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1. 发明授权

US06538460B1 Method and apparatus for enhancing a system board 失效
标题翻译：用于增强系统板的方法和装置
公开(公告)号：US06538460B1
公开(公告)日：2003-03-25
申请号：US09526956
申请日：2000-03-16
申请人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
发明人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
IPC分类号： G01R3128
CPC分类号： G01R31/2886 , G01R1/0416 , G01R1/045
摘要： A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.
摘要翻译：提出了一种与系统板互连的方法和装置。具有安装在其上的金属加强件的系统板在加强件中设置有开口，以提供对系统板上的感兴趣区域的访问。探针测试组件位于开口处并固定到加强件，当需要测试以提供对被测器件的引脚（例如，系统板上的多芯片模块（MCM））的访问时。或者，可以在加强件的开口处将诸如具有附加的中央处理单元（CPU）或其他特征的MCM或单芯片模块（SCM）的系统增强设备安装在系统板上，以增强系统的功能板。另一种替代方案包括定位在加强件的开口处的界面组件。盖子定位在开口处，并在所有其他时间固定在加强件上。

2. 发明授权

US06252391B1 High frequency probe 失效
标题翻译：高频探头
公开(公告)号：US06252391B1
公开(公告)日：2001-06-26
申请号：US09141907
申请日：1998-08-28
申请人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
发明人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
IPC分类号： G01R106
CPC分类号： G01R1/06772
摘要： A high frequency probe is presented. The probe comprises a probe body having a coaxial resilient double ended probe element attached thereto by an adaptor. A locking pin is attached to the probe adaptor and extends parallel to the probe element, however, it is slightly shorter as the locking pin should not contact any pins of the device being probed. The locking pin serves to hold the probe in place. Alternatively, a high frequency differential probe is presented. The high frequency differential probe comprises a base having a first pair of opposing spring steel plates and a second adjacent pair of opposing spring steel plates connected thereto. The first pair of spring plates are also connected to a first probe adaptor and the second pair of spring plates are also connected to a second probe adaptor. A first probe body is mounted at an angle to the first adaptor and a second probe body is mounted at an angle to the second adaptor. A first coaxial resilient double ended probe element connected to the first probe body by the first adaptor and a second coaxial resilient double ended probe element connected to the second probe body by the second adaptor.
摘要翻译：提出了一种高频探头。探针包括探针体，其具有通过适配器附接到其上的同轴弹性双端探针元件。锁定销连接到探头适配器并且平行于探针元件延伸，然而，其锁定销稍短，因为锁定销不应接触被探测设备的任何引脚。锁定销用于将探头固定到位。或者，提供高频差分探针。高频差分探头包括具有第一对相对弹簧钢板的基座和与其连接的第二相邻的相对的弹簧钢板。第一对弹簧板也连接到第一探针适配器，第二对弹簧板也连接到第二探针适配器。第一探针体与第一适配器成角度地安装，并且第二探针主体以与第二适配器成角度的方式安装。通过第一适配器连接到第一探针体的第一同轴弹性双端探头元件和通过第二适配器连接到第二探针体的第二同轴弹性双端探针元件。

3. 发明申请

US20070069754A1 Gel package structural enhancement of compression system board connections 失效
公开(公告)号：US20070069754A1
公开(公告)日：2007-03-29
申请号：US11234986
申请日：2005-09-26
申请人： Michael McAllister , Harald Pross , Gerhard Ruehle , Wolfgang Scholz , Gerhard Schoor
发明人： Michael McAllister , Harald Pross , Gerhard Ruehle , Wolfgang Scholz , Gerhard Schoor
IPC分类号： G01R31/26
CPC分类号： H05K7/1061 , H05K1/0271 , H05K3/0058 , H05K3/325 , H05K2201/10719 , H05K2201/2009 , Y10T29/49126 , Y10T29/49128
摘要： A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

4. 发明授权

US06462573B1 System interface assembly and method 失效
标题翻译：系统界面汇编和方法
公开(公告)号：US06462573B1
公开(公告)日：2002-10-08
申请号：US09527576
申请日：2000-03-16
申请人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
发明人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , G01R1/0416 , G01R1/045
摘要： A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.
摘要翻译：提出了一种与系统板互连的方法和装置。具有安装在其上的金属加强件的系统板在加强件中设置有开口，以提供对系统板上的感兴趣区域的访问。探针测试组件位于开口处并固定到加强件，当需要测试以提供对被测器件的引脚（例如，系统板上的多芯片模块（MCM））的访问时。或者，可以在加强件的开口处将诸如具有附加的中央处理单元（CPU）或其他特征的MCM或单芯片模块（SCM）的系统增强设备安装在系统板上，以增强系统的功能板。另一种替代方案包括定位在加强件的开口处的界面组件。盖子定位在开口处，并在所有其他时间固定在加强件上。

5. 发明授权

US06433562B1 Method and apparatus of interconnecting with a system board 失效
公开(公告)号：US06433562B1
公开(公告)日：2002-08-13
申请号：US09143228
申请日：1998-08-28
申请人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
发明人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
IPC分类号： G01R3128
CPC分类号： G01R31/2886 , G01R1/0416 , G01R1/045
摘要： A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

6. 发明申请

US20070069358A1 Gel package structural enhancement of compression system board connections 有权
公开(公告)号：US20070069358A1
公开(公告)日：2007-03-29
申请号：US11234884
申请日：2005-09-26
申请人： Michael McAllister , Harald Pross , Gerhard Ruehle , Wolfgang Scholz , Gerhard Schoor
发明人： Michael McAllister , Harald Pross , Gerhard Ruehle , Wolfgang Scholz , Gerhard Schoor
IPC分类号： H01L23/24
CPC分类号： H05K1/0271 , H01L23/3737 , H01L24/72 , H01L2924/01005 , H01L2924/01015 , H01L2924/01033 , H01L2924/01043 , H01L2924/01075 , H01L2924/14 , H05K3/0058 , H05K3/325 , H05K2201/10719 , H05K2201/2009
摘要： A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

