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1. 发明授权

US4967042A System for enhancing current carrying capacity of printed wiring board 失效
标题翻译：增强印刷电路板承载能力的系统
公开(公告)号：US4967042A
公开(公告)日：1990-10-30
申请号：US289332
申请日：1988-12-22
申请人： Glen C. Shepherd , Dirk Warriner , Charles F. Starks
发明人： Glen C. Shepherd , Dirk Warriner , Charles F. Starks
IPC分类号： H01R11/01 , H05K1/02 , H05K3/24 , H05K3/34
CPC分类号： H05K3/341 , H05K1/0263 , H05K2201/10272 , H05K2201/1028 , H05K3/3447 , Y02P70/613
摘要： The disclosure relates to a printed wiring board system including a printed wiring board having an electrical conductor on one surface thereof, a pair of apertures extending through the printed wiring board, an electrically conductive jumper extending through the apertures and beyond the surfaces of the printed wiring board surrounding the apertures, the portions of the jumpers extending beyond the electrical conductor carrying surface being positioned along the surface of the board and substantially parallel thereto, solder being disposed over each of the portions of the jumpers extending beyond the conductor carrying surface, the solder extending over the entire region between the portions. The additional solder build up between and around the jumpers substantially increase the current carrying capacity of the jumper and metal trace combination.

2. 发明授权

US4293987A Method of fabricating capacitive touch switch panel 失效
标题翻译：制造电容式触摸开关面板的方法
公开(公告)号：US4293987A
公开(公告)日：1981-10-13
申请号：US106294
申请日：1979-12-21
申请人： Tom L. Gottbreht , Glen C. Shepherd
发明人： Tom L. Gottbreht , Glen C. Shepherd
IPC分类号： H03K17/96 , H01G4/30 , H01H9/26
CPC分类号： H03K17/9622 , H05B6/6435 , H01H2207/004 , H03K2017/9613 , H03K2217/96023 , Y10T29/435 , Y10T29/49126
摘要： An improved technique for the manufacture of capacitive touch switch panel assemblies, utilized to control appliances and the like, provides simplified construction and manufacture. The technique involves the formation of conductive touch pads on one major surface of a dielectric panel and the formation of pairs of spaced-apart conductive pads and conductive lead members to the conductive pads on a separate flexible synthetic resin sheet. The synthetic resin is bonded to the opposite major surface of the dielectric panel with each pair of conductive pads on the synthetic resin sheet in registry with a corresponding touch pad on the one major surface of the dielectric panel. The synthetic resin sheet includes a portion having a conductive lead pattern formed thereon which is not bonded to the dielectric panel; this portion serves as a flexible connector for connection of the touch panel to a circuit board or the like. In one embodiment, the conductive lead pattern includes an interconnection pattern for circuit elements such as integrated circuits or display elements mounted on the synthetic resin sheet or the dielectric panel. The conductive lead pattern on the synthetic resin sheet may be a single-layer or a multi-layer pattern and the conductor may be formed from a single material or different materials having predetermined resistive characteristics whereby external resistors to the capacitive touch switches and/or circuit elements may be eliminated from the circuit.
摘要翻译：用于制造用于控制电器等的电容式触摸开关面板组件的改进技术提供了简化的结构和制造。该技术涉及在电介质面板的一个主表面上形成导电触摸垫，并且在单独的柔性合成树脂片上形成间隔开的导电焊盘和导电引线构件到导电焊盘。合成树脂通过合成树脂板上的每对导电焊盘与电介质面板的一个主表面上的对应的触摸板对准而与电介质面板的相对的主表面接合。合成树脂片包括其上形成有导电引线图案的部分，其未结合到电介质面板; 该部分用作用于将触摸面板连接到电路板等的柔性连接器。在一个实施例中，导电引线图形包括用于电路元件的互连图案，例如集成电路或安装在合成树脂片或电介质面板上的显示元件。合成树脂片上的导电图案可以是单层或多层图案，并且导体可以由具有预定电阻特性的单一材料或不同材料形成，从而电容式触摸开关和/或电路的外部电阻可以从电路中消除元件。

