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1. 发明申请

US20120119392A1 LEAD-FREE HIGH TEMPERATURE COMPOUND 审中-公开
标题翻译：无铅高温化合物
公开(公告)号：US20120119392A1
公开(公告)日：2012-05-17
申请号：US13384893
申请日：2010-07-21
申请人： Frank Breer , Wolfgang Schmitt , Jöerg Trodler , Karl-Heinz Schaller
发明人： Frank Breer , Wolfgang Schmitt , Jöerg Trodler , Karl-Heinz Schaller
IPC分类号： H01L23/48 , B23K35/24 , B23K31/02
CPC分类号： B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/302 , B23K35/362 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29111 , H01L2224/29294 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/8381 , H01L2224/83815 , H01L2224/83948 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/00014 , H01L2924/0105 , H01L2924/01026 , H01L2924/01028 , H01L2924/00
摘要： A simple method is provided for firmly-bonded connection of an electronic component to a substrate, which dispenses with the use of lead-containing paste solders and leads to a contact layer featuring sufficiently high resistance to heat fatigue in an environment characterized by incessant periodical temperature variations, and featuring high thermal and electrical conductivity. The method for firmly-bonded connection of an electronic component to a substrate includes the steps of: (a) providing an electronic component having a first surface to be connected and a substrate having a second surface to be connected; (b) applying a paste solder to at least one of the surfaces to be connected; (c) arranging the electronic component and the substrate such that the first electronic component surface to be connected and the second substrate surface to be connected contact each other through the paste solder; and (d) soldering the arrangement from (c) in order to generate a firmly-bonded connection between the electronic component and the substrate, wherein the paste solder contains (i) 10-30% by weight copper particles, (ii) 60-80% by weight particles of at least one substance selected from the group consisting of tin and tin-copper alloys, and (iii) 3-30% by weight solder flux, wherein the mean particle diameter of the particles (i) and of the particles (ii) is no more than 15 μm, and wherein the thickness of the applied layer of paste solder is at least 20 μm.
摘要翻译：提供了一种简单的方法，用于将电子部件牢固地连接到基底上，这样就省去了含铅膏焊料的使用，并且导致在不断周期性温度特征的环境中具有足够高的耐热疲劳性的接触层变化，并具有高导热和导热性。电子部件与基板的牢固结合连接的方法包括以下步骤：（a）提供具有要连接的第一表面的电子部件和具有要连接的第二表面的基板; （b）将糊状焊料施加到要连接的至少一个表面上; （c）布置所述电子部件和所述基板，使得要连接的所述第一电子部件表面和要连接的所述第二基板表面通过所述焊膏接触; 以及（d）从（c）焊接所述装置，以便在所述电子部件和所述基板之间产生牢固粘合的连接，其中所述焊料包含（i）10-30重量％的铜颗粒，（ii） 80重量％的选自锡和锡 - 铜合金的至少一种物质的颗粒，和（iii）3-30重量％的焊剂，其中颗粒（i）的平均粒径和颗粒（ii）的厚度不超过15μm，其中糊料焊料涂敷层的厚度至少为20μm。

2. 发明授权

US07926700B2 Solder pastes comprising nonresinous fluxes 有权
标题翻译：包含非粘性助焊剂的焊膏
公开(公告)号：US07926700B2
公开(公告)日：2011-04-19
申请号：US12093033
申请日：2006-10-20
申请人： Wolfgang Schmitt , Christian Loosz , Frank Breer , Jurgen Hornung , Thomas Krebs , Joerg Trodler
发明人： Wolfgang Schmitt , Christian Loosz , Frank Breer , Jurgen Hornung , Thomas Krebs , Joerg Trodler
IPC分类号： B23K31/02 , B23K35/00 , H01L21/44
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/362 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.
摘要翻译：根据本发明，制备由金属粉末，特别是软焊剂和凝胶制成的无树脂的焊膏，其中根据本发明的凝胶在金属粉末的再熔化期间在金属表面上不留下残余物。根据本发明的凝胶是基于在储存期间是稳定的并且包含羧酸，一种和多种溶剂的混合物。重要的用途是将软焊膏应用于电源模块，芯片连接，芯片上芯片，SiP（系统级封装），用于晶圆凸块，特别是在UBM（欠冲击金属化）上）以及 SMT（表面贴装技术），特别是涂层电路。通过使用根据本发明的无树脂的软焊膏，在电连接焊接之前的保护涂覆工艺之前，消除了清洗，并且在UBM上沉积的焊料凸块中的孔的形成被减小到小于20体积％。％。

3. 发明申请

US20090152331A1 SOLDER PASTES COMPRISING NONRESINOUS FLUXES 有权
标题翻译：包括非金属矿石的焊膏
公开(公告)号：US20090152331A1
公开(公告)日：2009-06-18
申请号：US12093033
申请日：2006-10-20
申请人： Wolfgang Schmitt , Christian Loosz , Frank Breer , Jürgen Hornung , Thomas Krebs , Joerg Trodler
发明人： Wolfgang Schmitt , Christian Loosz , Frank Breer , Jürgen Hornung , Thomas Krebs , Joerg Trodler
IPC分类号： B23K31/02 , B23K35/22 , B01J13/00
CPC分类号： B23K35/3618 , B23K35/3612 , B23K35/362 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.
摘要翻译：根据本发明，制备由金属粉末，特别是软焊剂和凝胶制成的无树脂的焊膏，其中根据本发明的凝胶在金属粉末的再熔化期间在金属表面上不留下残余物。根据本发明的凝胶是基于在储存期间是稳定的并且包含羧酸，一种和多种溶剂的混合物。重要的用途是将软焊膏应用于电源模块，芯片连接，芯片上芯片，SiP（系统级封装），用于晶圆凸块，特别是在UBM（欠冲击金属化）上）以及 SMT（表面贴装技术），特别是涂层电路。通过使用根据本发明的无树脂的软焊膏，在电连接焊接之前的保护涂覆工艺之前，消除了清洗，并且在UBM上沉积的焊料凸块中的孔的形成被减小到小于20体积％。％。

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