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    • 2. 发明授权
    • Multilayer computer chassis having integral circuit board mounting and
grounding structure
    • 多层电脑机箱具有集成电路板安装和接地结构
    • US5691504A
    • 1997-11-25
    • US435921
    • 1995-05-05
    • Steven L. SandsGeorge Thomas Holt
    • Steven L. SandsGeorge Thomas Holt
    • G06F1/18H05K7/14H05K5/00
    • G06F1/184G06F1/182H05K7/1429Y10S174/34Y10T29/49128
    • A chassis for containing a circuit board and a method of mounting a circuit board to a chassis. The chassis includes: (1) an outer chassis portion having a conductive material and having a plurality of associated pairs of integral circuit board mounts and outer chassis apertures formed in a substantially planar wall thereof, the circuit board mounts protruding toward an interior of the outer chassis portion and (2) an inner chassis portion having a plurality of associated pairs of integral spring members and inner chassis apertures formed in a substantially planar wall thereof, the plurality of circuit board mounts registerable with the plurality of inner chassis apertures to allow the plurality of circuit board mounts to pass through the plurality of inner chassis apertures as the wall of the inner chassis portion is brought into proximity with the wall of the outer chassis portion, the wall of the inner chassis portion substantially occluding the outer chassis apertures and the wall of the outer chassis portion substantially occluding the inner chassis apertures to form an electromagnetic interference ("EMI") shield, the plurality of circuit board mounts and the plurality of spring members cooperable to mount a circuit board to the chassis and to provide a grounding path from the circuit board to the chassis for electrical currents associated with the circuit board.
    • 用于容纳电路板的底盘和将电路板安装到底盘的方法。 底盘包括:(1)具有导电材料并且具有多个相关联的成对的一体的电路板安装件和形成在其基本上平坦的壁中的外部底座孔的外部底盘部分,电路板安装件朝向外部的内部突出 底盘部分和(2)内部底盘部分,其具有形成在其基本上平坦的壁中的多个相关联的成对的一体的弹簧构件和内部底盘孔,所述多个电路板安装件可与多个内部底盘孔对齐,以允许多个 的电路板安装件穿过多个内部底盘孔,当内部底架部分的壁靠近外部底盘部分的壁时,内部底盘部分的壁基本上封闭外部底盘孔和壁 所述外部底盘部分基本上封闭所述内部底盘孔以形成电子元件 电磁干扰(“EMI”)屏蔽,多个电路板安装件和多个弹簧构件可配合以将电路板安装到底盘,并且为与电路相关的电流提供从电路板到底盘的接地路径 板。
    • 3. 发明授权
    • Alignment and support apparatus for component and card coupling
    • 用于组件和卡耦合的对准和支持设备
    • US07672141B2
    • 2010-03-02
    • US11554123
    • 2006-10-30
    • Anthony P. MiddletonShane ChiassonGeorge Thomas Holt
    • Anthony P. MiddletonShane ChiassonGeorge Thomas Holt
    • H05K7/10H01R12/00
    • H05K7/1461G06F1/183G06F1/186
    • A component and card coupling alignment and support apparatus includes a card. A primary component connector is mounted to the card. A primary component including a connection edge engages the primary component connector. A secondary component extends from the primary component. An alignment and support member is included on the secondary component, whereby the card engages the alignment and support member on the secondary component. The engagement of the alignment and support member with the card aligns the primary component with the primary component connector during their coupling and supports the primary component in the primary component connector after their coupling. The card may then be coupled to an information handling system connector in an information handling system.
    • 组件和卡耦合对准和支持设备包括卡。 主要部件连接器安装在卡上。 包括连接边缘的主要部件接合主要部件连接器。 次要组件从主要组件延伸。 对准和支撑构件包括在次级部件上,由此卡接合次级部件上的对准和支撑部件。 对准和支撑构件与卡的接合在其联接期间将主要部件与主要部件连接器对准,并且在其联接之后支撑主要部件连接器中的主要部件。 然后,卡可以耦合到信息处理系统中的信息处理系统连接器。