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    • 1. 发明授权
    • Copper alloy containing cobalt, nickel and silicon
    • 含钴,镍和硅的铜合金
    • US08257515B2
    • 2012-09-04
    • US11246966
    • 2005-10-07
    • Frank N. MandigoPeter W. RobinsonDerek E. TylerAndreas BoegelHans-Achim KuhnFrank M. KeppelerJoerg Seeger
    • Frank N. MandigoPeter W. RobinsonDerek E. TylerAndreas BoegelHans-Achim KuhnFrank M. KeppelerJoerg Seeger
    • C22F1/08
    • C22F1/08C22C9/06H01L23/49579H01L2924/0002H01R13/03H01L2924/00
    • A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c). solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; (d). first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; (e). cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and (f). second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.
    • 具有改进的屈服强度和电导率组合的铜合金基本上由重量计包含1%至2.5%的镍,0.5%至2.0%的钴,总镍加钴含量为1.7%至 4.3%,0.5%〜1.5%的硅(Ni + Co)/ Si为3.5〜6的硅,余量为铜和不可避免的杂质,其中锻造铜合金的导电率超过40%IACS 。 通过进一步包含1%的银,可以获得屈服强度和导电性的组合以及增强的抗应力松弛性的组合的进一步增加。 制造本发明的合金以及其它铜 - 镍 - 硅合金的方法包括(a)的顺序步骤。 铸造铜合金; (b)。 热加工铸造铜基合金以实现横截面积的第一次减小; (C)。 在铸造铜基合金的温度和时间下有效地基本形成单相合金; (d)。 第一次老化退火合金的温度和时间有效地沉淀一定量的第二相有效形成具有硅化物的多相合金; (e)。 冷加工多相合金以实现横截面积的第二次减小; 和(f)。 第二次老化退火温度在第一退火温度低于第一退火温度的时间下,有效沉淀附加的硅化物,从而提高导电性。