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    • 1. 发明申请
    • Methods of Coating Substrate With Plasma Resistant Coatings and Related Coated Substrates
    • 用等离子体涂层和相关涂层基材涂覆基材的方法
    • US20110135915A1
    • 2011-06-09
    • US12953224
    • 2010-11-23
    • Sang Ho LeeGary Reichl
    • Sang Ho LeeGary Reichl
    • B32B5/00C23C14/30C23C14/28C23C14/06C23C16/22C23C14/34B05D1/36
    • C23C14/083H01J2237/332Y10T428/265
    • The invention includes a method of coating a substrate with a plasma etch-resistant layer that exhibits reduced particulation comprising applying an coating layer to a substrate wherein coating layer has a thickness of about 20 microns or less and wherein the coating layer, after exposure to a fluorine based plasma for an amount of time, is substantially free of any cracks or fissures that span the cross section of the coating layer.A coated substrate prepared by the methods described. Also included in the invention are coated substrates for use as a structural element in a fluorine-based semiconductor wafer processing protocol, wherein the coating is a coating layer having a thickness of about 20 microns or less and wherein the coating layer, after exposure to a fluorine based plasma for an amount of time, is substantially free of any cracks or fissures that span the cross section of the coating layer and exhibits reduced particulation.Included are structural elements used in a fluorine-based semiconductor wafer processing protocol, wherein at least a portion of a surface of a structural element is coated with a coating layer that having a thickness of about 20 microns or less and wherein the coating layer, after exposure to a fluorine based plasma for an amount of time, is substantially free of any cracks or fissures that span the cross section of the coating layer and exhibits reduced particulation.
    • 本发明包括一种用等离子体耐蚀刻层涂覆基材的方法,该层具有减小的颗粒,包括将涂层施加到基材上,其中涂层具有约20微米或更小的厚度,并且其中所述涂层在暴露于 基于氟的等离子体一段时间,基本上没有跨过涂层的横截面的任何裂纹或裂缝。 通过所述方法制备的涂布基材。 本发明还包括用作氟基半导体晶片处理方案中的结构元件的涂布基材,其中所述涂层是具有约20微米或更小的厚度的涂层,并且其中所述涂层在暴露于 基于氟的等离子体一段时间,基本上没有任何裂缝或裂缝跨过涂层的横截面并显示减少的颗粒。 包括在氟基半导体晶片处理方案中使用的结构元件,其中结构元件的表面的至少一部分涂覆有具有约20微米或更小的厚度的涂层,并且其中所述涂层在 暴露于基于氟的等离子体一段时间内,基本上没有任何裂缝或裂缝跨过涂层的横截面并表现出减少的颗粒化。
    • 3. 发明授权
    • Image recognition and analysis system and software
    • 图像识别和分析系统和软件
    • US08254657B2
    • 2012-08-28
    • US11970313
    • 2008-01-07
    • Michael J. PollackBranson J. DarnellSteven J. MandrachiaGary ReichlRichard A. DiDomizio
    • Michael J. PollackBranson J. DarnellSteven J. MandrachiaGary ReichlRichard A. DiDomizio
    • G06K9/00
    • G01N15/1463G01N15/0227G01N21/8507G01N2015/0092G01N2015/025G01N2015/1497G06T7/0002G06T2207/10016G06T2207/30024G06T2207/30108
    • A method of analyzing bubbles, cells, cell viability, or other particles or agglomerates in a process liquid contained in a vessel is provided. Images of bubbles, cells or other particles in the liquid are obtained in-situ with a vision probe extending through a wall of the vessel. The images are analyzed with image recognition software. The software measures at lease one of bubble, cell or particle size, mean diameter, surface area, flow rate, flow pattern, population distribution, viability, agglomerates or clumping, color change, viscosity, Sauter mean, ratio of surface area of bubbles relative to volume of bubbles, gas hold-up ratio of gas volume to volume of liquid, or interfacial area. The software distinguishes valid or viable bubbles, cells or particles that should be included in an analysis from invalid or non-viable bubbles, cells or particles that should not be included. The software can be configured to provide an analysis of the valid bubbles, cells or particles that fall within pre-set size and shape or viability parameters.
    • 提供了一种在容器中包含的工艺液体中分析气泡,细胞,细胞活力或其它颗粒或附聚物的方法。 液体中的气泡,细胞或其他颗粒的图像可通过延伸穿过血管壁的视觉探针原位获得。 图像用图像识别软件分析。 软件采用泡沫,细胞或颗粒尺寸,平均直径,表面积,流速,流动模式,种群分布,生存力,团聚或聚集,颜色变化,粘度,Sauter平均值,气泡表面积比 气泡体积,气体体积与液体体积的气体滞留比或界面面积。 该软件区分有效或可行的气泡,细胞或粒子,应包括在分析中无效或不可行的气泡,不应包括的细胞或颗粒。 该软件可以配置为提供落入预设大小和形状或生存参数范围内的有效气泡,细胞或颗粒的分析。