is in electrical contact with the non-doped region on the substrate.
摘要翻译：一种流体喷射装置，包括：具有第一表面和非掺杂区域的基板; 第一绝缘材料，设置在所述第一表面的一部分上，所述第一绝缘材料具有形成到所述第一表面的路径的多个开口; 设置在所述第一绝缘材料上的第一导电材料，所述第一导电材料设置成使得所述多个开口基本上不含所述第一导电材料; 设置在第一导电材料上的第二绝缘材料和第一绝缘材料的部分，第二绝缘材料设置成使得多个开口基本上不含第二绝缘材料，第二导电材料设置在第二绝缘材料上并且在多个开口内，使得设置在第二绝缘材料上的一些第二导电材料与衬底上的非掺杂区域电接触。

5. 发明授权

US6155674A Structure to effect adhesion between substrate and ink barrier in ink jet printhead 失效
标题翻译：用于实现喷墨打印头中基材和油墨阻挡层之间粘合的结构
公开(公告)号：US6155674A
公开(公告)日：2000-12-05
申请号：US811404
申请日：1997-03-04
申请人： Domingo A Figueredo , Gregory T Hindman , Brian J Keefe , Ali Emamjomeh , Roger J Kolodziej , Grant Allen Webster , Terri I. Chapman
发明人： Domingo A Figueredo , Gregory T Hindman , Brian J Keefe , Ali Emamjomeh , Roger J Kolodziej , Grant Allen Webster , Terri I. Chapman
IPC分类号： B05B1/24 , B41J2/14 , B41J2/16 , B41J2/05
CPC分类号： B41J2/1642 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2/1646 , B41J2202/03
摘要： A thermal ink jet printhead that includes an adhesion interface between a silicon carbide layer of a thin film substrate and a polymer ink barrier layer in the vicinity of ink chambers formed in the polymer ink barrier layer, and an adhesion interface between a silicon carbide layer disposed on the ink barrier layer and an orifice plate. An intervening adhesion promoter can be located between the silicon carbide layer of the thin film substrate and the polymer ink barrier layer, and between the silicon carbide layer disposed on the ink barrier layer and the orifice plate.
摘要翻译：一种热喷墨打印头，其包括薄膜基材的碳化硅层和形成在聚合物油墨阻挡层中的油墨室附近的聚合物油墨阻挡层之间的粘合界面，以及在碳化硅层之间的粘附界面在油墨阻挡层和孔板上。中间粘合促进剂可以位于薄膜基材的碳化硅层和聚合物油墨阻挡层之间，并且位于设置在油墨阻挡层上的碳化硅层和孔板之间。

6. 发明授权

US06286939B1 Method of treating a metal surface to increase polymer adhesion 失效
标题翻译：处理金属表面以增加聚合物粘合力的方法
公开(公告)号：US06286939B1
公开(公告)日：2001-09-11
申请号：US08938786
申请日：1997-09-26
申请人： Gregory T. Hindman , Domingo A. Figueredo , Ronald L. Enck
发明人： Gregory T. Hindman , Domingo A. Figueredo , Ronald L. Enck
IPC分类号： B41J205
CPC分类号： B41J2/14129 , B41J2202/03
摘要： A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF4), fluoroform (CHF3), hexafluoroethane (C2F6), difluoromethane (CH2F2), pentafluoroethane (C2HF5), tetraf luoroethane (C2H2F4), or octafluorobutene (C4F8).
摘要翻译：一种热喷墨打印头，其包括具有多个薄膜层的薄膜基板，多个薄膜层中限定的多个喷墨加热电阻器，设置在所述多个薄膜层上的图案化钽层，设置在图案化的钽层上的粘合层，设置在阻挡粘附层上的油墨阻挡层和在各个薄膜电阻器上形成在油墨阻挡层中的各个油墨室，每个室由阻挡层中的开口形成，层更具体地包括氮化钽层或沉积的钽，碳，氟和含氧层，其是通过将图案化的钽层暴露于等离子体而形成的，所述等离子体包括氟化烃如四氟化碳（CF 4），氟代（ CHF3），六氟乙烷（C2F6），二氟甲烷（CH2F2），五氟乙烷（C2HF5），四氟乙烷（C2H2F4）或八氟鲁本（C4F8）。

7. 发明授权

US06209991B1 Transition metal carbide films for applications in ink jet printheads 失效
标题翻译：用于喷墨打印头的过渡金属碳化物膜
公开(公告)号：US06209991B1
公开(公告)日：2001-04-03
申请号：US08811403
申请日：1997-03-04
申请人： Michael J Regan , Brian J Keefe , Ali Emamjomeh , Roger J Kolodziej , Ulrich E Hess , John P Whitlock , Domingo A Figueredo , Gregory T Hindman
发明人： Michael J Regan , Brian J Keefe , Ali Emamjomeh , Roger J Kolodziej , Ulrich E Hess , John P Whitlock , Domingo A Figueredo , Gregory T Hindman
IPC分类号： B41J205
CPC分类号： B41J2/1626 , B41J2/1404 , B41J2/14129 , B41J2/1603 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2202/03
摘要： A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum carbide layer disposed on the plurality of thin film layers, an ink barrier layer disposed over the tantalum carbide layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer. The tantalum carbide layer forms an oxidation and wear resistance layer and/or a barrier adhesion layer.
摘要翻译：一种热喷墨打印头，其包括：薄膜基板，包括多个薄膜层;多个喷墨加热电阻器，限定在所述多个薄膜层中，设置在所述多个薄膜层上的图案化碳化钽层，设置在碳化钽层上的油墨阻挡层，以及在各个薄膜电阻器上形成在油墨阻挡层中的各个油墨室，每个室由在阻挡层中开放的室形成。碳化钽层形成氧化和耐磨层和/或阻挡粘附层。

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