7. 发明授权

US06549024B2 Method of interconnecting with a system board 失效
标题翻译：与系统板互连的方法
公开(公告)号：US06549024B2
公开(公告)日：2003-04-15
申请号：US10199771
申请日：2002-07-19
申请人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
发明人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
IPC分类号： G01R3128
CPC分类号： G01R31/2886 , G01R1/0416 , G01R1/045
摘要： A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.
摘要翻译：提出了一种与系统板互连的方法和装置。具有安装在其上的金属加强件的系统板在加强件中设置有开口，以提供对系统板上的感兴趣区域的访问。探针测试组件位于开口处并固定到加强件，当需要测试以提供对被测器件的引脚（例如，系统板上的多芯片模块（MCM））的访问时。或者，诸如具有附加中央处理单元（CPU）或其他特征的MCM或单芯片模块（SCM）的系统增强设备可以在加强件的开口处安装在系统板上，以增强系统的功能板。另一种替代方案包括定位在加强件的开口处的界面组件。盖子定位在开口处，并在所有其他时间固定在加强件上。

8. 发明授权

US06429644B1 Method and apparatus of interconnecting with a system board 失效
标题翻译：与系统板互连的方法和装置
公开(公告)号：US06429644B1
公开(公告)日：2002-08-06
申请号：US09527577
申请日：2000-03-16
申请人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
发明人： Michael F. McAllister , Klaus K. Kempter , Charles F. Pells , Stephan R. Richter , Gerhard Ruehle
IPC分类号： G01R104
CPC分类号： G01R31/2886 , G01R1/0416 , G01R1/045
摘要： A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e.g., a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPU's) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.
摘要翻译：提出了一种与系统板互连的方法和装置。具有安装在其上的金属加强件的系统板在加强件中设置有开口，以提供对系统板上的感兴趣区域的访问。探针测试组件位于开口处并固定到加强件，当需要测试以提供对被测器件的引脚（例如，系统板上的多芯片模块（MCM））的访问时。或者，可以在加强件的开口处将诸如具有附加的中央处理单元（CPU）或其他特征的MCM或单芯片模块（SCM）的系统增强设备安装在系统板上，以增强系统的功能板。另一种替代方案包括定位在加强件的开口处的界面组件。盖子定位在开口处，并在所有其他时间固定在加强件上。

9. 发明授权

US06342788B1 Probing systems for chilled environment 失效
标题翻译：探测寒冷环境的系统
公开(公告)号：US06342788B1
公开(公告)日：2002-01-29
申请号：US09324497
申请日：1999-06-02
申请人： Michael Ford McAllister , Gerhard Ruehle
发明人： Michael Ford McAllister , Gerhard Ruehle
IPC分类号： G01R3102
CPC分类号： G01R31/2863
摘要： A probe test assembly for testing electronic devices maintained at lowered temperatures includes heaters and flows of dried air to prevent condensation from forming on the devices. The devices have pins received in an electrically non-conductive system board, and the probe test assembly includes a heat conductive and electrically conductive apertured probe plate to transfer heat from the heaters to the system board. Grounding pins extend from the probe plate to grounding pads on the system board, and a non-conductive apertured pattern plate spaced above the probe plate protects exposed ends of the grounding pins. In an alternate embodiment, the pattern plate is omitted in favor of a conductive intermediate plate and a superposed non-conductive contact plate. Signal pins extend from the system board to the contact plate in order to transfer contact points for electronic device from the system board to the contact plate. A multipin connector can be connected to the contact plate to enable the transmission of signals from the devices under test to a computer.
摘要翻译：用于测试维持在较低温度下的电子设备的探针测试组件包括加热器和干燥空气流，以防止在器件上形成冷凝。这些器件具有接收在非导电系统板中的引脚，并且探针测试组件包括导热和导电的有孔探针板，以将热量从加热器传递到系统板。接地引脚从探针板延伸到系统板上的接地焊盘，并且在探针板上方隔开的非导电孔径图案板保护接地引脚的露出端。在替代实施例中，省略了图形板，有利于导电中间板和叠置的非导电接触板。信号引脚从系统板延伸到接触板，以将电子设备的接触点从系统板传递到接触板。多接头连接器可以连接到接触板，以便将来自被测器件的信号传输到计算机。

10. 发明授权

US06669488B2 Removable housing for mounting pin grid array 失效
公开(公告)号：US06669488B2
公开(公告)日：2003-12-30
申请号：US10016446
申请日：2001-12-10
申请人： Dierk Kaller , Willi Recktenwald , Gerhard Ruehle
发明人： Dierk Kaller , Willi Recktenwald , Gerhard Ruehle
IPC分类号： H01R1200
CPC分类号： H05K7/1084 , H01R12/57 , H01R13/187
摘要： An assembly for mounting elongated electrical contact elements to an integrated circuit package or printed circuit board. The assembly comprises a a base plate having a first surface and a multiplicity of recesses aligned with each other in the first surface. Each of the recesses is sized and configured to receive a respective one of the contact elements. The assembly also comprises first and second spaced apart supports extending from the base plate. The assembly also comprises first and second rods received by the first and second supports and supported parallel to each other. The first and second rods define an intervening slot aligned with the recesses. The assembly also comprises a multiplicity of the contact elements. One end of each of the contact elements is received in a respective one of the recesses. The contact elements are engaged by the first and second rods, whereby the contact elements are held in their respective recesses. The rods are removable from the first and second supports to permit the contact elements to be removed from the base plate.

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