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    • 3. 发明申请
    • Threaded Structures with Solder Control Features
    • 具有焊接控制特性的螺纹结构
    • US20140057731A1
    • 2014-02-27
    • US13594135
    • 2012-08-24
    • Gregory N. StephensShayan MalekIan A. Spraggs
    • Gregory N. StephensShayan MalekIan A. Spraggs
    • B21D53/24
    • H05K3/341H05K2201/1031H05K2201/10371H05K2201/10409H05K2201/2036Y02P70/611Y02P70/613
    • Threaded standoff structures may be provided with features that control the flow of solder. A base structure for a standoff may be formed from a solderphobic material such as brass. A through hole may be formed in the base structure. The base structure may be coated with a solderphilic material such as an inner layer of nickel and an outer layer of tin. A tapping tool may be used to remove the solderphilic material from the opening by tapping threads into the opening, thereby exposing the underlying base metal of the standoff in the opening. During attachment to a substrate such as a printed circuit board, the standoff may be exposed to molten solder. The solderphilic coating on the outer surface of the standoff may attract the molten solder, whereas the solderphobic base metal in the threaded opening may help prevent solder from contaminating the threads in the opening.
    • 螺纹支座结构可以具有控制焊料流动的特征。 用于隔离物的基底结构可以由诸如黄铜的阻燃材料形成。 可以在基部结构中形成通孔。 基底结构可以涂覆有诸如镍的内层和锡的外层的可焊性材料。 可以使用攻丝工具通过将螺纹攻丝到开口中从开口中去除可焊性材料,从而将开口中的支架的下面的底层金属暴露出来。 在连接到诸如印刷电路板的基板时,间隔可能暴露于熔融焊料。 在支座的外表面上的气溶胶涂层可能会吸引熔融焊料,而螺纹孔中的阻焊基体金属可能有助于防止焊料污染开口中的螺纹。