3. 发明申请

US20100094607A1 Method of reducing solder wicking on a substrate 有权
标题翻译：减少衬底上焊锡芯吸的方法
公开(公告)号：US20100094607A1
公开(公告)日：2010-04-15
申请号：US12653358
申请日：2009-12-11
申请人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
发明人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
IPC分类号： G06F17/10 , H05K3/34 , H05K3/42
CPC分类号： H05K1/115 , H05K1/114 , H05K3/3442 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , Y10T29/49165
摘要： This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.
摘要翻译：本发明涉及一种具有通孔和衬垫结构以减少焊料芯吸的衬底。每个通孔和焊盘结构将组件连接到与衬底相关联的导电层。衬底包括一个或多个电镀通孔，围绕镀覆通孔的焊接掩模，以及具有连接到每个电镀通孔的导电迹线的导电焊盘。导电焊盘延伸超过端子侧以增加焊料形成，并且焊接掩模减少部件终端处的焊料形成。通孔和焊盘结构适用于各种组件和高组件密度。本发明还提供一种用于计算延伸超过部件的端子侧的导电焊盘的最大距离的计算机实现的方法。

4. 发明授权

US08378222B2 Method of reducing solder wicking on a substrate 有权
公开(公告)号：US08378222B2
公开(公告)日：2013-02-19
申请号：US12653358
申请日：2009-12-11
申请人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
发明人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
IPC分类号： H05K1/00
CPC分类号： H05K1/115 , H05K1/114 , H05K3/3442 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , Y10T29/49165
摘要： This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

5. 发明授权

US4304976A Capacitive touch switch panel 失效
标题翻译：电容触摸开关面板
公开(公告)号：US4304976A
公开(公告)日：1981-12-08
申请号：US105802
申请日：1979-12-20
申请人： Tom L. Gottbreht , Glen C. Shepherd
发明人： Tom L. Gottbreht , Glen C. Shepherd
IPC分类号： H03K17/96 , H05B6/80 , H05B6/64 , H01G7/00 , H01H9/54
CPC分类号： H05B6/6435 , H03K17/9622 , H01H2207/004 , H03K2017/9613 , H03K2217/96023 , H03K2217/96077
摘要： An improved technique for the manufacture of capacitive touch switch panel assemblies, utilized to control appliances and the like, provides simplified construction and manufacture. The technique involves the formation of conductive touch pads on one major surface of a dielectric panel and the formation of pairs of spaced-apart conductive pads and conductive lead members to the conductive pads on a separate flexible synthetic resin sheet. The synthetic resin is bonded to the opposite major surface of the dielectric panel with each pair of conductive pads on the synthetic resin sheet in registry with a corresponding touch pad on the one major surface of the dielectric panel. The synthetic resin sheet includes a portion having a conductive lead pattern formed thereon which is not bonded to the dielectric panel; this portion serves as a flexible connector for connection of the touch panel to a circuit board or the like. In one embodiment, the conductive lead pattern includes an interconnection pattern for circuit elements such as integrated circuits or display elements mounted on the synthetic resin sheet or the dielectric panel. The conductive lead pattern on the synthetic resin sheet may be a single-layer or a multi-layer pattern and the conductors may be formed from a single material or different materials having predetermined resistive characteristics whereby external resistors to the capacitive touch switches and/or circuit elements may be eliminated from the circuit.
摘要翻译：用于制造用于控制电器等的电容式触摸开关面板组件的改进技术提供了简化的结构和制造。该技术涉及在电介质面板的一个主表面上形成导电触摸垫，并且在单独的柔性合成树脂片上形成间隔开的导电焊盘和导电引线构件到导电焊盘。合成树脂通过合成树脂板上的每对导电焊盘与电介质面板的一个主表面上的对应的触摸板对准而与电介质面板的相对的主表面接合。合成树脂片包括其上形成有导电引线图案的部分，其未结合到电介质面板; 该部分用作用于将触摸面板连接到电路板等的柔性连接器。在一个实施例中，导电引线图形包括用于电路元件的互连图案，例如集成电路或安装在合成树脂片或电介质面板上的显示元件。合成树脂片上的导电图案可以是单层或多层图案，并且导体可以由具有预定电阻特性的单一材料或不同材料形成，从而电容式触摸开关和/或电路的外部电阻元件可以从电路中消除。

