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1. 发明授权

US06635184B1 Method for pattern-etching alumina layers and products 失效
标题翻译：氧化铝层和产品图案蚀刻的方法
公开(公告)号：US06635184B1
公开(公告)日：2003-10-21
申请号：US09553691
申请日：2000-04-21
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C23F100
CPC分类号： C04B41/009 , C04B41/5353 , C04B41/91 , C04B2111/00422 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3143 , G11B5/3163 , G11B5/40 , G11B19/04 , H01L21/00 , H01L2924/0002 , Y10T29/49046 , H01L2924/00
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
摘要翻译：通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

2. 发明授权

US5820770A Thin film magnetic head including vias formed in alumina layer and process for making the same 失效
标题翻译：薄膜磁头包括在氧化铝层中形成的通孔及其制造方法
公开(公告)号：US5820770A
公开(公告)日：1998-10-13
申请号：US502442
申请日：1995-07-13
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C04B41/53 , C04B41/91 , G11B5/31 , G11B5/39 , G11B5/40 , G11B19/04 , H01L21/00 , H01L21/306 , H01L21/3213 , H01L43/12 , H05K3/06 , B44C1/22
CPC分类号： C04B41/009 , C04B41/5353 , C04B41/91 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3163 , G11B5/40 , H01L21/00 , C04B2111/00422 , G11B19/04 , G11B5/3143 , H01L2924/0002 , Y10T29/49046
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
摘要翻译：通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。这些可以改善平面性，并减轻与不利地形相关的问题和TFH设备的高架特征。

3. 发明授权

US5657192A Thin film magnetic head including crater for recessed structure and process for making the same 失效
标题翻译：薄膜磁头包括凹陷结构的凹坑和制造相同的工艺
公开(公告)号：US5657192A
公开(公告)日：1997-08-12
申请号：US466514
申请日：1995-06-05
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C23F1/44 , C04B41/53 , C04B41/91 , C23F4/00 , G11B5/31 , G11B5/40 , G11B19/04 , H01L43/08 , H01L43/12 , B44C1/22 , C23F1/00
CPC分类号： C04B41/5353 , C04B41/91 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3163 , G11B5/40 , G11B19/04 , G11B5/3143 , Y10T29/49032 , Y10T29/49044 , Y10T29/49046 , Y10T29/49064
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and an alumina etchant. The deep alumina etching facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
摘要翻译：通过使用相容的金属掩模层和氧化铝蚀刻剂在薄膜头（TFH）的制造中图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻有助于形成用于凹陷结构的精确凹坑。这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

4. 发明授权

US5835315A Wafer including scribe line grooves for separating thin film heads and process for making the same 失效
标题翻译：晶片包括用于分离薄膜头的划线槽和用于制造它的工艺
公开(公告)号：US5835315A
公开(公告)日：1998-11-10
申请号：US466323
申请日：1995-06-05
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C23F1/44 , C04B41/53 , C04B41/91 , C23F4/00 , G11B5/31 , G11B5/40 , G11B19/04 , H01L43/08 , H01L43/12 , G11B5/147 , B44C1/22
CPC分类号： C04B41/5353 , C04B41/91 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3163 , G11B5/40 , G11B19/04 , G11B5/3143 , Y10T29/49032 , Y10T29/49044 , Y10T29/49046 , Y10T29/49064
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and an alumina etchant. The deep alumina etching enables the formation of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations.
摘要翻译：通过使用相容的金属掩模层和氧化铝蚀刻剂在薄膜头（TFH）的制造中图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻使得能够在晶片上形成用于锯切和加工滑块的街道和小路的划线槽。这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。

5. 发明授权

US5650897A Thin film magnetic head including lightning arrester and process for making the same 失效
标题翻译：薄膜磁头包括避雷器及其制作工艺
公开(公告)号：US5650897A
公开(公告)日：1997-07-22
申请号：US622331
申请日：1996-03-26
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C04B41/53 , C04B41/91 , G11B5/31 , G11B5/39 , G11B5/40 , G11B19/04 , H01L21/00 , H01L21/306 , H01L21/3213 , H01L43/12 , H05K3/06 , G11B5/147 , B44C1/22
CPC分类号： C04B41/009 , C04B41/5353 , C04B41/91 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3163 , G11B5/40 , H01L21/00 , C04B2111/00422 , G11B19/04 , G11B5/3143 , H01L2924/0002 , Y10T29/49046
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
摘要翻译：通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且随后通过氧化铝外涂层蚀刻通孔以露出焊盘。该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