6. 发明授权

US07645940B2 Substrate with via and pad structures 有权
标题翻译：基底与通孔和垫结构
公开(公告)号：US07645940B2
公开(公告)日：2010-01-12
申请号：US10774115
申请日：2004-02-06
申请人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
发明人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
IPC分类号： H05K1/00
CPC分类号： H05K1/115 , H05K1/114 , H05K3/3442 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , Y10T29/49165
摘要： This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.
摘要翻译：本发明涉及一种具有通孔和衬垫结构以减少焊料芯吸的衬底。每个通孔和焊盘结构将组件连接到与衬底相关联的导电层。衬底包括一个或多个电镀通孔，围绕镀覆通孔的焊接掩模，以及具有连接到每个电镀通孔的导电迹线的导电焊盘。导电焊盘延伸超过端子侧以增加焊料形成，并且焊接掩模减少部件终端处的焊料形成。通孔和焊盘结构适用于各种组件和高组件密度。本发明还提供一种用于计算延伸超过部件的端子侧的导电焊盘的最大距离的计算机实现的方法。

7. 发明授权

US4318071A Interface relay for high current equipment 失效
标题翻译：大电流设备接口继电器
公开(公告)号：US4318071A
公开(公告)日：1982-03-02
申请号：US137338
申请日：1980-04-04
申请人： Glen C. Shepherd
发明人： Glen C. Shepherd
IPC分类号： H01H61/02 , H01H61/00 , H01H71/18
CPC分类号： H01H61/02
摘要： Disclosed is a relay for high current equipment, such as, for example, an electric range. The relay provides the interface between the solid state electronics and the high wattage electric heating elements. The relay is comprised of a frame having a non-electrically conductive, flexible substrate, such as a plastic substrate supported at its ends with a shallow V cross section. The substrate has conductive heater elements formed thereon with heater terminals connected to said elements. The plastic substrate has a high coefficient of thermal expansion. A biasing member in contact with the apex of the plastic substrate transmits forces between the substrate and a switch assembly, either creep or snap acting. The upper switch arm preloads or couples a force between the biasing element and the plastic substrate causing a shallow V to be formed in the substrate. When current is applied to the heater terminals and heats the heater element, the substrate expands. This expansion of the plastic substrate is amplified into a larger displacement of the apex of the V due to the geometry of this construction. The motion with amplification of the plastic substrate causes the switch to change from a first state to a second state. When current is removed from the heater elements, the plastic cools and contracts causing the switch to change back to its first state.
摘要翻译：公开了一种用于大电流设备的继电器，例如电气范围。继电器提供固态电子设备和高功率电加热元件之间的接口。继电器由具有非导电柔性基板的框架构成，例如在其端部处支撑有浅V截面的塑料基板。衬底具有形成在其上的导电加热器元件，加热器端子连接到所述元件。塑料基板具有高的热膨胀系数。与塑料基板的顶点接触的偏置构件在基板和开关组件之间传递力，无论是蠕变或卡扣作用。上开关臂在偏置元件和塑料基板之间预加载或耦合力，导致在基板中形成浅V。当电流施加到加热器端子并加热加热器元件时，基板膨胀。由于该结构的几何形状，塑料基板的这种膨胀被扩大为V的顶点的较大位移。具有塑料基板的放大的运动导致开关从第一状态改变到第二状态。当电流从加热器元件移除时，塑料冷却并收缩，导致开关转回到其第一状态。

8. 发明授权

US4121073A Condition responsive electrical switch having improved bridging contact means 失效
标题翻译：具有改进的桥接接触装置的状态响应电开关
公开(公告)号：US4121073A
公开(公告)日：1978-10-17
申请号：US772701
申请日：1977-02-28
申请人： Thomas Bileski , Joe W. Crawford , Bobby D. Blanton , Carl N. Johnson , Felix Garcia , John W. Orcutt , Glen C. Shepherd , James A. Oursler
发明人： Thomas Bileski , Joe W. Crawford , Bobby D. Blanton , Carl N. Johnson , Felix Garcia , John W. Orcutt , Glen C. Shepherd , James A. Oursler
IPC分类号： H01H1/20 , H01H35/34
CPC分类号： H01H1/2083
摘要： An electrical switch actuatable upon the occurrence of a preselected level, includes a generally cup shaped, open ended housing which mounts therein a spaced pair of stationary contacts. The housing has two pairs of upwardly extending channels in its side walls, the two channels of the first pair aligned with the stationary contacts and the two channels of the second pair aligned with platform surfaces. An electrically conductive, flexible cruciform element is disposed in the housing with the distal end portions of two legs of the cruciform received respectively in the two channels of the first pair, and the distal end portions of the other two legs of the cruciform received respectively in the two channels of the second pair and resting on the platform surfaces. The stationary contacts may be disposed above or beneath the cruciform element for a normally open or normally closed switch as desired. The stationary contacts may lie in a plane parallel to the plane of the snap acting member or in planes which intersect each other and the plane of the snap acting member. A motion transfer pin extends between the snap acting member and the cruciform element and may be provided with a shoulder to prevent overtravel of the pin.
摘要翻译：在预先设定的水平位置上可启动的电开关包括一个大致为杯形的开放式外壳，其中安装有一对间隔开的固定触点。壳体在其侧壁中具有两对向上延伸的通道，第一对的两个通道与固定触点对准，并且第二对的两个通道与平台表面对准。导电的，柔性的十字形元件设置在壳体中，十字形的两个腿的远端部分别容纳在第一对的两个通道中，十字形的另外两个腿的远端部分别接收在第二对的两个通道并且搁置在平台表面上。根据需要，固定触点可以设置在十字形元件的上方或下方，用于常开或常闭开关。固定触点可以位于平行于卡扣作用构件的平面的平面中，或者位于与快速作用构件相交的平面中。运动传递销在卡扣作用构件和十字形元件之间延伸并且可以设置有肩部以防止销的超程。

9. 发明授权

US3949344A Thermostatic control apparatus 失效
标题翻译：恒温控制装置
公开(公告)号：US3949344A
公开(公告)日：1976-04-06
申请号：US530629
申请日：1974-12-09
申请人： John T. Hancock , James B. Allen , Glen C. Shepherd , Joe W. Crawford
发明人： John T. Hancock , James B. Allen , Glen C. Shepherd , Joe W. Crawford
IPC分类号： H01H37/20 , H01H37/12
CPC分类号： H01H37/20
摘要： Thermostatic control apparatus comprising a switch, a switch body housing the switch, and an actuator arm extending from the switch body with the arm being movable between the first and second positions for opening and closing the switch. A thermostatic bimetal strip is spaced from the switch body, with one end of the strip being mechanically linked to the actuator arm. A support extends from the body for supporting the other end of the strip. A selectively operable adjustment cam engages the strip between its ends on the face of the strip adjacent the body, this cam being operable for adjusting the thermostatic strip to open and close the switch at various preselected temperatures. A spring biases the strip into engagement with the cam whereby changes in temperature of the strip cause the arm to move between its first and second positions thereby causing the switch to open and close.
摘要翻译：恒温控制装置包括开关，容纳开关的开关体和从开关本体延伸的致动器臂，臂可在第一和第二位置之间移动，用于打开和闭合开关。恒温双金属条与开关主体间隔开，带的一端机械连接到致动器臂。支撑件从主体延伸以支撑条带的另一端。选择性地可操作的调节凸轮在其邻近主体的带的表面上的端部之间接合带，该凸轮可操作用于调节恒温条以在各种预选温度下打开和关闭开关。弹簧将条带偏置成与凸轮接合，由此带的温度变化使得臂在其第一和第二位置之间移动，从而使开关打开和关闭。

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