6. 发明授权

US06172852B2 Actuator assembly for a disc drive having stacked actuator arms with interlocked asperities on mating surfaces 失效
标题翻译：用于盘驱动器的致动器组件，其具有在配合表面上具有互锁粗糙度的堆叠致动器臂
公开(公告)号：US06172852B2
公开(公告)日：2001-01-09
申请号：US09170030
申请日：1998-10-13
申请人： Zine-Eddine Boutaghou , Gene Patrick Bonnie
发明人： Zine-Eddine Boutaghou , Gene Patrick Bonnie
IPC分类号： G11B548
CPC分类号： G11B5/5582 , G11B5/4833 , G11B5/484
摘要： An actuator assembly for suspending and positioning at least one read/write head over at least one substantially flat surface of magnetic media is disclosed. The actuator assembly is comprised of at least one HSA and at least one actuator arm. Each actuator arm has an actuator arm distal end mating surface for coupling to at least one HSA and actuator arm upper and lower bearing mating surfaces for coupling to other actuator arms. Each HSA has an HSA proximal end mating surface for coupling to an actuator arm and an HSA distal end mating surface for coupling to a read/write head. At least one of the actuator arm distal end mating surfaces, HSA proximal end mating surfaces, actuator arm upper bearing mating surfaces, and actuator arm lower bearing mating surfaces is roughened to increase frictional coupling such that component alignment is not disturbed if the disk drive system is subjected to a mechanical shock. In addition, adhesive may be employed between the mating surfaces to increase coupling strength.
摘要翻译：公开了用于将至少一个读/写头悬挂并定位在磁介质的至少一个基本上平坦的表面上的致动器组件。致动器组件包括至少一个HSA和至少一个致动器臂。每个致动器臂具有致动臂远端配合表面，用于联接到至少一个HSA和致动器臂上和下轴承配合表面，用于联接到其他致动器臂。每个HSA具有用于联接到致动器臂的HSA近端配合表面和用于耦合到读/写头的HSA远端配合表面。致动臂远端配合表面，HSA近端配合表面，致动器臂上轴承配合表面和致动器臂下轴承配合表面中的至少一个被粗糙化以增加摩擦联接，使得如果盘驱动系统受到机械冲击。此外，可以在配合表面之间使用粘合剂以增加耦合强度。

7. 发明授权

US6059984A Process for fabricating thin film magnetic head including crater for recessed structure 失效
标题翻译：用于制造包括用于凹陷结构的凹坑的薄膜磁头的方法
公开(公告)号：US6059984A
公开(公告)日：2000-05-09
申请号：US598933
申请日：1996-02-09
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C04B41/53 , C04B41/91 , G11B5/31 , G11B5/39 , G11B5/40 , G11B19/04 , H01L21/00 , H01L21/306 , H01L21/3213 , H01L43/12 , H05K3/06 , B44C1/22
CPC分类号： C04B41/009 , C04B41/5353 , C04B41/91 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3163 , G11B5/40 , H01L21/00 , C04B2111/00422 , G11B19/04 , G11B5/3143 , H01L2924/0002 , Y10T29/49046
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
摘要翻译：通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

8. 发明授权

US5659451A Studless thin film magnetic head and process for making the same 失效
标题翻译：无头薄膜磁头及其制造方法
公开(公告)号：US5659451A
公开(公告)日：1997-08-19
申请号：US510049
申请日：1995-07-31
申请人： Uri Cohen , Gene Patrick Bonnie
发明人： Uri Cohen , Gene Patrick Bonnie
IPC分类号： C23F1/44 , C04B41/53 , C04B41/91 , C23F4/00 , G11B5/31 , G11B5/40 , G11B19/04 , H01L43/08 , H01L43/12 , G11B5/147 , G11B5/42
CPC分类号： C04B41/5353 , C04B41/91 , G11B5/3103 , G11B5/3106 , G11B5/313 , G11B5/3133 , G11B5/3163 , G11B5/40 , G11B19/04 , G11B5/3143 , Y10T29/49032 , Y10T29/49044 , Y10T29/49046 , Y10T29/49064
摘要： A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a dilute (1:2) HF in water etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.
摘要翻译：通过在水蚀刻剂中使用相容的金属掩模层和稀（1：2）HF，制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

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